JP6234736B2 - スピン処理装置 - Google Patents

スピン処理装置 Download PDF

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Publication number
JP6234736B2
JP6234736B2 JP2013179910A JP2013179910A JP6234736B2 JP 6234736 B2 JP6234736 B2 JP 6234736B2 JP 2013179910 A JP2013179910 A JP 2013179910A JP 2013179910 A JP2013179910 A JP 2013179910A JP 6234736 B2 JP6234736 B2 JP 6234736B2
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JP
Japan
Prior art keywords
liquid receiving
liquid
substrate
receiving portion
peripheral surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013179910A
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English (en)
Japanese (ja)
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JP2015050263A5 (enExample
JP2015050263A (ja
Inventor
古矢　正明
正明 古矢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2013179910A priority Critical patent/JP6234736B2/ja
Priority to TW103127252A priority patent/TWI620989B/zh
Priority to CN201410431485.XA priority patent/CN104425235B/zh
Priority to KR1020140113000A priority patent/KR101634441B1/ko
Priority to US14/472,923 priority patent/US9679787B2/en
Publication of JP2015050263A publication Critical patent/JP2015050263A/ja
Publication of JP2015050263A5 publication Critical patent/JP2015050263A5/ja
Application granted granted Critical
Publication of JP6234736B2 publication Critical patent/JP6234736B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2013179910A 2013-08-30 2013-08-30 スピン処理装置 Active JP6234736B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013179910A JP6234736B2 (ja) 2013-08-30 2013-08-30 スピン処理装置
TW103127252A TWI620989B (zh) 2013-08-30 2014-08-08 旋轉處理裝置
CN201410431485.XA CN104425235B (zh) 2013-08-30 2014-08-28 自旋处理装置
KR1020140113000A KR101634441B1 (ko) 2013-08-30 2014-08-28 스핀 처리 장치
US14/472,923 US9679787B2 (en) 2013-08-30 2014-08-29 Spin treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013179910A JP6234736B2 (ja) 2013-08-30 2013-08-30 スピン処理装置

Publications (3)

Publication Number Publication Date
JP2015050263A JP2015050263A (ja) 2015-03-16
JP2015050263A5 JP2015050263A5 (enExample) 2017-05-18
JP6234736B2 true JP6234736B2 (ja) 2017-11-22

Family

ID=52581363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013179910A Active JP6234736B2 (ja) 2013-08-30 2013-08-30 スピン処理装置

Country Status (5)

Country Link
US (1) US9679787B2 (enExample)
JP (1) JP6234736B2 (enExample)
KR (1) KR101634441B1 (enExample)
CN (1) CN104425235B (enExample)
TW (1) TWI620989B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6461617B2 (ja) * 2015-01-20 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101841342B1 (ko) * 2015-03-30 2018-03-22 시바우라 메카트로닉스 가부시끼가이샤 스핀 처리 장치
JP6699335B2 (ja) * 2016-05-10 2020-05-27 トヨタ自動車株式会社 基板洗浄装置
TWI638394B (zh) * 2016-07-25 2018-10-11 斯庫林集團股份有限公司 基板處理裝置
JP6713893B2 (ja) * 2016-09-26 2020-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI770115B (zh) * 2017-02-06 2022-07-11 新加坡商平面半導體公司 加工汙水之去除
SG11201906905XA (en) 2017-02-06 2019-08-27 Planar Semiconductor Inc Subnanometer-level light-based substrate cleaning mechanism
KR102126645B1 (ko) 2017-02-06 2020-06-24 플레이너 세미컨덕터, 인크. 나노미터 미만 수준 기판 세정 메커니즘
JP6841188B2 (ja) * 2017-08-29 2021-03-10 東京エレクトロン株式会社 塗布処理装置及び塗布液捕集部材
JP7007141B2 (ja) * 2017-09-26 2022-01-24 芝浦メカトロニクス株式会社 基板処理装置
JP7242341B2 (ja) * 2018-03-30 2023-03-20 芝浦メカトロニクス株式会社 基板処理装置
KR102099105B1 (ko) 2018-07-18 2020-05-15 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
KR102081706B1 (ko) 2018-07-18 2020-02-27 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
JP7399452B2 (ja) * 2019-10-04 2023-12-18 中興化成工業株式会社 洗浄装置
CN113617599B (zh) * 2020-05-09 2025-05-16 浙江一达研磨有限公司 自动涂胶机
KR102635385B1 (ko) * 2020-11-23 2024-02-14 세메스 주식회사 기판 처리 장치
KR102853348B1 (ko) * 2021-01-27 2025-08-29 삼성전자주식회사 기판 처리 장치
JP7628434B2 (ja) * 2021-02-15 2025-02-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、筒状ガードの加工方法
US20230286713A1 (en) * 2022-03-14 2023-09-14 Semes Co., Ltd. Bowl, mehtod of manufacturing bowl, and apparatus for treating substrate
JP7609818B2 (ja) * 2022-03-24 2025-01-07 芝浦メカトロニクス株式会社 基板処理装置、基板処理方法

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JPS5927229B2 (ja) * 1979-09-19 1984-07-04 富士通株式会社 スピンナ−
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Also Published As

Publication number Publication date
KR20150026940A (ko) 2015-03-11
TW201523160A (zh) 2015-06-16
KR101634441B1 (ko) 2016-06-28
TWI620989B (zh) 2018-04-11
US20150059642A1 (en) 2015-03-05
JP2015050263A (ja) 2015-03-16
CN104425235B (zh) 2018-09-11
CN104425235A (zh) 2015-03-18
US9679787B2 (en) 2017-06-13

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