TWI620989B - 旋轉處理裝置 - Google Patents

旋轉處理裝置 Download PDF

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Publication number
TWI620989B
TWI620989B TW103127252A TW103127252A TWI620989B TW I620989 B TWI620989 B TW I620989B TW 103127252 A TW103127252 A TW 103127252A TW 103127252 A TW103127252 A TW 103127252A TW I620989 B TWI620989 B TW I620989B
Authority
TW
Taiwan
Prior art keywords
receiving portion
liquid receiving
liquid
substrate
annular
Prior art date
Application number
TW103127252A
Other languages
English (en)
Chinese (zh)
Other versions
TW201523160A (zh
Inventor
古矢正明
Original Assignee
芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦機械電子裝置股份有限公司 filed Critical 芝浦機械電子裝置股份有限公司
Publication of TW201523160A publication Critical patent/TW201523160A/zh
Application granted granted Critical
Publication of TWI620989B publication Critical patent/TWI620989B/zh

Links

Classifications

    • H10P95/00—
    • H10P72/0406—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H10P72/0414—
    • H10P72/0448—
    • H10P72/70—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H10P72/7624—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
TW103127252A 2013-08-30 2014-08-08 旋轉處理裝置 TWI620989B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-179910 2013-08-30
JP2013179910A JP6234736B2 (ja) 2013-08-30 2013-08-30 スピン処理装置

Publications (2)

Publication Number Publication Date
TW201523160A TW201523160A (zh) 2015-06-16
TWI620989B true TWI620989B (zh) 2018-04-11

Family

ID=52581363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103127252A TWI620989B (zh) 2013-08-30 2014-08-08 旋轉處理裝置

Country Status (5)

Country Link
US (1) US9679787B2 (enExample)
JP (1) JP6234736B2 (enExample)
KR (1) KR101634441B1 (enExample)
CN (1) CN104425235B (enExample)
TW (1) TWI620989B (enExample)

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JP6461617B2 (ja) * 2015-01-20 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101841342B1 (ko) * 2015-03-30 2018-03-22 시바우라 메카트로닉스 가부시끼가이샤 스핀 처리 장치
JP6699335B2 (ja) * 2016-05-10 2020-05-27 トヨタ自動車株式会社 基板洗浄装置
TWI638394B (zh) * 2016-07-25 2018-10-11 斯庫林集團股份有限公司 基板處理裝置
JP6713893B2 (ja) * 2016-09-26 2020-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
WO2018145001A1 (en) 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
JP6786732B2 (ja) 2017-02-06 2020-11-18 プレイナー・セミコンダクター・インコーポレイテッド サブナノメートルレベルの基板洗浄機構
TWI770115B (zh) 2017-02-06 2022-07-11 新加坡商平面半導體公司 加工汙水之去除
JP6841188B2 (ja) * 2017-08-29 2021-03-10 東京エレクトロン株式会社 塗布処理装置及び塗布液捕集部材
JP7007141B2 (ja) * 2017-09-26 2022-01-24 芝浦メカトロニクス株式会社 基板処理装置
JP7242341B2 (ja) * 2018-03-30 2023-03-20 芝浦メカトロニクス株式会社 基板処理装置
KR102081706B1 (ko) 2018-07-18 2020-02-27 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
KR102099105B1 (ko) 2018-07-18 2020-05-15 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
JP7399452B2 (ja) * 2019-10-04 2023-12-18 中興化成工業株式会社 洗浄装置
CN113617599B (zh) * 2020-05-09 2025-05-16 浙江一达研磨有限公司 自动涂胶机
KR102635385B1 (ko) * 2020-11-23 2024-02-14 세메스 주식회사 기판 처리 장치
KR102853348B1 (ko) * 2021-01-27 2025-08-29 삼성전자주식회사 기판 처리 장치
JP7628434B2 (ja) * 2021-02-15 2025-02-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、筒状ガードの加工方法
US20230286713A1 (en) * 2022-03-14 2023-09-14 Semes Co., Ltd. Bowl, mehtod of manufacturing bowl, and apparatus for treating substrate
JP7609818B2 (ja) * 2022-03-24 2025-01-07 芝浦メカトロニクス株式会社 基板処理装置、基板処理方法

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TW200807540A (en) * 2006-06-16 2008-02-01 Tokyo Electron Ltd Liquid processing apparatus and method
TW200921771A (en) * 2007-07-31 2009-05-16 Tokyo Electron Ltd Substrate processing apparatus
TW201026401A (en) * 2008-08-12 2010-07-16 Tokyo Electron Ltd Liquid treatment apparatus, liquid treatment method and storage medium

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US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
JPS5927229B2 (ja) * 1979-09-19 1984-07-04 富士通株式会社 スピンナ−
JP3116297B2 (ja) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
JPH10209102A (ja) * 1997-01-17 1998-08-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH10281643A (ja) * 1997-04-09 1998-10-23 Mitsubishi Electric Corp 基板処理装置
JP4593713B2 (ja) * 2000-02-04 2010-12-08 芝浦メカトロニクス株式会社 スピン処理装置
JP2001351857A (ja) * 2000-04-03 2001-12-21 Tokyo Electron Ltd 基板処理装置
JP3529724B2 (ja) * 2000-11-27 2004-05-24 住友精密工業株式会社 回転式基板処理装置
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JP4409910B2 (ja) * 2003-10-31 2010-02-03 日本ペイント株式会社 スプレー塗装装置および塗装方法
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US20060130767A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
JP4504859B2 (ja) * 2005-03-31 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
JP2007234882A (ja) * 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板取り扱い方法
JP2007324249A (ja) * 2006-05-31 2007-12-13 Hitachi High-Technologies Corp 基板処理装置、基板処理方法、及び基板の製造方法
US7891366B2 (en) * 2006-06-16 2011-02-22 Tokyo Electron Limited Liquid processing apparatus
JP2008153521A (ja) * 2006-12-19 2008-07-03 Dainippon Screen Mfg Co Ltd 回収カップ洗浄方法および基板処理装置
JP4969353B2 (ja) * 2007-07-25 2012-07-04 東京エレクトロン株式会社 基板処理装置
TWI367525B (en) * 2007-08-29 2012-07-01 Tokyo Electron Ltd Substrate treatment apparatus, substrate treatment method, and storage medium
JP5174103B2 (ja) * 2010-08-24 2013-04-03 東朋テクノロジー株式会社 フォトマスクの洗浄装置およびフォトマスクの洗浄システム
JP5667545B2 (ja) * 2011-10-24 2015-02-12 東京エレクトロン株式会社 液処理装置および液処理方法

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
TW200807540A (en) * 2006-06-16 2008-02-01 Tokyo Electron Ltd Liquid processing apparatus and method
TW200921771A (en) * 2007-07-31 2009-05-16 Tokyo Electron Ltd Substrate processing apparatus
TW201026401A (en) * 2008-08-12 2010-07-16 Tokyo Electron Ltd Liquid treatment apparatus, liquid treatment method and storage medium

Also Published As

Publication number Publication date
KR101634441B1 (ko) 2016-06-28
KR20150026940A (ko) 2015-03-11
CN104425235A (zh) 2015-03-18
US20150059642A1 (en) 2015-03-05
US9679787B2 (en) 2017-06-13
JP2015050263A (ja) 2015-03-16
JP6234736B2 (ja) 2017-11-22
CN104425235B (zh) 2018-09-11
TW201523160A (zh) 2015-06-16

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