KR101634441B1 - 스핀 처리 장치 - Google Patents

스핀 처리 장치 Download PDF

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Publication number
KR101634441B1
KR101634441B1 KR1020140113000A KR20140113000A KR101634441B1 KR 101634441 B1 KR101634441 B1 KR 101634441B1 KR 1020140113000 A KR1020140113000 A KR 1020140113000A KR 20140113000 A KR20140113000 A KR 20140113000A KR 101634441 B1 KR101634441 B1 KR 101634441B1
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South Korea
Prior art keywords
liquid
liquid containing
containing portion
substrate
annular
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Korean (ko)
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KR20150026940A (ko
Inventor
마사아키 후루야
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시바우라 메카트로닉스 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
KR1020140113000A 2013-08-30 2014-08-28 스핀 처리 장치 Active KR101634441B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013179910A JP6234736B2 (ja) 2013-08-30 2013-08-30 スピン処理装置
JPJP-P-2013-179910 2013-08-30

Publications (2)

Publication Number Publication Date
KR20150026940A KR20150026940A (ko) 2015-03-11
KR101634441B1 true KR101634441B1 (ko) 2016-06-28

Family

ID=52581363

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140113000A Active KR101634441B1 (ko) 2013-08-30 2014-08-28 스핀 처리 장치

Country Status (5)

Country Link
US (1) US9679787B2 (enExample)
JP (1) JP6234736B2 (enExample)
KR (1) KR101634441B1 (enExample)
CN (1) CN104425235B (enExample)
TW (1) TWI620989B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10969700B2 (en) 2018-07-18 2021-04-06 Semes Co., Ltd. Apparatus and method for treating substrate
US10991601B2 (en) 2018-07-18 2021-04-27 Semes Co., Ltd. Apparatus and method for treating substrate

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6461617B2 (ja) * 2015-01-20 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101841342B1 (ko) * 2015-03-30 2018-03-22 시바우라 메카트로닉스 가부시끼가이샤 스핀 처리 장치
JP6699335B2 (ja) * 2016-05-10 2020-05-27 トヨタ自動車株式会社 基板洗浄装置
TWI638394B (zh) * 2016-07-25 2018-10-11 斯庫林集團股份有限公司 基板處理裝置
JP6713893B2 (ja) * 2016-09-26 2020-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI770115B (zh) * 2017-02-06 2022-07-11 新加坡商平面半導體公司 加工汙水之去除
EP3577680A4 (en) 2017-02-06 2020-11-25 Planar Semiconductor, Inc. SUB-NANOMETRIC LEVEL SUBSTRATE CLEANING MECHANISM
US11069521B2 (en) 2017-02-06 2021-07-20 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
JP6841188B2 (ja) * 2017-08-29 2021-03-10 東京エレクトロン株式会社 塗布処理装置及び塗布液捕集部材
JP7007141B2 (ja) * 2017-09-26 2022-01-24 芝浦メカトロニクス株式会社 基板処理装置
JP7242341B2 (ja) * 2018-03-30 2023-03-20 芝浦メカトロニクス株式会社 基板処理装置
JP7399452B2 (ja) * 2019-10-04 2023-12-18 中興化成工業株式会社 洗浄装置
CN113617599B (zh) * 2020-05-09 2025-05-16 浙江一达研磨有限公司 自动涂胶机
KR102635385B1 (ko) * 2020-11-23 2024-02-14 세메스 주식회사 기판 처리 장치
KR102853348B1 (ko) * 2021-01-27 2025-08-29 삼성전자주식회사 기판 처리 장치
JP7628434B2 (ja) 2021-02-15 2025-02-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、筒状ガードの加工方法
US20230286713A1 (en) * 2022-03-14 2023-09-14 Semes Co., Ltd. Bowl, mehtod of manufacturing bowl, and apparatus for treating substrate
JP7609818B2 (ja) * 2022-03-24 2025-01-07 芝浦メカトロニクス株式会社 基板処理装置、基板処理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001212493A (ja) * 2000-02-04 2001-08-07 Shibaura Mechatronics Corp スピン処理装置
JP2005340556A (ja) * 2004-05-28 2005-12-08 Nec Electronics Corp 基板処理装置
KR20090012037A (ko) * 2007-07-25 2009-02-02 도쿄엘렉트론가부시키가이샤 기판 처리 장치
JP2009076878A (ja) * 2007-08-29 2009-04-09 Tokyo Electron Ltd 基板処理装置、基板処理方法、および記憶媒体
KR101062253B1 (ko) * 2006-06-16 2011-09-06 도쿄엘렉트론가부시키가이샤 액 처리 장치

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
JPS5927229B2 (ja) * 1979-09-19 1984-07-04 富士通株式会社 スピンナ−
JP3116297B2 (ja) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
JPH10209102A (ja) * 1997-01-17 1998-08-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH10281643A (ja) * 1997-04-09 1998-10-23 Mitsubishi Electric Corp 基板処理装置
JP2001351857A (ja) * 2000-04-03 2001-12-21 Tokyo Electron Ltd 基板処理装置
JP3529724B2 (ja) * 2000-11-27 2004-05-24 住友精密工業株式会社 回転式基板処理装置
US7171973B2 (en) * 2001-07-16 2007-02-06 Tokyo Electron Limited Substrate processing apparatus
JP4339026B2 (ja) * 2003-06-13 2009-10-07 東京エレクトロン株式会社 基板処理装置
JP4409910B2 (ja) * 2003-10-31 2010-02-03 日本ペイント株式会社 スプレー塗装装置および塗装方法
US7371022B2 (en) * 2004-12-22 2008-05-13 Sokudo Co., Ltd. Developer endpoint detection in a track lithography system
JP4504859B2 (ja) * 2005-03-31 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
JP2007234882A (ja) * 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板取り扱い方法
JP2007324249A (ja) * 2006-05-31 2007-12-13 Hitachi High-Technologies Corp 基板処理装置、基板処理方法、及び基板の製造方法
CN100550291C (zh) * 2006-06-16 2009-10-14 东京毅力科创株式会社 液体处理装置及液体处理方法
JP2008153521A (ja) * 2006-12-19 2008-07-03 Dainippon Screen Mfg Co Ltd 回収カップ洗浄方法および基板処理装置
JP4825178B2 (ja) * 2007-07-31 2011-11-30 東京エレクトロン株式会社 基板処理装置
JP5369538B2 (ja) * 2008-08-12 2013-12-18 東京エレクトロン株式会社 液処理装置及び液処理方法並びに記憶媒体
JP5174103B2 (ja) * 2010-08-24 2013-04-03 東朋テクノロジー株式会社 フォトマスクの洗浄装置およびフォトマスクの洗浄システム
JP5667545B2 (ja) * 2011-10-24 2015-02-12 東京エレクトロン株式会社 液処理装置および液処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001212493A (ja) * 2000-02-04 2001-08-07 Shibaura Mechatronics Corp スピン処理装置
JP2005340556A (ja) * 2004-05-28 2005-12-08 Nec Electronics Corp 基板処理装置
KR101062253B1 (ko) * 2006-06-16 2011-09-06 도쿄엘렉트론가부시키가이샤 액 처리 장치
KR20090012037A (ko) * 2007-07-25 2009-02-02 도쿄엘렉트론가부시키가이샤 기판 처리 장치
JP2009076878A (ja) * 2007-08-29 2009-04-09 Tokyo Electron Ltd 基板処理装置、基板処理方法、および記憶媒体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10969700B2 (en) 2018-07-18 2021-04-06 Semes Co., Ltd. Apparatus and method for treating substrate
US10991601B2 (en) 2018-07-18 2021-04-27 Semes Co., Ltd. Apparatus and method for treating substrate

Also Published As

Publication number Publication date
JP2015050263A (ja) 2015-03-16
TW201523160A (zh) 2015-06-16
JP6234736B2 (ja) 2017-11-22
TWI620989B (zh) 2018-04-11
US20150059642A1 (en) 2015-03-05
CN104425235B (zh) 2018-09-11
US9679787B2 (en) 2017-06-13
KR20150026940A (ko) 2015-03-11
CN104425235A (zh) 2015-03-18

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