CN104425235B - 自旋处理装置 - Google Patents

自旋处理装置 Download PDF

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Publication number
CN104425235B
CN104425235B CN201410431485.XA CN201410431485A CN104425235B CN 104425235 B CN104425235 B CN 104425235B CN 201410431485 A CN201410431485 A CN 201410431485A CN 104425235 B CN104425235 B CN 104425235B
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CN
China
Prior art keywords
substrate
liquid
liquid carrier
peripheral surface
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410431485.XA
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English (en)
Chinese (zh)
Other versions
CN104425235A (zh
Inventor
古矢正明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN104425235A publication Critical patent/CN104425235A/zh
Application granted granted Critical
Publication of CN104425235B publication Critical patent/CN104425235B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
  • Coating Apparatus (AREA)
CN201410431485.XA 2013-08-30 2014-08-28 自旋处理装置 Active CN104425235B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013179910A JP6234736B2 (ja) 2013-08-30 2013-08-30 スピン処理装置
JP2013-179910 2013-08-30

Publications (2)

Publication Number Publication Date
CN104425235A CN104425235A (zh) 2015-03-18
CN104425235B true CN104425235B (zh) 2018-09-11

Family

ID=52581363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410431485.XA Active CN104425235B (zh) 2013-08-30 2014-08-28 自旋处理装置

Country Status (5)

Country Link
US (1) US9679787B2 (enExample)
JP (1) JP6234736B2 (enExample)
KR (1) KR101634441B1 (enExample)
CN (1) CN104425235B (enExample)
TW (1) TWI620989B (enExample)

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* Cited by examiner, † Cited by third party
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JP6461617B2 (ja) * 2015-01-20 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101841342B1 (ko) * 2015-03-30 2018-03-22 시바우라 메카트로닉스 가부시끼가이샤 스핀 처리 장치
JP6699335B2 (ja) * 2016-05-10 2020-05-27 トヨタ自動車株式会社 基板洗浄装置
TWI638394B (zh) * 2016-07-25 2018-10-11 斯庫林集團股份有限公司 基板處理裝置
JP6713893B2 (ja) * 2016-09-26 2020-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI770115B (zh) 2017-02-06 2022-07-11 新加坡商平面半導體公司 加工汙水之去除
WO2018145001A1 (en) 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
WO2018144446A1 (en) 2017-02-06 2018-08-09 Planar Semiconductor, Inc. Sub-nanometer-level substrate cleaning mechanism
JP6841188B2 (ja) * 2017-08-29 2021-03-10 東京エレクトロン株式会社 塗布処理装置及び塗布液捕集部材
JP7007141B2 (ja) * 2017-09-26 2022-01-24 芝浦メカトロニクス株式会社 基板処理装置
JP7242341B2 (ja) * 2018-03-30 2023-03-20 芝浦メカトロニクス株式会社 基板処理装置
KR102081706B1 (ko) 2018-07-18 2020-02-27 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
KR102099105B1 (ko) 2018-07-18 2020-05-15 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
JP7399452B2 (ja) * 2019-10-04 2023-12-18 中興化成工業株式会社 洗浄装置
CN113617599B (zh) * 2020-05-09 2025-05-16 浙江一达研磨有限公司 自动涂胶机
KR102635385B1 (ko) * 2020-11-23 2024-02-14 세메스 주식회사 기판 처리 장치
KR102853348B1 (ko) * 2021-01-27 2025-08-29 삼성전자주식회사 기판 처리 장치
JP7628434B2 (ja) * 2021-02-15 2025-02-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、筒状ガードの加工方法
US20230286713A1 (en) * 2022-03-14 2023-09-14 Semes Co., Ltd. Bowl, mehtod of manufacturing bowl, and apparatus for treating substrate
JP7609818B2 (ja) * 2022-03-24 2025-01-07 芝浦メカトロニクス株式会社 基板処理装置、基板処理方法

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US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US7171973B2 (en) * 2001-07-16 2007-02-06 Tokyo Electron Limited Substrate processing apparatus
CN101204708A (zh) * 2006-12-19 2008-06-25 大日本网目版制造株式会社 回收杯清洗方法以及基板处理装置

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JPS5927229B2 (ja) * 1979-09-19 1984-07-04 富士通株式会社 スピンナ−
JP3116297B2 (ja) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
JPH10209102A (ja) * 1997-01-17 1998-08-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH10281643A (ja) * 1997-04-09 1998-10-23 Mitsubishi Electric Corp 基板処理装置
JP4593713B2 (ja) * 2000-02-04 2010-12-08 芝浦メカトロニクス株式会社 スピン処理装置
JP2001351857A (ja) * 2000-04-03 2001-12-21 Tokyo Electron Ltd 基板処理装置
JP3529724B2 (ja) * 2000-11-27 2004-05-24 住友精密工業株式会社 回転式基板処理装置
JP4339026B2 (ja) * 2003-06-13 2009-10-07 東京エレクトロン株式会社 基板処理装置
JP4409910B2 (ja) * 2003-10-31 2010-02-03 日本ペイント株式会社 スプレー塗装装置および塗装方法
JP4492939B2 (ja) * 2004-05-28 2010-06-30 ルネサスエレクトロニクス株式会社 基板処理装置
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
JP4504859B2 (ja) * 2005-03-31 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
JP2007234882A (ja) * 2006-03-01 2007-09-13 Dainippon Screen Mfg Co Ltd 基板処理装置および基板取り扱い方法
JP2007324249A (ja) * 2006-05-31 2007-12-13 Hitachi High-Technologies Corp 基板処理装置、基板処理方法、及び基板の製造方法
KR101042666B1 (ko) * 2006-06-16 2011-06-20 도쿄엘렉트론가부시키가이샤 액 처리 장치 및 액 처리 방법
KR101062253B1 (ko) * 2006-06-16 2011-09-06 도쿄엘렉트론가부시키가이샤 액 처리 장치
JP4969353B2 (ja) * 2007-07-25 2012-07-04 東京エレクトロン株式会社 基板処理装置
JP4825178B2 (ja) * 2007-07-31 2011-11-30 東京エレクトロン株式会社 基板処理装置
TWI367525B (en) * 2007-08-29 2012-07-01 Tokyo Electron Ltd Substrate treatment apparatus, substrate treatment method, and storage medium
JP5369538B2 (ja) * 2008-08-12 2013-12-18 東京エレクトロン株式会社 液処理装置及び液処理方法並びに記憶媒体
JP5174103B2 (ja) * 2010-08-24 2013-04-03 東朋テクノロジー株式会社 フォトマスクの洗浄装置およびフォトマスクの洗浄システム
JP5667545B2 (ja) * 2011-10-24 2015-02-12 東京エレクトロン株式会社 液処理装置および液処理方法

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US7171973B2 (en) * 2001-07-16 2007-02-06 Tokyo Electron Limited Substrate processing apparatus
CN101204708A (zh) * 2006-12-19 2008-06-25 大日本网目版制造株式会社 回收杯清洗方法以及基板处理装置

Also Published As

Publication number Publication date
JP6234736B2 (ja) 2017-11-22
KR101634441B1 (ko) 2016-06-28
TWI620989B (zh) 2018-04-11
CN104425235A (zh) 2015-03-18
US20150059642A1 (en) 2015-03-05
TW201523160A (zh) 2015-06-16
KR20150026940A (ko) 2015-03-11
JP2015050263A (ja) 2015-03-16
US9679787B2 (en) 2017-06-13

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