JP6212507B2 - 切断装置及び切断方法 - Google Patents

切断装置及び切断方法 Download PDF

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Publication number
JP6212507B2
JP6212507B2 JP2015021259A JP2015021259A JP6212507B2 JP 6212507 B2 JP6212507 B2 JP 6212507B2 JP 2015021259 A JP2015021259 A JP 2015021259A JP 2015021259 A JP2015021259 A JP 2015021259A JP 6212507 B2 JP6212507 B2 JP 6212507B2
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JP
Japan
Prior art keywords
cutting
cut
jig
sealed substrate
marks
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Active
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JP2015021259A
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English (en)
Japanese (ja)
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JP2016143861A5 (enExample
JP2016143861A (ja
Inventor
勝則 傳藤
勝則 傳藤
幹司 石橋
幹司 石橋
白井　克昌
克昌 白井
啓人 望月
啓人 望月
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Towa Corp
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Towa Corp
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Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2015021259A priority Critical patent/JP6212507B2/ja
Priority to PCT/JP2016/050202 priority patent/WO2016125518A1/ja
Priority to KR1020177024358A priority patent/KR102089098B1/ko
Priority to CN201680008290.1A priority patent/CN107210206B/zh
Priority to TW105101656A priority patent/TWI622090B/zh
Publication of JP2016143861A publication Critical patent/JP2016143861A/ja
Publication of JP2016143861A5 publication Critical patent/JP2016143861A5/ja
Application granted granted Critical
Publication of JP6212507B2 publication Critical patent/JP6212507B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
JP2015021259A 2015-02-05 2015-02-05 切断装置及び切断方法 Active JP6212507B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015021259A JP6212507B2 (ja) 2015-02-05 2015-02-05 切断装置及び切断方法
PCT/JP2016/050202 WO2016125518A1 (ja) 2015-02-05 2016-01-06 切断装置及び切断方法
KR1020177024358A KR102089098B1 (ko) 2015-02-05 2016-01-06 절단 장치 및 절단 방법
CN201680008290.1A CN107210206B (zh) 2015-02-05 2016-01-06 切断装置以及通过切断被切断物而制造多个产品的方法
TW105101656A TWI622090B (zh) 2015-02-05 2016-01-20 Cutting device and cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015021259A JP6212507B2 (ja) 2015-02-05 2015-02-05 切断装置及び切断方法

Publications (3)

Publication Number Publication Date
JP2016143861A JP2016143861A (ja) 2016-08-08
JP2016143861A5 JP2016143861A5 (enExample) 2016-10-13
JP6212507B2 true JP6212507B2 (ja) 2017-10-11

Family

ID=56563870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015021259A Active JP6212507B2 (ja) 2015-02-05 2015-02-05 切断装置及び切断方法

Country Status (5)

Country Link
JP (1) JP6212507B2 (enExample)
KR (1) KR102089098B1 (enExample)
CN (1) CN107210206B (enExample)
TW (1) TWI622090B (enExample)
WO (1) WO2016125518A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6483541B2 (ja) * 2015-06-16 2019-03-13 株式会社ディスコ パッケージ基板の加工方法
JP2018133432A (ja) * 2017-02-15 2018-08-23 株式会社ディスコ 切削装置
EP3795271B1 (en) * 2018-05-14 2023-05-24 FUJI Corporation Mounter provided with a lead wire cutting unit
EP3702831A1 (de) 2019-03-01 2020-09-02 Carl Zeiss Vision International GmbH Datensatz zur verwendung in einem verfahren zur herstellung eines brillenglases
JP6912745B1 (ja) * 2019-09-27 2021-08-04 株式会社東京精密 ダイシング装置及び方法
KR102411860B1 (ko) 2019-09-27 2022-06-23 가부시키가이샤 도교 세이미쓰 다이싱 장치 및 방법
JP7377092B2 (ja) * 2019-12-16 2023-11-09 Ｔｏｗａ株式会社 統計データ生成方法、切断装置及びシステム
JP7446169B2 (ja) * 2020-06-26 2024-03-08 キヤノントッキ株式会社 基板搬送装置、基板処理システム、基板搬送方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7440356B2 (ja) * 2020-06-26 2024-02-28 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7440355B2 (ja) * 2020-06-26 2024-02-28 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7438865B2 (ja) * 2020-06-26 2024-02-27 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7613849B2 (ja) * 2020-06-26 2025-01-15 キヤノントッキ株式会社 アライメント装置、成膜装置、アライメント方法、電子デバイスの製造方法、プログラム及び記憶媒体
JP7423161B2 (ja) * 2020-06-30 2024-01-29 株式会社ディスコ チャックテーブル
KR102799609B1 (ko) * 2021-03-16 2025-04-29 한미반도체 주식회사 반도체 자재 절단장치의 절단 셋팅방법
JP7564747B2 (ja) * 2021-03-29 2024-10-09 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
KR102633129B1 (ko) * 2021-09-29 2024-02-06 한국생산기술연구원 다이 웨이퍼 간 본딩 시 정렬방법
CN114609711B (zh) * 2022-03-09 2023-07-18 业成科技（成都）有限公司 光学元件的制造方法、夹持装置、显示模组及电子设备
JP2024024364A (ja) * 2022-08-09 2024-02-22 Ｔｏｗａ株式会社 切断装置、及び、切断品の製造方法
CN115815474B (zh) * 2022-12-01 2023-09-15 广东新亚光电缆股份有限公司 一种低压电线及其智能加工系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001156025A (ja) 1999-11-29 2001-06-08 Disco Abrasive Syst Ltd ペレットの分離方法
JP4733929B2 (ja) * 2004-04-20 2011-07-27 株式会社ディスコ 半導体ウエーハの切断方法
JP2005353723A (ja) 2004-06-09 2005-12-22 Apic Yamada Corp 切断装置、及び切断方法
JP2009170501A (ja) * 2008-01-11 2009-07-30 Disco Abrasive Syst Ltd 切削装置
JP5139852B2 (ja) 2008-03-17 2013-02-06 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
JP2012114126A (ja) * 2010-11-19 2012-06-14 Sharp Corp 基板分割装置および電子部品の製造方法
JP6232667B2 (ja) * 2013-06-25 2017-11-22 ボンドテック株式会社 基板接合方法
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6143668B2 (ja) * 2013-12-28 2017-06-07 Ｔｏｗａ株式会社 電子部品製造用の切断装置及び切断方法

Also Published As

Publication number Publication date
TWI622090B (zh) 2018-04-21
WO2016125518A1 (ja) 2016-08-11
KR20170110651A (ko) 2017-10-11
KR102089098B1 (ko) 2020-03-13
JP2016143861A (ja) 2016-08-08
TW201643951A (zh) 2016-12-16
CN107210206B (zh) 2020-09-22
CN107210206A (zh) 2017-09-26

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