JP6209572B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
JP6209572B2
JP6209572B2 JP2015184630A JP2015184630A JP6209572B2 JP 6209572 B2 JP6209572 B2 JP 6209572B2 JP 2015184630 A JP2015184630 A JP 2015184630A JP 2015184630 A JP2015184630 A JP 2015184630A JP 6209572 B2 JP6209572 B2 JP 6209572B2
Authority
JP
Japan
Prior art keywords
substrate
gas
supply unit
gas supply
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015184630A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016145702A (ja
Inventor
竜平 高原
竜平 高原
西部　幸伸
幸伸 西部
磯　明典
明典 磯
健司 坂下
健司 坂下
大輝 松田
大輝 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to TW104139421A priority Critical patent/TWI618905B/zh
Priority to CN201610046871.6A priority patent/CN105826168B/zh
Publication of JP2016145702A publication Critical patent/JP2016145702A/ja
Application granted granted Critical
Publication of JP6209572B2 publication Critical patent/JP6209572B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2015184630A 2015-01-28 2015-09-18 基板処理装置 Active JP6209572B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104139421A TWI618905B (zh) 2015-01-28 2015-11-26 Substrate processing device
CN201610046871.6A CN105826168B (zh) 2015-01-28 2016-01-25 基板处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015014155 2015-01-28
JP2015014155 2015-01-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017173697A Division JP6495986B2 (ja) 2015-01-28 2017-09-11 基板処理装置

Publications (2)

Publication Number Publication Date
JP2016145702A JP2016145702A (ja) 2016-08-12
JP6209572B2 true JP6209572B2 (ja) 2017-10-04

Family

ID=56686152

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015184630A Active JP6209572B2 (ja) 2015-01-28 2015-09-18 基板処理装置
JP2017173697A Active JP6495986B2 (ja) 2015-01-28 2017-09-11 基板処理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017173697A Active JP6495986B2 (ja) 2015-01-28 2017-09-11 基板処理装置

Country Status (3)

Country Link
JP (2) JP6209572B2 (enrdf_load_stackoverflow)
CN (1) CN105826168B (enrdf_load_stackoverflow)
TW (1) TWI618905B (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108807215B (zh) * 2017-04-28 2021-01-29 苏州均晟豪智能科技有限公司 处理装置
CN107065433B (zh) * 2017-05-08 2021-01-26 京东方科技集团股份有限公司 干燥装置
JP7031831B1 (ja) 2021-03-16 2022-03-08 株式会社アルフテクノ 乾燥装置
CN115513095B (zh) * 2022-09-19 2025-04-04 京东方科技集团股份有限公司 一种高密度清洗设备
CN118482549B (zh) * 2024-07-15 2024-09-20 江苏徕阳氢能源科技有限公司 一种电解水制氢用电极板干燥运输一体化装置
CN118856845B (zh) * 2024-09-19 2024-11-29 黄骅聚金五金制品有限公司 一种球化线烘干装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919273Y2 (ja) * 1979-10-03 1984-06-04 株式会社阪田商会 乾燥装置
JP3070511B2 (ja) * 1997-03-31 2000-07-31 日本電気株式会社 基板乾燥装置
JP2002022359A (ja) * 2000-07-07 2002-01-23 Matsushita Electric Ind Co Ltd 基板の乾燥装置
JP4382306B2 (ja) * 2001-07-05 2009-12-09 Ｎｅｃ液晶テクノロジー株式会社 薬液塗布方法及びその塗布装置
JP3754905B2 (ja) * 2001-09-10 2006-03-15 東京エレクトロン株式会社 基板乾燥装置
JP4229670B2 (ja) * 2002-09-30 2009-02-25 株式会社日本設計工業 薄板状材の搬送方法及び装置
JP3865717B2 (ja) * 2003-06-27 2007-01-10 東京応化工業株式会社 基板乾燥装置および基板乾燥方法
JP4494269B2 (ja) * 2005-03-30 2010-06-30 大日本スクリーン製造株式会社 基板処理装置
JP4829710B2 (ja) * 2006-07-26 2011-12-07 芝浦メカトロニクス株式会社 基板の処理装置
JP4272230B2 (ja) * 2006-12-22 2009-06-03 東京エレクトロン株式会社 減圧乾燥装置
CN201561627U (zh) * 2009-12-17 2010-08-25 无锡尚德太阳能电力有限公司 硅片吹干系统
JP2013045877A (ja) * 2011-08-24 2013-03-04 Tokyo Electron Ltd 基板処理装置
CN203672080U (zh) * 2014-01-06 2014-06-25 宇宙电路板设备(深圳)有限公司 触控面板用烘干装置

Also Published As

Publication number Publication date
CN105826168B (zh) 2018-10-26
JP6495986B2 (ja) 2019-04-03
CN105826168A (zh) 2016-08-03
TW201706548A (zh) 2017-02-16
TWI618905B (zh) 2018-03-21
JP2016145702A (ja) 2016-08-12
JP2017211178A (ja) 2017-11-30

Similar Documents

Publication Publication Date Title
JP6495986B2 (ja) 基板処理装置
US7614722B2 (en) Inkjet recording apparatus
KR100770503B1 (ko) 기판 처리 장치
JP6420967B2 (ja) 異物除去装置
CN110892518B (zh) 干燥基片的干燥装置和方法
JPWO2006046317A1 (ja) 連続搬送式フリーザ
TWI446480B (zh) 基板冷卻裝置
WO2011099222A1 (ja) 基板処理装置
KR101074957B1 (ko) 기판 건조장치 및 기판 건조방법
JP3629411B2 (ja) エアーナイフ乾燥装置
JP7055839B2 (ja) 基板処理装置
JP4509613B2 (ja) 基板処理装置
JP6146664B2 (ja) 対向型エアブロー
JP5467905B2 (ja) フイルム搬送装置及び方法、フイルム製造装置及び方法
JP2007153542A (ja) 基板搬送装置及び基板乾燥装置
JP7429216B2 (ja) 基板処理装置
JP2019117022A (ja) 水切り装置、水切り方法およびウェブの製造方法
JP2010190568A (ja) 連続搬送式フリーザ
TWM632520U (zh) 處理裝置
CN106997860B (zh) 基板处理装置
KR20160144143A (ko) 기판 처리 장치
JP6731197B2 (ja) 基板処理装置
JP2020180714A (ja) 水滴除去装置および水滴除去方法
TW201825977A (zh) 玻璃基板之製造方法
KR20190019327A (ko) 스케일 배출장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160823

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170523

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170606

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170802

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170822

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170911

R150 Certificate of patent or registration of utility model

Ref document number: 6209572

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150