JP6136936B2 - 積層体の製造方法および製造装置 - Google Patents

積層体の製造方法および製造装置 Download PDF

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Publication number
JP6136936B2
JP6136936B2 JP2013556357A JP2013556357A JP6136936B2 JP 6136936 B2 JP6136936 B2 JP 6136936B2 JP 2013556357 A JP2013556357 A JP 2013556357A JP 2013556357 A JP2013556357 A JP 2013556357A JP 6136936 B2 JP6136936 B2 JP 6136936B2
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Japan
Prior art keywords
face material
bonding
resin layer
pressure
laminated body
Prior art date
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Expired - Fee Related
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JP2013556357A
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English (en)
Japanese (ja)
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JPWO2013115068A1 (ja
Inventor
泰則 伊藤
泰則 伊藤
裕 野尻
裕 野尻
和幸 浅野
和幸 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
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Asahi Glass Co Ltd
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Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP2013556357A priority Critical patent/JP6136936B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Electroluminescent Light Sources (AREA)
JP2013556357A 2012-02-01 2013-01-24 積層体の製造方法および製造装置 Expired - Fee Related JP6136936B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013556357A JP6136936B2 (ja) 2012-02-01 2013-01-24 積層体の製造方法および製造装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012020014 2012-02-01
JP2012020014 2012-02-01
PCT/JP2013/051496 WO2013115068A1 (ja) 2012-02-01 2013-01-24 積層体の製造方法および製造装置
JP2013556357A JP6136936B2 (ja) 2012-02-01 2013-01-24 積層体の製造方法および製造装置

Publications (2)

Publication Number Publication Date
JPWO2013115068A1 JPWO2013115068A1 (ja) 2015-05-11
JP6136936B2 true JP6136936B2 (ja) 2017-05-31

Family

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Family Applications (1)

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JP2013556357A Expired - Fee Related JP6136936B2 (ja) 2012-02-01 2013-01-24 積層体の製造方法および製造装置

Country Status (5)

Country Link
JP (1) JP6136936B2 (ko)
KR (1) KR102050770B1 (ko)
CN (1) CN104093569B (ko)
TW (1) TWI625240B (ko)
WO (1) WO2013115068A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102181329B1 (ko) * 2013-12-27 2020-11-20 엘지디스플레이 주식회사 라미네이션 장치
JP2015157451A (ja) * 2014-02-25 2015-09-03 旭硝子株式会社 積層体の製造方法、積層体、および粘着層付き透明面材
DE102015205041A1 (de) * 2015-03-19 2016-09-22 Via Optronics Gmbh Laminiervorrichtung
JP6720741B2 (ja) * 2015-08-07 2020-07-08 Ａｇｃ株式会社 積層板および中間膜
JP6834609B2 (ja) * 2017-03-07 2021-02-24 デクセリアルズ株式会社 画像表示装置の製造方法
KR102264217B1 (ko) 2018-05-24 2021-06-11 주식회사 엘지화학 기능성층이 구비된 곡면 박판 유리의 제조 방법 및 기능성층이 구비된 곡면 접합 유리의 제조 방법
CN110683230B (zh) * 2019-11-19 2021-06-22 盐城工业职业技术学院 一种用于海上运输的防霉变集装箱

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60137035A (ja) * 1983-12-26 1985-07-20 Toshiba Ceramics Co Ltd ウエ−ハ接着装置
JPS6181474A (ja) * 1984-09-28 1986-04-25 Toshiba Ceramics Co Ltd ウエ−ハ接着装置
JPS62134252A (ja) * 1985-12-06 1987-06-17 ラヴィ　アクチエンゲゼルシャフト 積層物形成方法及び装置
JPH0622200B2 (ja) * 1988-03-25 1994-03-23 ソマール株式会社 薄膜張付方法及びその実施装置
US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
JPH0582493A (ja) * 1991-03-11 1993-04-02 Hitachi Ltd ウエハ接着装置およびその装置を用いたウエハの接着方法
JPH07242350A (ja) * 1994-03-07 1995-09-19 Sakura Seiki Kk 薄板の剥離及び貼付け方法
JP3932660B2 (ja) 1998-03-30 2007-06-20 株式会社デンソー Ｅｌ表示装置の製造方法
JP2000191985A (ja) * 1998-12-25 2000-07-11 Seiko Epson Corp 部材の貼り合わせ方法、貼り合わせ体の製造方法及び貼り合わせ装置
JP2002260306A (ja) * 2001-03-02 2002-09-13 Sony Corp 光ディスクの製造方法および光ディスクの製造装置
JP2002313688A (ja) * 2001-04-16 2002-10-25 Toshiba Corp ウェーハ接着装置
JP2003005145A (ja) * 2001-06-25 2003-01-08 Sharp Corp 基板貼付装置および基板貼付方法
JP4218285B2 (ja) * 2002-08-26 2009-02-04 株式会社日立プラントテクノロジー 基板貼り合わせ方法及びその装置
JP2004153159A (ja) * 2002-10-31 2004-05-27 Enzan Seisakusho:Kk 半導体ウェハの保護部材貼着方法及びその装置
JP2004296139A (ja) * 2003-03-25 2004-10-21 Sony Corp 貼合装置および貼合方法、ならびに表示装置の製造方法
JP4666519B2 (ja) * 2006-09-08 2011-04-06 リンテック株式会社 シート貼付装置
JP4841412B2 (ja) * 2006-12-06 2011-12-21 日東電工株式会社 基板貼合せ装置
JP4980039B2 (ja) * 2006-12-19 2012-07-18 株式会社リコー ワークの貼り合わせ装置
JP2009180911A (ja) * 2008-01-30 2009-08-13 Toray Eng Co Ltd 基板貼合せ方法、基板貼合せ装置、及びこれらの方法または装置を用いて製作したディスプレイ装置
JP5062897B2 (ja) * 2008-06-06 2012-10-31 クライムプロダクツ株式会社 ワーク貼合装置
JP2010018740A (ja) * 2008-07-11 2010-01-28 Fujitsu Ltd 貼り合わせ装置及び貼り合わせ方法

Also Published As

Publication number Publication date
KR102050770B1 (ko) 2019-12-02
WO2013115068A1 (ja) 2013-08-08
CN104093569A (zh) 2014-10-08
TWI625240B (zh) 2018-06-01
TW201338984A (zh) 2013-10-01
CN104093569B (zh) 2016-11-16
KR20140119088A (ko) 2014-10-08
JPWO2013115068A1 (ja) 2015-05-11

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