JP6118538B2 - ネガティブトーン現像によってフォトリソグラフィパターンを形成する方法 - Google Patents

ネガティブトーン現像によってフォトリソグラフィパターンを形成する方法 Download PDF

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JP6118538B2
JP6118538B2 JP2012243366A JP2012243366A JP6118538B2 JP 6118538 B2 JP6118538 B2 JP 6118538B2 JP 2012243366 A JP2012243366 A JP 2012243366A JP 2012243366 A JP2012243366 A JP 2012243366A JP 6118538 B2 JP6118538 B2 JP 6118538B2
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polymer
photoresist
photoresist composition
layer
exposure
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Japanese (ja)
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JP2013137513A5 (enExample
JP2013137513A (ja
Inventor
ヨン・チョル・ペ
ジビン・サン
スン−ヒョン・イ
ジョン・クン・パク
セシリー・アンデス
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DuPont Electronic Materials International LLC
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Rohm and Haas Electronic Materials LLC
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/325—Non-aqueous compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2012243366A 2011-11-03 2012-11-05 ネガティブトーン現像によってフォトリソグラフィパターンを形成する方法 Active JP6118538B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161555462P 2011-11-03 2011-11-03
US61/555,462 2011-11-03

Publications (3)

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JP2013137513A JP2013137513A (ja) 2013-07-11
JP2013137513A5 JP2013137513A5 (enExample) 2016-12-01
JP6118538B2 true JP6118538B2 (ja) 2017-04-19

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Country Link
US (1) US8790867B2 (enExample)
JP (1) JP6118538B2 (enExample)
KR (1) KR102065932B1 (enExample)
CN (1) CN103091978B (enExample)
TW (1) TWI477907B (enExample)

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US20130302735A1 (en) * 2011-11-03 2013-11-14 Rohm And Haas Electronic Materials Llc Monomers, polymers and photoresist compositions
KR102233875B1 (ko) * 2013-12-30 2021-03-30 롬엔드하스전자재료코리아유한회사 광산 발생제를 포함하는 반사방지 코팅 조성물을 이용한 패턴 형성 방법
JP6267533B2 (ja) 2014-02-14 2018-01-24 信越化学工業株式会社 パターン形成方法
JPWO2015122468A1 (ja) * 2014-02-14 2017-03-30 三菱瓦斯化学株式会社 （メタ）アクリル酸エステル化合物およびその製造方法
US9472448B2 (en) 2014-03-14 2016-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Contact plug without seam hole and methods of forming the same
KR102245135B1 (ko) 2014-05-20 2021-04-28 삼성전자 주식회사 패턴 형성 방법 및 이를 이용한 집적회로 소자의 제조 방법
CN106662816B (zh) * 2014-07-08 2020-10-23 东京毅力科创株式会社 负性显影剂相容性的光致抗蚀剂组合物及使用方法
US11092894B2 (en) 2014-12-31 2021-08-17 Rohm And Haas Electronic Materials Korea Ltd. Method for forming pattern using anti-reflective coating composition comprising photoacid generator
KR102374049B1 (ko) 2015-06-02 2022-03-14 삼성전자주식회사 포토레지스트를 이용한 패턴 형성 방법
US10061199B2 (en) * 2015-06-24 2018-08-28 Tokyo Electron Limited Methods of forming a mask for substrate patterning
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CN106784398B (zh) * 2016-12-15 2019-12-03 武汉华星光电技术有限公司 Oled封装方法与oled封装结构
US10727055B2 (en) * 2017-02-10 2020-07-28 International Business Machines Corporation Method to increase the lithographic process window of extreme ultra violet negative tone development resists
JP6937648B2 (ja) * 2017-09-28 2021-09-22 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
CN107799402A (zh) * 2017-10-24 2018-03-13 德淮半导体有限公司 二次图形的形成方法
CN109679020B (zh) * 2018-12-28 2020-12-29 厦门恒坤新材料科技股份有限公司 含立方烷的丙烯酸酯系成膜树脂和ArF光刻胶及其制备方法和光刻方法
WO2022005716A1 (en) * 2020-07-02 2022-01-06 Applied Materials, Inc. Selective deposition of carbon on photoresist layer for lithography applications
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US20130302735A1 (en) 2011-11-03 2013-11-14 Rohm And Haas Electronic Materials Llc Monomers, polymers and photoresist compositions

Also Published As

Publication number Publication date
CN103091978B (zh) 2015-01-28
KR102065932B1 (ko) 2020-01-14
US8790867B2 (en) 2014-07-29
JP2013137513A (ja) 2013-07-11
US20130115559A1 (en) 2013-05-09
TW201327046A (zh) 2013-07-01
CN103091978A (zh) 2013-05-08
KR20130049165A (ko) 2013-05-13
TWI477907B (zh) 2015-03-21

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