JP6029266B2 - 撮像装置、撮像システムおよび撮像装置の製造方法 - Google Patents
撮像装置、撮像システムおよび撮像装置の製造方法 Download PDFInfo
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- JP6029266B2 JP6029266B2 JP2011173963A JP2011173963A JP6029266B2 JP 6029266 B2 JP6029266 B2 JP 6029266B2 JP 2011173963 A JP2011173963 A JP 2011173963A JP 2011173963 A JP2011173963 A JP 2011173963A JP 6029266 B2 JP6029266 B2 JP 6029266B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011173963A JP6029266B2 (ja) | 2011-08-09 | 2011-08-09 | 撮像装置、撮像システムおよび撮像装置の製造方法 |
| US13/566,781 US8692345B2 (en) | 2011-08-09 | 2012-08-03 | Image sensing device, image sensing system, and method for manufacturing image sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011173963A JP6029266B2 (ja) | 2011-08-09 | 2011-08-09 | 撮像装置、撮像システムおよび撮像装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013038266A JP2013038266A (ja) | 2013-02-21 |
| JP2013038266A5 JP2013038266A5 (enExample) | 2014-09-25 |
| JP6029266B2 true JP6029266B2 (ja) | 2016-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011173963A Active JP6029266B2 (ja) | 2011-08-09 | 2011-08-09 | 撮像装置、撮像システムおよび撮像装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8692345B2 (enExample) |
| JP (1) | JP6029266B2 (enExample) |
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| KR101774491B1 (ko) | 2011-10-14 | 2017-09-13 | 삼성전자주식회사 | 유기 포토다이오드를 포함하는 유기 픽셀, 이의 제조 방법, 및 상기 유기 픽셀을 포함하는 장치들 |
| JP5907011B2 (ja) * | 2012-09-07 | 2016-04-20 | 株式会社デンソー | 光センサ |
| JP6055270B2 (ja) * | 2012-10-26 | 2016-12-27 | キヤノン株式会社 | 固体撮像装置、その製造方法、およびカメラ |
| US10203411B2 (en) * | 2012-11-02 | 2019-02-12 | Maxim Integrated Products, Inc. | System and method for reducing ambient light sensitivity of infrared (IR) detectors |
| JP6116878B2 (ja) * | 2012-12-03 | 2017-04-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP5987108B2 (ja) * | 2013-04-23 | 2016-09-07 | シャープ株式会社 | 回路内蔵光電変換装置およびその製造方法 |
| JP5956968B2 (ja) * | 2013-09-13 | 2016-07-27 | 株式会社東芝 | 受光素子および光結合型信号絶縁装置 |
| US9337225B2 (en) * | 2013-09-13 | 2016-05-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
| US10032817B2 (en) | 2013-10-03 | 2018-07-24 | Sharp Kabushiki Kaisha | Photoelectric conversion device |
| JP6195369B2 (ja) * | 2013-11-13 | 2017-09-13 | キヤノン株式会社 | 固体撮像装置、カメラ、および、固体撮像装置の製造方法 |
| KR20150089650A (ko) * | 2014-01-28 | 2015-08-05 | 에스케이하이닉스 주식회사 | 이미지 센서 및 그 제조 방법 |
| US9324755B2 (en) * | 2014-05-05 | 2016-04-26 | Semiconductor Components Industries, Llc | Image sensors with reduced stack height |
| JP6482790B2 (ja) * | 2014-08-21 | 2019-03-13 | ルネサスエレクトロニクス株式会社 | 光半導体装置 |
| WO2016103430A1 (ja) * | 2014-12-25 | 2016-06-30 | キヤノン株式会社 | ラインセンサ、画像読取装置、画像形成装置 |
| US9704901B2 (en) * | 2015-01-16 | 2017-07-11 | Visera Technologies Company Limited | Solid-state imaging devices |
| US10263025B2 (en) * | 2015-06-05 | 2019-04-16 | Sony Corporation | Solid-state imaging sensor |
| JP6556511B2 (ja) | 2015-06-17 | 2019-08-07 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US9589969B1 (en) * | 2016-01-15 | 2017-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method of the same |
| JP2017168531A (ja) * | 2016-03-14 | 2017-09-21 | 株式会社リコー | 固体撮像装置及び固体撮像装置の製造方法 |
| JP6744748B2 (ja) * | 2016-04-06 | 2020-08-19 | キヤノン株式会社 | 固体撮像装置及びその製造方法 |
| JP2018042141A (ja) * | 2016-09-08 | 2018-03-15 | 株式会社デンソー | 撮像装置 |
| KR102490821B1 (ko) * | 2018-01-23 | 2023-01-19 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
| KR102398784B1 (ko) * | 2017-08-14 | 2022-05-16 | 주식회사 디비하이텍 | 후면조사형 씨모스 이미지 센서 및 형성 방법 |
| JP2019075441A (ja) * | 2017-10-13 | 2019-05-16 | キヤノン株式会社 | 光電変換装置および機器 |
| KR102651181B1 (ko) * | 2017-12-26 | 2024-03-26 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 촬상 소자 및 촬상 장치 |
| KR102593949B1 (ko) * | 2018-07-25 | 2023-10-27 | 삼성전자주식회사 | 이미지 센서 |
| US11244978B2 (en) * | 2018-10-17 | 2022-02-08 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus and equipment including the same |
| KR102639539B1 (ko) * | 2018-11-05 | 2024-02-26 | 삼성전자주식회사 | 이미지 센서 및 이의 형성 방법 |
| KR102721025B1 (ko) * | 2019-01-03 | 2024-10-24 | 삼성전자주식회사 | 이미지 센서 및 이의 제조 방법 |
| US11398512B2 (en) * | 2019-12-19 | 2022-07-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photo-sensing device and manufacturing method thereof |
| JP7520558B2 (ja) * | 2020-04-07 | 2024-07-23 | キヤノン株式会社 | 光電変換装置および機器 |
| JP7328176B2 (ja) * | 2020-04-15 | 2023-08-16 | キヤノン株式会社 | 光電変換装置および機器 |
| JP7633006B2 (ja) * | 2020-07-27 | 2025-02-19 | 株式会社ジャパンディスプレイ | 検出装置 |
| CN115881738A (zh) * | 2021-09-26 | 2023-03-31 | 群创光电股份有限公司 | 光学感测装置 |
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| JPH1168074A (ja) * | 1997-08-13 | 1999-03-09 | Sony Corp | 固体撮像素子 |
| JP3702611B2 (ja) * | 1997-10-06 | 2005-10-05 | ソニー株式会社 | 固体撮像素子及びその製造方法 |
| JP3324581B2 (ja) * | 1999-09-21 | 2002-09-17 | 日本電気株式会社 | 固体撮像装置及びその製造方法 |
| JP3824469B2 (ja) | 2000-04-03 | 2006-09-20 | シャープ株式会社 | 固体撮像装置、及びその製造方法 |
| JP4686201B2 (ja) | 2005-01-27 | 2011-05-25 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
| JP2007184311A (ja) | 2005-12-29 | 2007-07-19 | Sony Corp | 固体撮像装置およびその製造方法 |
| JP2007311391A (ja) * | 2006-05-16 | 2007-11-29 | Matsushita Electric Ind Co Ltd | 固体撮像素子およびその製造方法 |
| JP2008066409A (ja) * | 2006-09-05 | 2008-03-21 | Sony Corp | 固体撮像装置及びその製造方法 |
| JP2008091660A (ja) * | 2006-10-03 | 2008-04-17 | Fujifilm Corp | 撮像装置 |
| US7544982B2 (en) | 2006-10-03 | 2009-06-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Image sensor device suitable for use with logic-embedded CIS chips and methods for making the same |
| JP5159120B2 (ja) | 2007-02-23 | 2013-03-06 | キヤノン株式会社 | 光電変換装置およびその製造方法 |
| JP2009146957A (ja) | 2007-12-12 | 2009-07-02 | Panasonic Corp | 固体撮像装置及び固体撮像装置の製造方法 |
| CN101494233A (zh) | 2008-01-24 | 2009-07-29 | 索尼株式会社 | 固态摄像装置及其制造方法 |
| JP4725614B2 (ja) | 2008-01-24 | 2011-07-13 | ソニー株式会社 | 固体撮像装置 |
| JP2009218374A (ja) | 2008-03-11 | 2009-09-24 | Panasonic Corp | 固体撮像装置 |
| JP2009224361A (ja) * | 2008-03-13 | 2009-10-01 | Panasonic Corp | 固体撮像装置及びその製造方法 |
| JP5357441B2 (ja) * | 2008-04-04 | 2013-12-04 | キヤノン株式会社 | 固体撮像装置の製造方法 |
| JP2009283482A (ja) | 2008-05-19 | 2009-12-03 | Sony Corp | 固体撮像装置 |
| JP2009283634A (ja) * | 2008-05-21 | 2009-12-03 | Canon Inc | 光電変換装置及び撮像システム |
| JP5402083B2 (ja) * | 2008-09-29 | 2014-01-29 | ソニー株式会社 | 固体撮像装置とその製造方法、及び電子機器 |
| US8193555B2 (en) * | 2009-02-11 | 2012-06-05 | Megica Corporation | Image and light sensor chip packages |
| JP5651986B2 (ja) * | 2010-04-02 | 2015-01-14 | ソニー株式会社 | 固体撮像装置とその製造方法、並びに電子機器及びカメラモジュール |
| WO2012026292A1 (ja) * | 2010-08-24 | 2012-03-01 | 富士フイルム株式会社 | 固体撮像装置 |
-
2011
- 2011-08-09 JP JP2011173963A patent/JP6029266B2/ja active Active
-
2012
- 2012-08-03 US US13/566,781 patent/US8692345B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20130037902A1 (en) | 2013-02-14 |
| JP2013038266A (ja) | 2013-02-21 |
| US8692345B2 (en) | 2014-04-08 |
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