JP6027058B2 - 積層セラミックキャパシタ及びその実装基板 - Google Patents

積層セラミックキャパシタ及びその実装基板 Download PDF

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Publication number
JP6027058B2
JP6027058B2 JP2014144795A JP2014144795A JP6027058B2 JP 6027058 B2 JP6027058 B2 JP 6027058B2 JP 2014144795 A JP2014144795 A JP 2014144795A JP 2014144795 A JP2014144795 A JP 2014144795A JP 6027058 B2 JP6027058 B2 JP 6027058B2
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Japan
Prior art keywords
ceramic body
ceramic capacitor
multilayer ceramic
disposed
lead
Prior art date
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Active
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JP2014144795A
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English (en)
Japanese (ja)
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JP2015023287A (ja
Inventor
パク・ミン・チョル
イ・キョ・クヮン
アン・ヨン・ギュ
キム・ヒュン・テ
パク・サン・ス
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2015023287A publication Critical patent/JP2015023287A/ja
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2014144795A 2013-07-17 2014-07-15 積層セラミックキャパシタ及びその実装基板 Active JP6027058B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020130084041A KR20140038872A (ko) 2013-07-17 2013-07-17 적층 세라믹 커패시터 및 그 실장 기판
KR10-2013-0084041 2013-07-17
KR1020140080924A KR101659152B1 (ko) 2013-07-17 2014-06-30 적층 세라믹 커패시터 및 그 실장 기판
KR10-2014-0080924 2014-06-30

Publications (2)

Publication Number Publication Date
JP2015023287A JP2015023287A (ja) 2015-02-02
JP6027058B2 true JP6027058B2 (ja) 2016-11-16

Family

ID=50647000

Family Applications (1)

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JP2014144795A Active JP6027058B2 (ja) 2013-07-17 2014-07-15 積層セラミックキャパシタ及びその実装基板

Country Status (3)

Country Link
JP (1) JP6027058B2 (ko)
KR (3) KR20140038872A (ko)
CN (1) CN104299779A (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015019079A (ja) 2014-08-13 2015-01-29 株式会社村田製作所 積層セラミック電子部品
JP2014220528A (ja) 2014-08-13 2014-11-20 株式会社村田製作所 積層コンデンサ
JP2014239259A (ja) 2014-08-13 2014-12-18 株式会社村田製作所 積層コンデンサ及び積層コンデンサの実装構造体
JP2014241452A (ja) 2014-08-13 2014-12-25 株式会社村田製作所 積層セラミック電子部品
JP2014222783A (ja) 2014-08-13 2014-11-27 株式会社村田製作所 積層コンデンサ及び積層コンデンサの実装構造体
JP2015019083A (ja) 2014-08-13 2015-01-29 株式会社村田製作所 積層コンデンサ及び積層コンデンサの実装構造体
JP2015035630A (ja) 2014-11-13 2015-02-19 株式会社村田製作所 3端子型コンデンサ
JP2015065455A (ja) 2014-11-13 2015-04-09 株式会社村田製作所 3端子型コンデンサ
JP2015079980A (ja) 2014-12-04 2015-04-23 株式会社村田製作所 3端子型コンデンサ
US9214282B1 (en) 2014-12-08 2015-12-15 Murata Manufacturing Co., Ltd. Three-terminal capacitor
KR101771798B1 (ko) * 2015-08-26 2017-08-25 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102198538B1 (ko) * 2015-12-29 2021-01-06 삼성전기주식회사 적층 전자 부품
KR101813365B1 (ko) 2016-03-22 2017-12-28 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102483618B1 (ko) 2016-03-23 2023-01-02 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
JP6851174B2 (ja) * 2016-10-26 2021-03-31 太陽誘電株式会社 積層セラミックコンデンサ
KR102613871B1 (ko) 2016-11-23 2023-12-15 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
WO2018159838A1 (ja) 2017-03-03 2018-09-07 株式会社村田製作所 積層セラミックコンデンサおよびその製造方法
KR101939083B1 (ko) 2017-03-29 2019-01-16 삼성전기 주식회사 적층형 커패시터 및 그 제조방법
JP7480480B2 (ja) * 2018-10-11 2024-05-10 株式会社村田製作所 電子部品
JP7476493B2 (ja) 2018-10-11 2024-05-01 株式会社村田製作所 電子部品
US11462360B2 (en) * 2020-01-23 2022-10-04 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081875B2 (ja) * 1989-09-08 1996-01-10 株式会社村田製作所 積層コンデンサ
JPH11312624A (ja) * 1998-04-28 1999-11-09 Kyocera Corp 積層セラミックコンデンサ
US6950300B2 (en) * 2003-05-06 2005-09-27 Marvell World Trade Ltd. Ultra low inductance multi layer ceramic capacitor
JP2006086359A (ja) * 2004-09-16 2006-03-30 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
JP2006100682A (ja) * 2004-09-30 2006-04-13 Taiyo Yuden Co Ltd 3端子型積層コンデンサ実装回路基板及び3端子型積層コンデンサ
JP2006100646A (ja) * 2004-09-30 2006-04-13 Taiyo Yuden Co Ltd 積層コンデンサ
JP2006114806A (ja) * 2004-10-18 2006-04-27 Taiyo Yuden Co Ltd 回路基板
WO2008044376A1 (fr) * 2006-10-06 2008-04-17 Sanyo Electric Co., Ltd. Dispositif électrique
KR100900673B1 (ko) * 2007-01-31 2009-06-01 삼성전기주식회사 적층형 칩 커패시터
US7920370B2 (en) * 2007-02-05 2011-04-05 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
US8238116B2 (en) * 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
JP2010177717A (ja) * 2007-05-21 2010-08-12 Sanyo Electric Co Ltd 電気素子およびその製造方法
JP2009026872A (ja) * 2007-07-18 2009-02-05 Taiyo Yuden Co Ltd 積層コンデンサ
GB0816637D0 (en) 2008-09-12 2008-10-22 Rolls Royce Plc Blade Pitch Control
JP5343997B2 (ja) * 2011-04-22 2013-11-13 Tdk株式会社 積層コンデンサの実装構造
KR101525645B1 (ko) * 2011-09-02 2015-06-03 삼성전기주식회사 적층 세라믹 커패시터
JP5810956B2 (ja) * 2012-02-13 2015-11-11 株式会社村田製作所 積層セラミックコンデンサの製造方法及び積層セラミックコンデンサ
KR101422946B1 (ko) * 2012-12-11 2014-07-23 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조 방법

Also Published As

Publication number Publication date
KR101659152B1 (ko) 2016-09-22
KR20150009922A (ko) 2015-01-27
KR20140038872A (ko) 2014-03-31
CN104299779A (zh) 2015-01-21
KR20160106026A (ko) 2016-09-09
KR101912279B1 (ko) 2018-10-29
JP2015023287A (ja) 2015-02-02

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