JP6022893B2 - カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法 - Google Patents

カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法 Download PDF

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Publication number
JP6022893B2
JP6022893B2 JP2012234894A JP2012234894A JP6022893B2 JP 6022893 B2 JP6022893 B2 JP 6022893B2 JP 2012234894 A JP2012234894 A JP 2012234894A JP 2012234894 A JP2012234894 A JP 2012234894A JP 6022893 B2 JP6022893 B2 JP 6022893B2
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film
alkyl group
halogen atom
carbon atoms
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Japanese (ja)
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JP2014086591A (ja
Inventor
広志 桑野
広志 桑野
慎 寺木
慎 寺木
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Namics Corp
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Namics Corp
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Priority to JP2012234894A priority Critical patent/JP6022893B2/ja
Priority to CN201380054077.0A priority patent/CN104718801B/zh
Priority to PCT/JP2013/071514 priority patent/WO2014064986A1/ja
Priority to KR1020157011340A priority patent/KR102090580B1/ko
Priority to TW102134814A priority patent/TWI593742B/zh
Publication of JP2014086591A publication Critical patent/JP2014086591A/ja
Priority to PH12015500899A priority patent/PH12015500899A1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2012234894A 2012-10-24 2012-10-24 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法 Active JP6022893B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012234894A JP6022893B2 (ja) 2012-10-24 2012-10-24 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
CN201380054077.0A CN104718801B (zh) 2012-10-24 2013-08-08 覆盖膜、及使用其的柔性印刷布线板、以及它们的制造方法
PCT/JP2013/071514 WO2014064986A1 (ja) 2012-10-24 2013-08-08 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
KR1020157011340A KR102090580B1 (ko) 2012-10-24 2013-08-08 커버레이 필름, 및 그것을 사용한 플렉시블 프린트 배선판, 그리고 그들의 제조 방법
TW102134814A TWI593742B (zh) 2012-10-24 2013-09-26 覆蓋薄膜及使用其之撓性印刷配線板及彼等之製造方法
PH12015500899A PH12015500899A1 (en) 2012-10-24 2015-04-22 Coverplay film, flexible printed circuit board using same, and production method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012234894A JP6022893B2 (ja) 2012-10-24 2012-10-24 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法

Publications (2)

Publication Number Publication Date
JP2014086591A JP2014086591A (ja) 2014-05-12
JP6022893B2 true JP6022893B2 (ja) 2016-11-09

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JP2012234894A Active JP6022893B2 (ja) 2012-10-24 2012-10-24 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法

Country Status (6)

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JP (1) JP6022893B2 (ko)
KR (1) KR102090580B1 (ko)
CN (1) CN104718801B (ko)
PH (1) PH12015500899A1 (ko)
TW (1) TWI593742B (ko)
WO (1) WO2014064986A1 (ko)

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KR101797723B1 (ko) 2014-12-08 2017-11-14 셍기 테크놀로지 코. 엘티디. 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
TWI570200B (zh) * 2015-01-19 2017-02-11 巴川製紙所股份有限公司 熱硬化性接著劑組成物、熱硬化性接著薄膜及複合薄膜
JP5979516B2 (ja) * 2015-02-18 2016-08-24 パナソニックＩｐマネジメント株式会社 プリント配線板及びその製造方法
JP2016221469A (ja) * 2015-06-01 2016-12-28 関西ペイント株式会社 複層塗膜形成方法
KR102653701B1 (ko) 2015-09-30 2024-04-01 아라까와 가가꾸 고교 가부시끼가이샤 변성 폴리이미드, 접착제 조성물, 수지 부착 동박, 동장 적층판, 프린트 배선판 및 다층 기판
KR102392681B1 (ko) * 2016-01-29 2022-04-29 포센 인코포레이티드 내시경 기구용 센서 필름
JP6939017B2 (ja) 2016-03-30 2021-09-22 荒川化学工業株式会社 ポリイミド、ポリイミド系接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板及びプリント配線板、並びに多層配線板及びその製造方法
WO2018016524A1 (ja) * 2016-07-20 2018-01-25 日立化成株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
CN109963920B (zh) * 2016-11-18 2021-09-14 三键有限公司 相机模组用阳离子固化性胶粘剂组合物、固化物以及接合体
JP6917636B2 (ja) * 2016-11-24 2021-08-11 ナミックス株式会社 樹脂組成物、それを用いた熱硬化性フィルム、樹脂硬化物、積層板、プリント配線板、および半導体装置
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JPWO2019188187A1 (ja) * 2018-03-28 2021-04-01 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
US11365274B2 (en) * 2018-03-28 2022-06-21 Panasonic Intellectual Property Management Co., Ltd. Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
SG11202009376SA (en) * 2018-03-30 2020-10-29 Mitsui Mining & Smelting Co Copper-clad laminate
CN109868102B (zh) * 2019-01-02 2021-07-16 浙江华正新材料股份有限公司 Lcp基柔性覆铜板用改性环氧树脂胶黏剂及制备方法与应用
JP7507382B2 (ja) * 2019-03-29 2024-06-28 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
US20220259363A1 (en) * 2019-07-17 2022-08-18 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
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Also Published As

Publication number Publication date
CN104718801A (zh) 2015-06-17
KR20150077429A (ko) 2015-07-07
PH12015500899B1 (en) 2015-07-06
PH12015500899A1 (en) 2015-07-06
KR102090580B1 (ko) 2020-03-18
CN104718801B (zh) 2017-10-13
TWI593742B (zh) 2017-08-01
TW201422705A (zh) 2014-06-16
WO2014064986A1 (ja) 2014-05-01
JP2014086591A (ja) 2014-05-12

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