CN104718801B - 覆盖膜、及使用其的柔性印刷布线板、以及它们的制造方法 - Google Patents

覆盖膜、及使用其的柔性印刷布线板、以及它们的制造方法 Download PDF

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CN104718801B
CN104718801B CN201380054077.0A CN201380054077A CN104718801B CN 104718801 B CN104718801 B CN 104718801B CN 201380054077 A CN201380054077 A CN 201380054077A CN 104718801 B CN104718801 B CN 104718801B
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cover layer
alkyl
composition
halogen atom
phenyl
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CN104718801A (zh
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桑野広志
寺木慎
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Namics Corp
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Namics Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201380054077.0A 2012-10-24 2013-08-08 覆盖膜、及使用其的柔性印刷布线板、以及它们的制造方法 Active CN104718801B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-234894 2012-10-24
JP2012234894A JP6022893B2 (ja) 2012-10-24 2012-10-24 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
PCT/JP2013/071514 WO2014064986A1 (ja) 2012-10-24 2013-08-08 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法

Publications (2)

Publication Number Publication Date
CN104718801A CN104718801A (zh) 2015-06-17
CN104718801B true CN104718801B (zh) 2017-10-13

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Country Status (6)

Country Link
JP (1) JP6022893B2 (ko)
KR (1) KR102090580B1 (ko)
CN (1) CN104718801B (ko)
PH (1) PH12015500899A1 (ko)
TW (1) TWI593742B (ko)
WO (1) WO2014064986A1 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015133513A1 (ja) * 2014-03-07 2017-04-06 日本ゼオン株式会社 多層硬化性樹脂フィルム、プリプレグ、積層体、硬化物、複合体及び多層回路基板
KR101797723B1 (ko) 2014-12-08 2017-11-14 셍기 테크놀로지 코. 엘티디. 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
WO2016117554A1 (ja) * 2015-01-19 2016-07-28 株式会社巴川製紙所 熱硬化性接着剤組成物、熱硬化性接着フィルム、および複合フィルム
JP5979516B2 (ja) * 2015-02-18 2016-08-24 パナソニックＩｐマネジメント株式会社 プリント配線板及びその製造方法
JP2016221469A (ja) * 2015-06-01 2016-12-28 関西ペイント株式会社 複層塗膜形成方法
KR102653701B1 (ko) 2015-09-30 2024-04-01 아라까와 가가꾸 고교 가부시끼가이샤 변성 폴리이미드, 접착제 조성물, 수지 부착 동박, 동장 적층판, 프린트 배선판 및 다층 기판
EP4299021A3 (en) * 2016-01-29 2024-06-05 Forcen Inc. Sensor film for endoscopic instruments
KR102211591B1 (ko) 2016-03-30 2021-02-02 아라까와 가가꾸 고교 가부시끼가이샤 폴리이미드, 폴리이미드계 접착제, 필름상 접착재, 접착층, 접착 시트, 수지부 동박, 동피복 적층판 및 프린트 배선판, 그리고 다층 배선판 및 그 제조 방법
TWI749032B (zh) * 2016-07-20 2021-12-11 日商昭和電工材料股份有限公司 熱硬化性樹脂組成物、層間絕緣用樹脂薄膜、複合薄膜、印刷線路板及其製造方法
JP7007592B2 (ja) * 2016-11-18 2022-02-10 株式会社スリーボンド カメラモジュール用カチオン硬化性接着剤組成物、硬化物および接合体
WO2018097010A1 (ja) * 2016-11-24 2018-05-31 ナミックス株式会社 樹脂組成物、それを用いた熱硬化性フィルム、樹脂硬化物、積層板、プリント配線板、および半導体装置
US20180179424A1 (en) * 2016-12-23 2018-06-28 Industrial Technology Research Institute Adhesive composition and composite substrate employing the same
US11945910B2 (en) 2018-03-28 2024-04-02 Panasonic Intellectual Property Management Co., Ltd. Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
JP7316572B2 (ja) * 2018-03-28 2023-07-28 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
KR20200118144A (ko) * 2018-03-30 2020-10-14 미쓰이금속광업주식회사 동장 적층판
CN109868102B (zh) * 2019-01-02 2021-07-16 浙江华正新材料股份有限公司 Lcp基柔性覆铜板用改性环氧树脂胶黏剂及制备方法与应用
JPWO2020203320A1 (ko) * 2019-03-29 2020-10-08
KR20220038379A (ko) * 2019-07-17 2022-03-28 파나소닉 아이피 매니지먼트 가부시키가이샤 수지 조성물, 프리프레그, 수지 부가 필름, 수지 부가 금속박, 금속 클래드 적층판, 및 배선판
WO2021106847A1 (ja) * 2019-11-28 2021-06-03 東洋紡株式会社 接着フィルム、積層体およびプリント配線板
JP7447459B2 (ja) * 2019-12-16 2024-03-12 株式会社レゾナック 積層フィルム、配線基板を製造する方法、及び半導体装置を製造する方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101460539A (zh) * 2006-06-06 2009-06-17 日立化成工业株式会社 具有酸性取代基和不饱和马来酰亚胺基的固化剂的制造方法以及热固化性树脂组合物、预浸料及层叠板
JP2011068713A (ja) * 2009-09-24 2011-04-07 Namics Corp カバーレイフィルム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005248048A (ja) 2004-03-05 2005-09-15 Shin Etsu Chem Co Ltd 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
JP2006169446A (ja) 2004-12-17 2006-06-29 Shin Etsu Chem Co Ltd 接着剤組成物およびカバーレイフィルム
KR20140133892A (ko) * 2006-06-06 2014-11-20 히타치가세이가부시끼가이샤 산성 치환기와 불포화 말레이미드기를 갖는 경화제의 제조 방법 및 열경화성 수지 조성물, 프리프레그 및 적층판
JP2008248141A (ja) 2007-03-30 2008-10-16 Nippon Steel Chem Co Ltd 難燃硬化性樹脂組成物
JP5649773B2 (ja) * 2007-05-31 2015-01-07 三菱瓦斯化学株式会社 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
JP5233710B2 (ja) * 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
JP5439841B2 (ja) * 2009-02-16 2014-03-12 日立化成株式会社 接着剤組成物、接着シート及び半導体装置
KR20110068713A (ko) 2009-12-15 2011-06-22 원용대 Led조명기구
JP5541122B2 (ja) * 2010-11-30 2014-07-09 山一電機株式会社 フレキシブル配線板
JP2013151638A (ja) * 2011-12-27 2013-08-08 Yamaichi Electronics Co Ltd カバーレイフィルム、フレキシブル配線板およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101460539A (zh) * 2006-06-06 2009-06-17 日立化成工业株式会社 具有酸性取代基和不饱和马来酰亚胺基的固化剂的制造方法以及热固化性树脂组合物、预浸料及层叠板
JP2011068713A (ja) * 2009-09-24 2011-04-07 Namics Corp カバーレイフィルム

Also Published As

Publication number Publication date
TW201422705A (zh) 2014-06-16
KR102090580B1 (ko) 2020-03-18
CN104718801A (zh) 2015-06-17
JP2014086591A (ja) 2014-05-12
PH12015500899B1 (en) 2015-07-06
WO2014064986A1 (ja) 2014-05-01
TWI593742B (zh) 2017-08-01
JP6022893B2 (ja) 2016-11-09
KR20150077429A (ko) 2015-07-07
PH12015500899A1 (en) 2015-07-06

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