TWI812720B - 低介電黏接劑組成物 - Google Patents
低介電黏接劑組成物 Download PDFInfo
- Publication number
- TWI812720B TWI812720B TW108117402A TW108117402A TWI812720B TW I812720 B TWI812720 B TW I812720B TW 108117402 A TW108117402 A TW 108117402A TW 108117402 A TW108117402 A TW 108117402A TW I812720 B TWI812720 B TW I812720B
- Authority
- TW
- Taiwan
- Prior art keywords
- mass
- parts
- optionally substituted
- less
- group
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 80
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 80
- 239000000203 mixture Substances 0.000 title claims abstract description 62
- 239000003822 epoxy resin Substances 0.000 claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 35
- 229920000098 polyolefin Polymers 0.000 claims abstract description 35
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000004840 adhesive resin Substances 0.000 claims abstract description 3
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 3
- 239000002253 acid Substances 0.000 claims description 10
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 125000005415 substituted alkoxy group Chemical group 0.000 claims description 7
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000004426 substituted alkynyl group Chemical group 0.000 claims description 6
- 125000003107 substituted aryl group Chemical group 0.000 claims description 6
- 125000005017 substituted alkenyl group Chemical group 0.000 claims description 5
- 150000001336 alkenes Chemical class 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 32
- 239000002184 metal Substances 0.000 abstract description 32
- 229910000679 solder Inorganic materials 0.000 abstract description 24
- 239000000758 substrate Substances 0.000 abstract description 22
- 229920001721 polyimide Polymers 0.000 abstract description 16
- 239000004642 Polyimide Substances 0.000 abstract description 7
- 229920006267 polyester film Polymers 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 44
- 229920005989 resin Polymers 0.000 description 44
- 239000011347 resin Substances 0.000 description 44
- 239000010408 film Substances 0.000 description 42
- -1 laminates Substances 0.000 description 33
- 239000010410 layer Substances 0.000 description 31
- 239000012790 adhesive layer Substances 0.000 description 28
- 239000011265 semifinished product Substances 0.000 description 28
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 239000011888 foil Substances 0.000 description 16
- 238000002156 mixing Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 239000011889 copper foil Substances 0.000 description 14
- 238000001035 drying Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 12
- 239000013039 cover film Substances 0.000 description 11
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 239000004711 α-olefin Substances 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 229920000106 Liquid crystal polymer Polymers 0.000 description 8
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 239000003063 flame retardant Substances 0.000 description 8
- 238000003475 lamination Methods 0.000 description 8
- 229920005672 polyolefin resin Polymers 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000002966 varnish Substances 0.000 description 8
- 239000006087 Silane Coupling Agent Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- 239000000123 paper Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 150000008065 acid anhydrides Chemical class 0.000 description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 150000001718 carbodiimides Chemical class 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 239000012779 reinforcing material Substances 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 239000005062 Polybutadiene Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 125000000304 alkynyl group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000003208 petroleum Substances 0.000 description 4
- 229920006122 polyamide resin Polymers 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 125000006017 1-propenyl group Chemical group 0.000 description 3
- 125000000530 1-propynyl group Chemical group [H]C([H])([H])C#C* 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- 229920005990 polystyrene resin Polymers 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 3
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Chemical group BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000013557 residual solvent Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- HGXJDMCMYLEZMJ-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOOC(=O)C(C)(C)C HGXJDMCMYLEZMJ-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical group ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical compound CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- HHAPGMVKBLELOE-UHFFFAOYSA-N 2-(2-methylpropoxy)ethanol Chemical compound CC(C)COCCO HHAPGMVKBLELOE-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- KSSHRIXGOHGEJF-UHFFFAOYSA-N 2-(diaminomethyl)cyclohexan-1-one Chemical compound NC(N)C1C(CCCC1)=O KSSHRIXGOHGEJF-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- YJTIFIMHZHDNQZ-UHFFFAOYSA-N 2-[2-(2-methylpropoxy)ethoxy]ethanol Chemical compound CC(C)COCCOCCO YJTIFIMHZHDNQZ-UHFFFAOYSA-N 0.000 description 1
- MXVMODFDROLTFD-UHFFFAOYSA-N 2-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]ethanol Chemical compound CCCCOCCOCCOCCOCCO MXVMODFDROLTFD-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- 125000006179 2-methyl benzyl group Chemical group [H]C1=C([H])C(=C(C([H])=C1[H])C([H])([H])*)C([H])([H])[H] 0.000 description 1
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 1
- 125000000474 3-butynyl group Chemical group [H]C#CC([H])([H])C([H])([H])* 0.000 description 1
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 description 1
- 125000006181 4-methyl benzyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])C([H])([H])* 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 241000501667 Etroplus Species 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000002009 alkene group Chemical group 0.000 description 1
- 125000005024 alkenyl aryl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- ZJKCITHLCNCAHA-UHFFFAOYSA-K aluminum dioxidophosphanium Chemical compound [Al+3].[O-][PH2]=O.[O-][PH2]=O.[O-][PH2]=O ZJKCITHLCNCAHA-UHFFFAOYSA-K 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- KQNZLOUWXSAZGD-UHFFFAOYSA-N benzylperoxymethylbenzene Chemical compound C=1C=CC=CC=1COOCC1=CC=CC=C1 KQNZLOUWXSAZGD-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000004956 cyclohexylene group Chemical group 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 238000004807 desolvation Methods 0.000 description 1
- AQEFLFZSWDEAIP-UHFFFAOYSA-N di-tert-butyl ether Chemical compound CC(C)(C)OC(C)(C)C AQEFLFZSWDEAIP-UHFFFAOYSA-N 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000005980 hexynyl group Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- DYGOPFFOGFHOIB-UHFFFAOYSA-N methylperoxyethane Chemical group CCOOC DYGOPFFOGFHOIB-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000005981 pentynyl group Chemical group 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 229920005653 propylene-ethylene copolymer Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000011410 subtraction method Methods 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- ROEHNQZQCCPZCH-UHFFFAOYSA-N tert-butyl 2-tert-butylperoxycarbonylbenzoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1C(=O)OC(C)(C)C ROEHNQZQCCPZCH-UHFFFAOYSA-N 0.000 description 1
- RUPAXCPQAAOIPB-UHFFFAOYSA-N tert-butyl formate Chemical compound CC(C)(C)OC=O RUPAXCPQAAOIPB-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
本發明提供一種黏接劑組成物,不僅係與以往的聚醯亞胺、聚酯膜,其與金屬基材亦具有高黏接性,並且可得到高焊料耐熱性,且低介電特性亦優良。
本發明之黏接劑樹脂組成物含有酸改性聚烯烴(a)、數量平均分子量3000以下的低聚苯醚(b)及環氧樹脂(c),且滿足下述(A)及/或(B)。
(A)相對於100質量份之酸改性聚烯烴(a),含有超過20質量份且60質量份以下之環氧樹脂(c)
(B)更含有聚碳二亞胺(d)。
Description
本發明係關於一種黏接劑組成物。更詳細而言,係關於一種用於樹脂基材與樹脂基材或金屬基材之黏接的黏接劑組成物。特別是關於撓性印刷電路板(以下簡稱為FPC)用黏接劑組成物,以及包含該黏接劑組成物之覆蓋層薄膜、疊層板、附樹脂之銅箔及接合片。
撓性印刷電路板(FPC)因為具有優良的彎曲性,而可對應個人電腦(PC)及智慧型手機等的多功能化、小型化,因此常用於將電子電路基板組裝至狹窄且複雜的內部。近年來,電子設備邁向小型化、輕量化、高密度化、高輸出化,隨著該等潮流,對於配線板(電子電路基板)之性能的要求亦越來越高。特別是隨著FPC中傳送信號的高速化,信號的高頻化亦正在發展。伴隨於此,對於FPC而言,在高頻區域中的低介電特性(低介電常數、低介電正切)的要求提高。如此,為了達成低介電特性,而形成了降低FPC之基材及黏接劑之介電損失的對策。就黏接劑而言,係由聚烯烴與環氧化物的組合(專利文獻1)或彈性體與環氧化物的組合(專利文獻2)進行開發。
[先前技術文獻]
[專利文獻]
[專利文獻1]WO2016/047289號公報
[專利文獻2]WO2014/147903號公報
[發明所欲解決之課題]
然而,專利文獻1中,用於補強板或層間的黏接劑,其耐熱性難以說是優良。又,專利文獻2中,在使用時重要的摻合後之保存穩定性並不充分。
本發明,為了解決上述課題而詳細研究的結果,發現具有特定物性的黏接劑組成物,其與以往聚醯亞胺膜等的樹脂基材、及銅箔等的金屬基材的黏接性高、焊料耐熱性及摻合後的適用期(pot life)性能優良,進而完成本發明。
亦即,本發明之目的係提供一種黏接劑組成物,其與聚醯亞胺等的各種樹脂基材及金屬基材雙方皆具有良好的黏接性、且焊料耐熱性及適用期性亦優良。
[解決課題之手段]
一種黏接劑樹脂組成物,含有酸改性聚烯烴(a)、數量平均分子量3000以下的低聚苯醚(b)、及環氧樹脂(c),且滿足下述(A)及/或(B)。
(A)相對於100質量份之酸改性聚烯烴(a),含有超過20質量份且60質量份以下之環氧樹脂(c)
(B)更含有聚碳二亞胺(d)
酸改性聚烯烴(a)的酸價宜為5~40mgKOH/g,數量平均分子量3000以下的低聚苯醚(b)宜具有通式(1)的結構單元及/或通式(2)的結構單元。
通式(1)中,R1
、R2
、R3
、R4
各自獨立,表示氫原子、可經取代之烷基、可經取代之烯基、可經取代之炔基、可經取代之芳基、可經取代之芳烷基或可經取代之烷氧基。
通式(2)中,R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
各自獨立,表示氫原子、可經取代之烷基、可經取代之烯基、可經取代之炔基、可經取代之芳基、可經取代之芳烷基或可經取代之烷氧基。A為碳數20以下的直鏈狀、分支狀或環狀的2價烴基、或氧。
相對於100質量份之酸改性聚烯烴(a),宜含有0.05質量份以上200質量份以下的數量平均分子量3000以下的低聚苯醚(b),且宜含有0.5~20質量份的聚碳二亞胺(d)。
該黏接劑組成物,於1GHz的相對介電常數(εc
)宜為3.0以下,介電正切(tanδ)宜為0.02以下。
含有該黏接劑組成物的黏接片或疊層體。含有該疊層體作為構成要件的印刷電路板。
[發明之效果]
本發明之黏接劑組成物,與聚醯亞胺等的各種樹脂基材及金屬基材雙方皆具有良好的黏接性,且焊料耐熱性及適用期性優良。
>酸改性聚烯烴(a)>
本發明中所使用的酸改性聚烯烴(a)(以下亦簡稱為(a)成分)並無限制,但宜為藉由將α,β-不飽和羧酸及其酸酐中之至少1種接枝於聚烯烴樹脂而得的酸改性聚烯烴。聚烯烴樹脂係指:乙烯、丙烯、丁烯、丁二烯、異戊二烯等所例示之烯烴單體之單獨聚合、或與其他單體的共聚合、及得到的聚合物之氫化物或鹵化物等以烴骨架作為主體之聚合物。亦即,酸改性聚烯烴宜為藉由將α,β-不飽和羧酸及其酸酐中之至少1種接枝於聚乙烯、聚丙烯及丙烯-α-烯烴共聚物中至少1種而得的酸改性聚烯烴。
丙烯-α-烯烴共聚物,係以丙烯作為主體而與α-烯烴共聚合而得者。可使用例如:乙烯、1-丁烯、1-庚烯、1-辛烯、4-甲基-1-戊烯、乙酸乙烯酯等之1種或數種作為α-烯烴。該等α-烯烴之中宜為乙烯、1-丁烯。丙烯-α-烯烴共聚物之丙烯成分與α-烯烴成分的比例並無限制,但丙烯成分宜為50莫耳%以上,為70莫耳%以上更佳。
可列舉例如:馬來酸、伊康酸、檸康酸及該等酸酐作為α,β-不飽和羧酸及其酸酐的至少1種。該等之中宜為酸酐,為馬來酸酐更佳。具體而言可列舉:馬來酸酐改性聚丙烯、馬來酸酐改性丙烯-乙烯共聚物、馬來酸酐改性丙烯-丁烯共聚物、馬來酸酐改性丙烯-乙烯-丁烯共聚物等,可使用該等酸改性聚烯烴中的1種或將2種以上組合使用。
酸改性聚烯烴(a)的酸價,考慮耐熱性及和樹脂基材、金屬基材間的黏接性之觀點,下限宜為5mgKOH/g以上,為6mgKOH/g以上更佳,為7mgKOH/g以上再更佳。藉由使其在該下限值以上,與環氧樹脂(c)的互溶性變得良好,而可呈現優良的黏接強度。又,交聯密度高而耐熱性變得良好。上限宜為40mgKOH/g以下,為30mgKOH/g以下更佳,為20mgKOH/g以下再更佳。藉由使其在該上限值以下,黏接性變得良好。又,溶液的黏度及穩定性變得良好,而可呈現優良的適用期性。再者,製造效率亦提升。
酸改性聚烯烴(a)的數量平均分子量(Mn)宜在10,000~50,000之範圍內。在15,000~45,000之範圍內更佳,在20,000~40000之範圍內再更佳,在22,000~38,000之範圍內特佳。藉由使其在該下限值以上,凝聚力變得良好,而可呈現優良的黏接性。又,藉由使其在該上限值以下,流動性優良,操作性變得良好。
酸改性聚烯烴(a)宜為結晶性的酸改性聚烯烴。本發明所指的結晶性,係使用差示掃描型熱量計(DSC)以20℃/分鐘的速度從-100℃升溫至250℃為止之該升溫過程中顯示明確的熔解峰值者。
酸改性聚烯烴(a)之熔點(Tm)宜在50℃~120℃之範圍內。在60℃~100℃之範圍內更佳,在70℃~90℃之範圍內再更佳。藉由使其在該下限值以上,來自結晶的凝聚力變得良好,而可呈現優良的黏接及耐熱性。又,藉由使其在該上限值以下,溶液穩定性、流動性優良,黏接時的操作性變得良好。
酸改性聚烯烴(a)之熔解熱(ΔH)宜在5J/g~60J/g之範圍內。在10J/g~50J/g之範圍內更佳,在20J/g~40J/g之範圍內最佳。藉由使其在該下限值以上,來自結晶的凝聚力變得良好,而可呈現優良的黏接及耐熱性。又,藉由使其在該上限值以下,溶液穩定性、流動性優良,黏接時的操作性變得良好。
就酸改性聚烯烴(a)之製造方法而言並無特別限制,例如可列舉自由基接枝反應(亦即對於成為主鏈之聚合物生成自由基物種,並以該自由基物種作為聚合起始點而使不飽和羧酸及酸酐進行接枝聚合之反應)等。
就自由基產生劑而言並無特別限制,但宜使用有機過氧化物。就有機過氧化物而言並無特別限制,但可列舉:過氧酞酸二第三丁酯、第三丁基過氧化氫、過氧化二異丙苯、過氧化苯甲醯、過氧化苯甲酸第三丁酯、過氧化-2-乙基己酸第三丁酯、過氧化新戊酸第三丁酯、過氧化甲乙酮、二第三丁基過氧化物、過氧化月桂醯等過氧化物;偶氮雙異丁腈、偶氮雙異丙腈等偶氮腈類等。
>低聚苯醚(b)>
本發明中所使用的低聚苯醚(b)(以下亦簡稱為(b)成分),數量平均分子量(Mn)為3000以下,宜為可使用具有下述通式(1)所示之結構單元及/或通式(2)之結構單元的化合物。
通式(1)中,R1
、R2
、R3
、R4
各自獨立,宜為氫原子、可經取代之烷基、可經取代之烯基、可經取代之炔基、可經取代之芳基、可經取代之芳烷基或可經取代之烷氧基。可經取代之烷基的「烷基」為例如碳數1以上6以下、宜為碳數1以上3以下的直鏈狀或分支狀的烷基。更具體而言,可列舉:甲基、乙基、丙基、異丙基、丁基、異丁基、第二丁基、第三丁基、戊基、己基等,為甲基或乙基更佳。就可經取代之烯基的「烯基」而言,可列舉例如:乙烯基、1-丙烯基、2-丙烯基、3-丁烯基、戊烯基、己烯基等,為乙烯基或1-丙烯基更佳。就可經取代之炔基的「炔基」而言,可列舉例如:乙炔基、1-丙炔基、2-丙炔基(炔丙基)基、3-丁炔基、戊炔基、己炔基等,為乙炔基、1-丙炔基或2-丙炔基(炔丙基)基更佳。就可經取代之芳基的「芳基」而言,可列舉例如:苯基、萘基等,為苯基更佳。就可經取代之芳烷基的「芳烷基」而言,可列舉例如:苄基、苯乙基、2-甲基苄基、4-甲基苄基、α-甲基苄基、2-乙烯基苯乙基、4-乙烯基苯乙基等,為苄基更佳。可經取代之烷氧基的「烷氧基」為例如碳數1以上6以下、宜為碳數1以上3以下的直鏈狀或分支狀的烷氧基。可列舉例如:甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、第二丁氧基、第三丁氧基、戊氧基、己氧基等,為甲氧基或乙氧基更佳。上述烷基、芳基、烯基、炔基、芳烷基、及烷氧基經取代的情況,亦可具有1個或2個以上的取代基。就這種取代基而言,可列舉例如鹵素原子(例如,氟原子、氯原子、溴原子)、碳數1~6的烷基(例如,甲基、乙基、丙基、異丙基、丁基、異丁基、第二丁基、第三丁基、戊基、己基)、芳基(例如,苯基、萘基)、烯基(例如,乙烯基、1-丙烯基、2-丙烯基)、炔基(例如,乙炔基、1-丙炔基、2-丙炔基)、芳烷基(例如,苄基、苯乙基)、烷氧基(例如,甲氧基、乙氧基)等。其中,宜為R1
及R4
為甲基、R2
及R3
為氫。
通式(2)中,R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
各自獨立,宜為氫原子、可經取代之烷基、可經取代之烯基、可經取代之炔基、可經取代之芳基、可經取代之芳烷基或可經取代之烷氧基。此外,各取代基的定義如上所述。就烷基而言,可列舉:甲基、乙基、丙基、異丙基、丁基、異丁基、第二丁基、第三丁基、戊基、己基等,宜為甲基。其中,宜為R13
、R14
、R17
及R18
為甲基,R11
、R12
、R15
及R16
為氫。又,-A-宜為碳數20以下的直鏈狀、分支狀或環狀的2價烴基、或氧。A的碳數為1以上15以下更佳,為2以上10以下再更佳。又,就A之2價烴基而言,可列舉:亞甲基、伸乙基、伸丙基、正伸丁基、伸環己基、伸苯基等,其中宜為伸苯基。特佳為氧。
(b)成分亦可為以乙烯基苄基等的乙烯屬不飽和基、環氧基、胺基、羥基、巰基、羧基、及矽基等將一部分或全部官能基化的改性聚苯醚。再者,兩末端宜具有羥基、環氧基、或乙烯屬不飽和基。作為乙烯屬不飽和基,可列舉乙烯基、烯丙基、甲基丙烯酸基、丙烯基、丁烯基、己烯基、辛烯基等的烯基、環戊烯基、環己烯基等的環烯基、乙烯基苄基、乙烯基萘基等的烯基芳基。又,兩末端可為相同的官能基,亦可為相異的官能基。考慮高程度地控制低介電正切與減少樹脂殘渣之平衡的觀點,兩末端宜為羥基或乙烯基苄基,兩末端皆為羥基或乙烯基苄基更佳。
就具有以通式(1)所示之結構單元的化合物而言,為通式(3)的化合物特佳。
通式(3)中,n宜為3以上,為5以上更佳,宜為23以下,為21以下更佳,為19以下再更佳。
又,就具有以通式(2)所示之結構單元的化合物而言,為通式(4)的化合物特佳。
通式(4)中,n宜為2以上,為4以上更佳,宜為23以下,為20以下更佳,為18以下再更佳。
(b)成分的數量平均分子量必須在3000以下,宜為2700以下,為2500以下更佳。又,(b)成分的數量平均分子量宜為500以上,為700以上更佳。藉由使(b)成分的數量平均分子量在下限值以上,可使得到的黏接劑層之可撓性良好。另一方面,藉由使(b)成分的數量平均分子量在上限值以下,可使對於有機溶劑的溶解性良好。
相對於100質量份的(a)成分,(b)成分的含量宜為0.05質量份以上。為1質量份以上更佳,為5質量份以上再更佳。藉由使其在該下限值以上,可呈現優良的焊料耐熱性。又,宜為200質量份以下。為150質量份以下更佳,為100質量份以下再更佳,為50質量份以下特佳。藉由使其在該上限值以下,可呈現優良的黏接性及焊料耐熱性。
>環氧樹脂(c)>
就本發明中所使用的環氧樹脂(c)(以下亦簡稱為(c)成分)而言,只要分子中具有環氧丙基者即可,無特別限制,宜為分子中具有2個以上之環氧丙基者。具體而言無特別限制,可使用選自於由聯苯型環氧樹脂、萘型環氧樹脂、雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚醛型環氧樹脂、脂環族環氧樹脂、雙環戊二烯型環氧樹脂、四縮水甘油基二胺基二苯甲烷、三縮水甘油基對胺基苯酚、四縮水甘油基雙胺基甲基環己酮、N,N,N’,N’-四縮水甘油基間二甲苯二胺及環氧改性聚丁二烯所構成之群組中至少1種。宜為聯苯型環氧樹脂、酚醛型環氧樹脂、雙環戊二烯型環氧樹脂或環氧改性聚丁二烯。為雙環戊二烯型環氧樹脂或環氧改性聚丁二烯更佳。
>黏接劑組成物>
本發明之黏接劑組成物,藉由含有該(a)成分~(c)成分的3種樹脂,並且滿足下述(A)及/或(B)的要件,可呈現和液晶聚合物(LCP)等低極性樹脂基材、金屬基材間的優良黏接性、耐熱性、適用期性及電特性(低介電特性)。亦即,將黏接劑組成物塗佈於基材並且硬化後的黏接劑塗膜(黏接劑層)可呈現優良的低介電常數特性。
>要件(A)>
本發明之黏接劑組成物中不含有聚碳二亞胺(d)的情況,相對於100質量份之酸改性聚烯烴(a),環氧樹脂(c)的含量宜超過20質量份。為20.5質量份以上更佳,為21質量份以上再更佳。藉由使其在該下限值以上,可得到充分的硬化效果,而可呈現優良的黏接性及焊料耐熱性。又,宜為60質量份以下,為50質量份以下更佳,為40質量份以下再更佳,為35質量份以下特佳。藉由使其在該上限值以下,黏接劑組成物的介電特性變得良好。亦即,藉由使其在該範圍內,可得到除了黏接性、焊料耐熱性及適用期性以外更具有優良之低介電特性的黏接劑組成物。
>要件(B)>
本發明之黏接劑組成物除了該(a)成分~(c)成分的3種樹脂以外,可更含有聚碳二亞胺(d)(以下亦簡稱為(d)成分)。
>聚碳二亞胺(d)>
就聚碳二亞胺(d)而言,只要係分子內具有碳二亞胺基者即可,無特別限制。宜為分子內具有2個以上之碳二亞胺基的聚碳二亞胺。藉由使用聚碳二亞胺,酸改性聚烯烴(a)的羧基與碳二亞胺基反應而提高黏接劑組成物與基材的交互作用,進而可提升黏接性及焊料耐熱性。
使其含有聚碳二亞胺(d)的情況,相對於100質量份之酸改性聚烯烴(a),其含量宜為0.5質量份以上,為1質量份以上更佳,為2質量份以上再更佳。藉由使其在該下限值以上,呈現與基材的交互作用,黏接性變得良好。又,宜為20質量份以下,為15質量份以下更佳,為10質量份以下再更佳。藉由使其在該上限值以下,可呈現優良的介電特性。亦即,藉由使其在上述範圍內,可得到除了黏接性、焊料耐熱性及適用期性以外更具有優良之低介電特性的黏接劑組成物。
使其含有聚碳二亞胺(d)的情況,環氧樹脂(c)的含量並無特別限制,即使相對於100質量份之酸改性聚烯烴(a)在20質量份以下亦無問題,超過20質量份亦無問題。使其含有聚碳二亞胺(d)的情況,相對於100質量份之酸改性聚烯烴(a),環氧樹脂(c)的含量宜為0.5質量份以上,為1質量份以上更佳,為5質量份以上再更佳,為10質量份以上特佳。藉由使其在該下限值以上,可得到充分的硬化效果,而可呈現優良的黏接性及焊料耐熱性。又,宜為60質量份以下,為50質量份以下更佳,為40質量份以下再更佳,為35質量份以下特佳。藉由使其在該上限值以下,黏接劑組成物的適用期性及介電特性變得良好。亦即,藉由使其在該範圍內,可得到除了黏接性、焊料耐熱性及適用期性以外更具有優良之低介電特性的黏接劑組成物。
本發明之黏接劑組成物可更包含有機溶劑。本發明中所使用的有機溶劑,只要可溶解酸改性聚烯烴(a)、低聚苯醚(b)、環氧樹脂(c)、及聚碳二亞胺(d)則無特別限制。具體而言,例如可使用:苯、甲苯、二甲苯等的芳香烴;己烷、庚烷、辛烷、癸烷等的脂肪族系烴;環己烷、環己烯、甲基環己烷、乙基環己烷等的脂環族烴;三氯乙烯、二氯乙烯、氯苯、氯仿等的鹵化烴;甲醇、乙醇、異丙醇、丁醇、戊醇、己醇、丙二醇、酚等醇系溶劑;丙酮、甲基異丁酮、甲乙酮、戊酮、己酮、環己酮、異佛爾酮、苯乙酮等的酮系溶劑;甲基賽路蘇、乙基賽路蘇等的賽路蘇類;乙酸甲酯、乙酸乙酯、乙酸丁酯、丙酸甲酯、甲酸丁基等的酯系溶劑;乙二醇單正丁醚、乙二醇單異丁醚、乙二醇單第三丁醚、二乙二醇單正丁醚、二乙二醇單異丁醚、三乙二醇單正丁醚、四乙二醇單正丁醚等的二醇醚系溶劑等,可使用該等中的1種或將2種以上併用。特別從作業環境性、乾燥性而言,宜為甲基環己烷或甲苯。
相對於100質量份的酸改性烯烴(a),有機溶劑宜在100~1000質量份的範圍內,在200~900質量份之範圍內更佳,在300~800質量份之範圍內最佳。藉由使其在該下限值以上,液態及適用期性變得良好。又,藉由使其在該上限值以下,從製造成本及運輸成本的面向來看變得有利。
本案發明之黏接劑組成物,於頻率1GHz的相對介電常數(εc
)宜為3.0以下。為2.6以下更佳,為2.3以下再更佳。下限並無特別限制,但實用上為2.0。又,在頻率1GHz~30GHz的全區域中的介電常數(ε)宜為3.0以下,為2.6以下更佳,為2.3以下再更佳。
本案發明之黏接劑組成物,於頻率1GHz的介電正切(tanδ)宜為0.02以下。為0.01以下更佳,為0.008以下再更佳。下限並無特別限制,但實用上為0.0001。又,在頻率1GHz~30GHz的全區域中的介電正切(tanδ)宜為0.02以下,為0.01以下更佳,為0.05以下再更佳。
在本發明中,相對介電常數(εc
)及介電正切(tanδ)可以下述方法測量。亦即,將黏接劑組成物以使乾燥後的厚度成為25μm之方式塗佈於脫模基材,以約130℃乾燥約3分鐘。然後以約140℃進行熱處理約4小時以使其硬化,再將硬化後的黏接劑組成物層(黏接劑層)從脫模膜剝離。測量剝離後的該黏接劑組成物層於頻率1GHz的相對介電常數(εc
)。具體而言,以蒸鍍、濺射法等的薄膜法或導電性漿料的塗佈等的手法在黏接劑層的雙面形成金屬層以作為電容器,測量電容可從厚度與面積算出相對介電常數(εc
)及介電正切(tanδ)。
又,本發明之黏接劑組成物,在不損及本發明之效果之範圍內,亦可因應需要更含有其他成分。可列舉阻燃劑、黏著性賦予劑、填料、矽烷偶聯劑作為這種成分的具體例。
>阻燃劑>
本發明之黏接劑組成物中,在不損及本發明之效果之範圍內,亦可因應需要摻合阻燃劑。可列舉溴系、磷系、氮系、氫氧化金屬化合物等作為阻燃劑。其中宜為磷系阻燃劑,例如可使用:磷酸三甲酯、磷酸三苯酯、磷酸三甲苯酯等磷酸酯;次膦酸鋁等磷酸鹽、膦氮烯等的已知的磷系阻燃劑。該等可單獨使用,亦可任意組合2種以上使用。使其含有阻燃劑的情況,相對於(a)~(d)成分總計100質量份,宜在1~200質量份之範圍內含有阻燃劑,在5~150質量份之範圍內更佳,在10~100質量份之範圍內最佳。藉由使其在該下限值以上,阻燃性變得良好。又,藉由使其在該上限值以下,黏接性、耐熱性、電特性等不會降低。
>黏著性賦予劑>
本發明之黏接劑組成物中,在不損及本發明之效果之範圍內,亦可因應需要摻合黏著賦予劑。可列舉聚萜烯樹脂、松香系樹脂、脂肪族系石油樹脂、脂環族系石油樹脂、共聚合系石油樹脂、苯乙烯樹脂及氫化石油樹脂等作為黏著性賦予劑,目的用以提升黏接強度。該等可單獨使用,亦可任意組合2種以上使用。使其含有黏著賦予劑的情況,相對於(a)~(d)成分總計100質量份,宜在1~200質量份之範圍內含有黏著賦予劑,在5~150質量份之範圍內更佳,在10~100質量份之範圍內最佳。藉由使其在該下限值以上,可發揮黏著賦予劑的效果。又,藉由使其在該上限值以下,黏接性、耐熱性、電特性等不會降低。
>填料>
本發明之黏接劑組成物中,在不損及本發明之效果之範圍內,亦可因應需要摻合二氧化矽等填料。藉由摻合二氧化矽可提升耐熱性之特性,故非常理想。就二氧化矽而言一般已知有疏水性二氧化矽與親水性二氧化矽,但此處為了賦予耐吸濕性,宜為以二甲基二氯矽烷、六甲基二矽氮烷或辛基矽烷等實施處理的疏水性二氧化矽。摻合二氧化矽的情況,相對於(a)~(d)成分總計100質量份,其摻合量宜為0.05~30質量份的摻合量。藉由使其在該下限值以上,可發揮提升耐熱性的效果。又,藉由使其在該上限值以下,不會發生二氧化矽的分散不良,溶液黏度良好,且作業性變得良好。又,黏接性亦不會降低。
>矽烷偶聯劑>
本發明之黏接劑組成物中,在不損及本發明之效果之範圍內,亦可因應需要摻合矽烷偶聯劑。藉由摻合矽烷偶聯劑會提升對金屬之黏接性及耐熱性之特性提升,故非常理想。就矽烷偶聯劑而言並無特別限制,但可列舉具有不飽和基者、具有環氧丙基者、具有胺基者等。該等之中考慮耐熱性的觀點,為γ-環氧丙氧基丙基三甲氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷或β-(3,4-環氧環己基)乙基三乙氧基矽烷等的具有環氧丙基之矽烷偶聯劑再更佳。摻合矽烷偶聯劑的情況,相對於(a)~(d)成分總計100質量份,其摻合量宜為0.5~20質量份之摻合量。藉由使其在0.5質量份以上,優良的耐熱性變得良好。另一方面,藉由使其在20質量份以下,耐熱性及黏接性變得良好。
>疊層體>
本發明之疊層體係將黏接劑組成物疊層於基材而成者(基材/黏接劑層的2層疊層體)、或再貼合基材者(基材/黏接劑層/基材的3層疊層體)。此處黏接劑層係指將本發明之黏接劑組成物塗佈於基材並使其乾燥後的黏接劑組成物層。依照常規方法將本發明之黏接劑組成物塗佈於各種基材並使其乾燥,以及再疊層其他基材,藉此可得到本發明之疊層體。
>基材>
本發明中基材只要係本發明之黏接劑組成物可塗佈於其上並在乾燥後可形成黏接劑層者即可,無特別限制,可列舉:膜狀樹脂等的樹脂基材、金屬板及金屬箔等的金屬基材、紙類等。
可例示聚酯樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚醯胺-醯亞胺樹脂、液晶聚合物、聚苯硫醚、對排聚苯乙烯、聚烯烴系樹脂及氟系樹脂等作為樹脂基材。宜為膜狀樹脂(以下稱為基材膜層)。
可使用任何以往習知用於電路基板的導電性材料作為金屬基材。可例示SUS、銅、鋁、鐵、鋼、鋅、鎳等各種金屬及各別之合金、鍍敷物、經鋅及鉻化物等其他金屬處理之金屬等作為素材。宜為金屬箔,為銅箔更佳。關於金屬箔之厚度並無特別限制,但宜為1μm以上,為3μm以上更佳,為10μm以上再更佳。又,宜為50μm以下,為30μm以下更佳,為20μm以下再更佳。厚度過薄時,會有電路難以得到充分電特性的情況,另一方面,厚度過厚時,會有電路製作時之加工能率等降低的情況。金屬箔通常係以捲軸狀的形態提供。製造本發明之印刷電路板時所使用的金屬箔之形態並無特別限制。使用帶狀形態之金屬箔時,其長度並無特別限制。又,其寬度雖無特別限制,但宜為250~500cm左右。
可例示優質紙、牛皮紙、紙捲、玻璃紙等作為紙類。又,可例示玻璃環氧化物等作為複合素材。
考慮與黏接劑組成物間的黏接力、耐久性,就基材而言宜為聚酯樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、液晶聚合物、聚苯硫醚、對排聚苯乙烯、聚烯烴系樹脂、氟系樹脂、SUS鋼板、銅箔、鋁箔、或玻璃環氧化物。
>黏接片>
在本發明中,黏接片係指該疊層體與脫模基材介隔黏接劑組成物疊層而得者。可列舉疊層體/黏接劑層/脫模基材、或是脫模基材/黏接劑層/疊層體/黏接劑層/脫模基材作為具體的構成型態。藉由疊層脫模基材而發揮作為基材之保護層的功能。又,藉由使用脫模基材,可從黏接片將脫模基材脫模,再將黏接劑層轉印於另外的基材上。
藉由常規方法將本發明之黏接劑組成物塗佈各種疊層體並使其乾燥,可得到本發明之黏接片。又,若在乾燥後將脫模基材貼附於黏接劑層,即不會造成朝基材背面之轉移且可進行捲繞,作業性優良且可同時黏接劑層亦受到保護,因此保存性優良而且容易使用。又塗佈於脫模基材且乾燥後,若因應需要貼附另外的脫模基材,亦可將黏接劑層轉印至其他基材上。
>脫模基材>
就脫模基材而言並無特別限制,例如可列舉於優質紙、牛皮紙、紙捲、玻璃紙等紙的雙面上設置黏土、聚乙烯、聚丙烯等填平劑之塗佈層,再於其各塗佈層上塗佈聚矽氧系、氟系、醇酸系的脫模劑者。又,可列舉於聚乙烯、聚丙烯、乙烯-α-烯烴共聚物、丙烯-α-烯烴共聚物等各種烯烴膜單獨,及聚對苯二甲酸乙二酯等膜上塗佈上述脫模劑者。脫模基材與黏接劑層間的脫模力,考慮聚矽氧對於電特性有不良影響等理由,宜為於優質紙的雙面進行聚丙烯填平處理並於其上使用醇酸系脫模劑者,或聚對苯二甲酸乙二酯上使用有醇酸系脫模劑者。
另外,就將本發明中黏接劑組成物塗佈於基材上之方法而言並無特別限制,但可列舉缺角輪塗佈、逆輥塗等。或亦可因應需要,直接或是藉由轉印法在印刷電路板構成材料之壓延銅箔、或聚醯亞胺膜上設置黏接劑層。乾燥後的黏接劑層之厚度亦可因應需要適當變更,但宜在5~200μm之範圍內。黏接膜厚度若未達5μm,則黏接強度不充分。若在200μm以上則因乾燥不足,可列舉殘留溶劑變多、製造印刷電路板之壓製時產生膨起之問題點。乾燥條件並無特別限制,但乾燥後之溶劑殘留率宜為1質量%以下。若超過1質量%,則可列舉在印刷電路板壓製時殘留溶劑發泡而產生膨起之問題點。
>印刷電路板>
本發明中的「印刷電路板」係包含以形成導體電路之金屬箔與樹脂基材所形成之疊層體以作為構成要素者。印刷電路板係例如使用覆金屬疊層體而利用減去(subtractive)法等以往習知方法所製造。係總稱因應需要將由金屬箔形成的導體電路部分性或全面性地使用覆蓋膜、網版印刷印墨等被覆之所謂撓性電路板(FPC)、扁平電纜、捲帶式自動接合(TAB)用電路板等。
本發明之印刷電路板可為能夠被採用作印刷電路板之任意的疊層構成。例如可為由基材膜層、金屬箔層、黏接劑層及覆蓋膜層的4層所構成之印刷電路板。又例如可為由基材膜層、黏接劑層、金屬箔層、黏接劑層及覆蓋膜層的5層所構成之印刷電路板。
此外,因應需要亦可為將2個或3個以上之上述印刷電路板疊層而得的構成。
本發明之黏接劑組成物可適合地使用在印刷電路板的各黏接劑層。尤其若將本發明之黏接劑組成物作為黏接劑使用,不僅是和構成印刷電路板之以往的聚醯亞胺、聚酯膜、銅箔,和LCP等低極性之樹脂基材亦可具有高黏接性並得到耐焊料回焊性,並且黏接劑層本身低介電特性優良。因此,適合作為使用於覆蓋層薄膜、疊層板、設有樹脂之銅箔及接合片之黏接劑組成物。
本發明之印刷電路板中,可使用以往作為印刷電路板之基材使用之任意的樹脂膜作為基材膜。可例示聚酯樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、液晶聚合物、聚苯硫醚、對排聚苯乙烯、聚烯烴系樹脂及氟系樹脂等作為基材膜的樹脂。尤其是對於液晶聚合物、聚苯硫醚、對排聚苯乙烯、聚烯烴系樹脂等的低極性基材,亦具有優良的黏接性。
>覆蓋膜>
就覆蓋膜而言,可使用以往習知之任意的絕緣膜作為印刷電路板用之絕緣膜。例如可使用由聚醯亞胺、聚酯、聚苯硫醚、聚醚碸、聚醚醚酮、聚芳醯胺(aramid)、聚碳酸酯、聚芳酯、聚醯胺醯亞胺、液晶聚合物、對排聚苯乙烯、聚烯烴系樹脂等各種聚合物所製造的膜。為聚醯亞胺膜或液晶聚合物膜更佳。
本發明之印刷電路板,除了使用上述各層的材料以外,可使用以往習知之任意的製程而製造。
理想的實施型態係製造將黏接劑層疊層於覆蓋膜層的半成品(以下稱「覆蓋膜側半成品」)。另一方面,係製造將金屬箔層疊層於基材膜層而形成預期電路圖案的半成品(以下稱「基材膜側2層半成品」)或將黏接劑層疊層於基材膜層再於其上疊層金屬箔層而形成預期電路圖案的半成品(以下稱「基材膜側3層半成品」)(以下將基材膜側2層半成品與基材膜側3層半成品合稱為「基材膜側半成品」)。藉由將如此得到的覆蓋膜側半成品與基材膜側半成品貼合,可得到4層或5層的印刷電路板。
基材膜側半成品,例如,可藉由包含下述步驟的製造方法而得:(A)在該金屬箔上塗佈成為基材膜之樹脂的溶液,並將塗膜初步乾燥的步驟;(B)將於(A)得到的金屬箔與初步乾燥塗膜的疊層物進行熱處理・乾燥的步驟(以下稱為「熱處理・脫溶劑步驟」)。
金屬箔層中之電路的形成可使用以往習知的方法。可使用加成法(additive),亦可使用減去法。宜為減去法。
得到的基材膜側半成品可直接用於與覆蓋膜側半成品之貼合,另外亦可貼合脫模膜而保存後,使用在與覆蓋膜側半成品之貼合。
覆蓋膜側半成品,例如係將黏接劑塗佈於覆蓋膜而製造。亦可因應需要進行所塗佈之黏接劑中的交聯反應。於理想的實施型態中,係使黏接劑層半硬化。
得到的覆蓋膜側半成品可直接使用在與基材膜側半成品之貼合,另外亦可貼合脫模膜並保存後再用於與基材膜側半成品的貼合。
基材膜側半成品與覆蓋膜側半成品,分別在以例如捲軸的形態保存後,貼合而製成印刷電路板。可使用任意的法作為貼合方法,例如可使用壓製或滾軸等進行貼合的方法。又,亦可藉由使用加熱壓製或加熱滾軸裝置等的方法,邊實施加熱邊將兩者貼合。
補強材料側半成品,例如如聚醯亞胺膜般可柔軟地捲繞之補強材料的情況,將黏接劑塗佈於補強材料而製造係為合適。又,例如如以環氧樹脂使SUS、鋁等金屬板、玻璃纖維硬化而得的板等堅硬且無法捲繞之補強板的情況,藉由將預先塗佈於脫模基材的黏接劑進行轉印塗佈而製造係為合適。又,亦可因應需要實施所塗佈之黏接劑中的交聯反應。於理想的實施型態中,係使黏接劑層半硬化。
得到的補強材料側半成品可直接使用在與印刷電路板背面之貼合,另外亦可貼合脫模膜並保存後再使用於與基材膜側半成品的貼合。
基材膜側半成品、覆蓋膜側半成品、補強材料側半成品皆為本發明中的印刷電路板用疊層體。
>實施例>
以下舉實施例進一步詳細說明本發明。然而,本發明不限於實施例。實施例及比較例中單獨的份係表示質量份。
(物性評估方法)
酸價(a)成分:酸改性聚烯烴
本發明中的酸價(當量/106
g),係使酸改性聚烯烴溶解於甲苯,在甲醇鈉的甲醇溶液中,以酚酞作為指示劑進行滴定。其係表示為在1ton的樹脂之中的當量(當量/106
g)。
數量平均分子量(Mn)
本發明中的數量平均分子量,係以島津製作股份有限公司所製的凝膠滲透層析儀(以下稱為GPC,標準物質:聚苯乙烯樹脂,流動相:四氫呋喃,管柱:Shodex KF-802 + KF-804L + KF-806L,管柱溫度:30℃,流速:1.0ml/分鐘,檢測器:RI檢測器)所測量的值。
熔點、熔解熱的測量
本發明中的熔點、熔解熱,係使用差示掃描熱量計(以下稱DSC,TA Instrument Japan製,Q-2000),以20℃/分鐘的速度升溫熔解,進行冷卻樹脂化,從再次進行升溫熔解時熔解峰值之峰頂溫度及面積所測量的值。
(1)剝離強度(黏接性)
將下述黏接劑組成物以使乾燥後的厚度為25μm方式塗佈於厚度12.5μm的聚醯亞胺膜(Kaneka股份有限公司製,APICAL(註冊商標))或厚度18μm的壓延銅箔(JX金屬股份有限公司製,BHY系列),並於130℃乾燥3分鐘。將如此得到的黏接性膜(B階段(B-stage)品)與厚度12.5μm的聚醯亞胺膜或18μm的壓延銅箔貼合。貼合係以使壓延銅箔的光澤面與黏接劑層接觸的方式進行,於160℃、40kgf/cm2
的加壓下壓擠30秒並黏接。然後於140℃熱處理4小時以使其硬化,得到剝離強度評估用樣本。剝離強度係在25℃拉伸膜,以拉伸速度50mm/min實施90°剝離試驗並測量剝離強度。該試驗表示常溫下的黏接強度。
>評估基準>
◎:1.0N/mm以上
○:0.8N/mm以上未達1.0N/mm
△:0.5N/mm以上未達0.8N/mm
×:未達0.5N/mm
(2)焊料耐熱性
以與上述相同方法製作樣本,於23℃對2.0cm×2.0cm的樣本片進行2天的時效(aging)處理,在於280℃熔融的焊料浴中流動10秒,確認有無膨脹等的外觀變化。
>評估基準>
◎:無膨脹
○:具有部分膨脹
△:具有多處膨脹
×:膨脹且變色
(3)相對介電常數(εc
)及介電正切(tanδ)
將下述黏接劑組成物塗佈於厚度35μm的電解銅箔的光澤面並使乾燥硬化後的厚度為25μm,於130℃乾燥3分鐘。然後於140℃熱處理4小時而使其硬化,得到試驗用的覆銅疊層板。在所得到的試驗用的覆銅疊層板之硬化的黏接劑組成物面上,以網版印刷塗佈蒸發乾固型的導電性銀糊而形成直徑50mm的圓形,於120℃乾燥硬化30分鐘,再以導電性黏接劑將長度30mm的引線黏接於導電性銀糊所形成之圓的中央,得到平行平板電容器。使用PRECISION LCR meter HP-4284A,於22℃下,以頻率1MHz的條件測量所得之平行平板電容器的電容Cap與損失係數D(介電正切),並以下式算出相對介電常數(εc
)。
εc
=(Cap×d)/(S×ε0
)
上式中的符號如下。
Cap:電容[F]
d:介電體層厚度=25×10-6
[m]
S:被測量的介電體面積=π×(25×10-3
)2
ε0
:真空的介電常數8.854×10-12
針對所得之相對介電常數、介電正切,以下述方式進行評估。
>相對介電常數的評估基準>
◎:2.3以下
○:超過2.3且2.6以下
△:超過2.6且3.0以下
×:超過3.0
>介電正切的評估基準>
◎:0.008以下
○:超過0.008且0.01以下
△:超過0.01且0.02以下
×:超過0.02
(4)適用期性
適用期性,係指以使固體成分濃度成為20質量%的方式摻合(a)~(d)成分及甲基環己烷與甲苯的混合溶劑(甲基環己烷/甲苯=80/20(v/v))以製備樹脂溶液(清漆),而在摻合後當下或摻合後經過一定時間後該清漆的穩定性。適用期性良好的情況,係指清漆的黏度上升少而可長期保存,適用期性不良的情況係指清漆的黏度上升(增黏),嚴重的情況係指發生膠化現象,難以塗佈於基材而無法長期保存。
使用布氏黏度計,測量依照表1、2的比例所製備的清漆於25℃的分散液黏度,求得初期分散液黏度ηB0。之後,將清漆於25℃保存7天,於25℃測量分散黏度ηB。以下式算出清漆黏度,並如下述進行評估。
溶液黏度比=溶液黏度ηB/溶液黏度ηB0
>評估基準>
◎:0.5以上未達1.5
○:1.5以上未達2.0
△:2.0以上未達3.0
×:3.0以上,或因膠化而無法測量黏度
實施例1
摻合80質量份的CO-1、20質量份的OPE-2St 1200、5質量份的聚碳二亞胺V-09GB、17質量份的環氧樹脂HP-7200以及488質量份(固體成分濃度為20質量%)的有機溶劑(甲基環己烷/甲苯=80/20(v/v)),得到黏接劑組成物。摻合量、黏接強度、焊料耐熱性、電特性顯示於表1。
實施例2~20
如表1所示進行變更,以與實施例1相同的方法進行實施例2~20。黏接強度、焊料耐熱性、電特性顯示於表1。此外,係以使固體成分濃度成為20質量%的方式調整有機溶劑(甲基環己烷/甲苯=80/20(v/v))。
[表1]
比較例1~5
如表2所示進行變更,以與實施例1相同的方法進行比較例1~5。黏接強度、焊料耐熱性、電特性顯示於表2。
[表2]
表1、2中使用之酸改性聚烯烴(a)、低聚苯醚(b)、環氧樹脂(c)聚碳二亞胺(d)如以下所述。
(低聚苯醚(b))
低聚苯醚苯乙烯改性品:OPE-2St 1200(三菱瓦斯化學公司製Mn1000的具有通式(4)之結構的化合物)
低聚苯醚苯乙烯改性品:OPE-2St 2200(三菱瓦斯化學公司製Mn2000的具有通式(4)之結構的化合物)
低聚苯醚:SA90(SABIC公司製Mn1800的具有通式(3)之結構的化合物)
低聚苯醚:PPO樹脂粉末(SABIC公司製Mn20000的具有通式(3)之結構的化合物)
(環氧樹脂(c))
雙環戊二烯型環氧樹脂:HP-7200(DIC公司製 環氧當量259g/eq)
雙環戊二烯型環氧樹脂:HP-7200H(DIC公司製 環氧當量278g/eq)
環氧改性聚丁二烯樹脂:JP-100(日本曹達公司製)
(聚碳二亞胺(d))
聚碳二亞胺樹脂:V-09GB(日清紡化學公司製碳二亞胺當量 216g/eq)
聚碳二亞胺樹脂:V-03(日清紡化學公司製 碳二亞胺當量209g/eq)
(酸改性聚烯烴(a))
製造例1
在1L高壓釜中加入100質量份的丙烯-丁烯共聚物(三井化學公司製「TAFMER(註冊商標)XM7080」)、150質量份的甲苯及19質量份的馬來酸酐、6質量份的二第三丁基過氧化物,升溫至140℃後再攪拌3小時。之後,將得到的反應液冷卻後,注入具有大量甲乙酮的容器中並使樹脂析出。之後,將含有該樹脂的液體離心分離,藉此將馬來酸酐接枝聚合而得的酸改性丙烯-丁烯共聚物與(聚)馬來酸酐及低分子量物進行分離、純化。之後,在減壓下於70℃使其乾燥5小時,藉此得到馬來酸酐改性丙烯-丁烯共聚物(CO-1,酸價19mgKOH/g,數量平均分子量25,000,Tm80℃,ΔH35J/g)。
製造例2
將馬來酸酐的進料量變更為14質量份,除此之外,以與製造例1相同的方式,得到馬來酸酐改性丙烯-丁烯共聚物(CO-2,酸價14mgKOH/g,數量平均分子量30,000,Tm78℃,ΔH25J/g)。
製造例3
將馬來酸酐的進料量變更為11質量份,除此之外,以與製造例1相同的方式,得到馬來酸酐改性丙烯-丁烯共聚物(CO-3,酸價11mgKOH/g,數量平均分子量33,000,Tm80℃,ΔH25J/g)。
製造例4
將馬來酸酐的進料量變更為6質量份,除此之外,以與製造例1相同的方式,得到馬來酸酐改性丙烯-丁烯共聚物(CO-4,酸價7mgKOH/g,數量平均分子量35,000,Tm82℃,ΔH25J/g)。
從表1、2明確可知,實施例1~20中,主劑的適用期性優良,作為黏接劑,在聚醯亞胺(PI)與銅箔間、銅箔彼此之間及PI彼此之間具有優良的黏接性,並且具有焊料耐熱性。又,實施例1~16、19、20的黏接劑組成物的電特性之中,介電常數、介電正切皆為低值而良好。實施例17、18中,分別因為環氧樹脂(c)或聚碳二亞胺(d)的摻合量多,導致電特性不佳,但黏接性、焊料耐熱性及適用期性良好。相對於此,比較例1中,因為不含有低聚苯醚(b),因此焊料耐熱性低。比較例2中,因為不含有酸改性聚烯烴樹脂(a),因此黏接性不佳。比較例3中,因為不含有環氧樹脂(c),因此焊料耐熱性低。比較例4中,因為低聚苯醚(b)的數量平均分子量大,未溶解於有機溶劑,而無法製作樹脂溶液(清漆)。比較例5中,環氧樹脂(c)的摻合量少,且不含有碳二亞胺(d),因此焊料耐熱性低。
[產業利用性]
本發明之黏接劑組成物,不僅係與以往的聚醯亞胺、聚對苯二甲酸乙二酯膜,其與銅箔等的金屬基材亦具有高黏接性,並可得到高焊料耐熱性,且適用期性亦優良。又,藉由調整環氧樹脂及聚碳二亞胺的摻合量,可呈現優良的低介電特性。本發明之黏接劑組成物,可得到黏接性片及使用其進行黏接的疊層體。根據上述特性而能夠有效地用於撓性印刷電路板用途、尤其是要求在高頻區域中的低介電特性(低介電常數、低介電正切)的FPC用途。
Claims (8)
- 一種黏接劑樹脂組成物,其含有酸改性聚烯烴(a)、數量平均分子量3000以下之低聚苯醚(b)及環氧樹脂(c),相對於100質量份之酸改性聚烯烴(a),含有0.05質量份以上且200質量份以下的數量平均分子量3000以下之低聚苯醚(b),且滿足下述(A)及/或(B);(A)相對於100質量份之酸改性聚烯烴(a),含有超過20質量份且60質量份以下的環氧樹脂(c);(B)更含有聚碳二亞胺(d)。
- 如申請專利範圍第1項之黏接劑組成物,其中,酸改性聚烯烴(a)的酸價為5~40mgKOH/g。
- 如申請專利範圍第1或2項之黏接劑組成物,其中,相對於100質量份之酸改性聚烯烴,含有0.5~20質量份之聚碳二亞胺(d)。
- 如申請專利範圍第1或2項之黏接劑組成物,其中,於1GHz的相對介電常數(εc)為3.0以下,介電正切(tanδ)為0.02以下。
- 一種黏接片,其含有如申請專利範圍第1至5項中任一項之黏接劑組成物。
- 一種疊層體,其含有如申請專利範圍第1至5項中任一項之黏接劑組成物。
- 一種印刷電路板,其包含如申請專利範圍第7項之疊層體作為構成要件。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-101490 | 2018-05-28 | ||
JP2018-101491 | 2018-05-28 | ||
JP2018101490 | 2018-05-28 | ||
JP2018101491 | 2018-05-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202003760A TW202003760A (zh) | 2020-01-16 |
TWI812720B true TWI812720B (zh) | 2023-08-21 |
Family
ID=68696988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108117402A TWI812720B (zh) | 2018-05-28 | 2019-05-21 | 低介電黏接劑組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11732164B2 (zh) |
EP (1) | EP3719093B1 (zh) |
JP (2) | JP6764586B2 (zh) |
KR (1) | KR102552552B1 (zh) |
CN (1) | CN111670236B (zh) |
TW (1) | TWI812720B (zh) |
WO (1) | WO2019230445A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021085009A1 (ja) * | 2019-10-30 | 2021-05-06 | リンテック株式会社 | 接着剤組成物及び接着シート |
CN114729246B (zh) * | 2019-12-23 | 2024-05-28 | 三井化学株式会社 | 电子标签用粘接剂及电子标签 |
KR102259097B1 (ko) * | 2020-02-28 | 2021-06-02 | (주)이녹스첨단소재 | 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체 |
KR102324559B1 (ko) * | 2020-02-28 | 2021-11-10 | (주)이녹스첨단소재 | 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체 |
KR102324561B1 (ko) * | 2020-03-03 | 2021-11-10 | (주)이녹스첨단소재 | 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체 |
KR102259098B1 (ko) * | 2020-03-03 | 2021-06-03 | (주)이녹스첨단소재 | 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체 |
KR102324560B1 (ko) * | 2020-03-03 | 2021-11-11 | (주)이녹스첨단소재 | 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체 |
KR102259099B1 (ko) * | 2020-03-03 | 2021-06-03 | (주)이녹스첨단소재 | 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체 |
JP6905160B1 (ja) * | 2020-03-13 | 2021-07-21 | リンテック株式会社 | デバイス用硬化性接着シート |
JP7484517B2 (ja) | 2020-07-14 | 2024-05-16 | artience株式会社 | 熱硬化性接着シート、およびその利用 |
CN114945268A (zh) * | 2021-02-15 | 2022-08-26 | 信越聚合物株式会社 | 电磁波屏蔽膜和带电磁波屏蔽膜印刷布线板 |
JP7444318B1 (ja) | 2023-05-30 | 2024-03-06 | 東洋紡エムシー株式会社 | 接着剤組成物、並びにこれを含有する接着シート、積層体およびプリント配線板 |
JP7444319B1 (ja) | 2023-05-30 | 2024-03-06 | 東洋紡エムシー株式会社 | 接着剤組成物、並びにこれを含有する接着シート、積層体およびプリント配線板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5189103A (en) * | 1989-12-11 | 1993-02-23 | Sumitomo Chemical Company, Limited | Polyphenylene ether resin composition and process for producing the same |
CN106459704A (zh) * | 2014-08-27 | 2017-02-22 | 东洋纺株式会社 | 低介电性粘合剂组合物 |
CN107075335A (zh) * | 2014-09-24 | 2017-08-18 | 东亚合成株式会社 | 粘接剂组合物和使用了其的带有粘接剂层的层叠体 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4104323A (en) * | 1977-04-18 | 1978-08-01 | Shell Oil Company | Adhesive composition containing a pre-blended polyphenylene ether resin |
US7871709B2 (en) * | 2005-09-07 | 2011-01-18 | Equistar Chemicals, Lp | Modified tie-layer compositions and improved clarity multi-layer barrier films produced therewith |
US20120315476A1 (en) * | 2011-06-08 | 2012-12-13 | Hiroshi Ogawa | Adhesive composition and surface protection film using the same |
JP2013151638A (ja) | 2011-12-27 | 2013-08-08 | Yamaichi Electronics Co Ltd | カバーレイフィルム、フレキシブル配線板およびその製造方法 |
JP5955156B2 (ja) * | 2012-08-10 | 2016-07-20 | ナミックス株式会社 | 樹脂組成物、ならびに、それによる接着フィルムおよびカバーレイフィルム |
WO2014147903A1 (ja) | 2013-03-22 | 2014-09-25 | 東亞合成株式会社 | 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板 |
JP2015098504A (ja) * | 2013-11-18 | 2015-05-28 | 株式会社Adeka | 樹脂組成物及び放熱性絶縁硬化物 |
JP6458985B2 (ja) * | 2014-10-22 | 2019-01-30 | ナミックス株式会社 | 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置 |
WO2016117554A1 (ja) * | 2015-01-19 | 2016-07-28 | 株式会社巴川製紙所 | 熱硬化性接着剤組成物、熱硬化性接着フィルム、および複合フィルム |
JP6579309B2 (ja) * | 2015-05-01 | 2019-09-25 | 味の素株式会社 | 硬化性組成物 |
CN107109182B (zh) * | 2015-05-15 | 2019-06-07 | 东洋纺株式会社 | 含有低介电粘合剂层的层叠体 |
JP6705456B2 (ja) * | 2015-08-19 | 2020-06-03 | 東洋紡株式会社 | 低誘電接着剤組成物 |
JP6759873B2 (ja) * | 2015-09-03 | 2020-09-23 | 株式会社村田製作所 | フレキシブル銅張積層板の製造方法とフレキシブル銅張積層板 |
JP2017197597A (ja) * | 2016-04-25 | 2017-11-02 | 京セラ株式会社 | 接着剤組成物、接着シート、接着剤層付き銅箔、銅張積層板、および回路基板 |
CN106190004B (zh) * | 2016-07-20 | 2020-05-15 | 律胜科技(苏州)有限公司 | 一种具有高频特性的接着剂组合物及其用途 |
JP6553312B2 (ja) * | 2017-01-10 | 2019-07-31 | 住友精化株式会社 | エポキシ樹脂組成物 |
-
2019
- 2019-05-17 KR KR1020207022736A patent/KR102552552B1/ko active IP Right Grant
- 2019-05-17 CN CN201980011245.5A patent/CN111670236B/zh active Active
- 2019-05-17 US US16/767,251 patent/US11732164B2/en active Active
- 2019-05-17 WO PCT/JP2019/019658 patent/WO2019230445A1/ja unknown
- 2019-05-17 EP EP19810254.3A patent/EP3719093B1/en active Active
- 2019-05-17 JP JP2020522098A patent/JP6764586B2/ja active Active
- 2019-05-21 TW TW108117402A patent/TWI812720B/zh active
-
2020
- 2020-07-31 JP JP2020131099A patent/JP6941308B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5189103A (en) * | 1989-12-11 | 1993-02-23 | Sumitomo Chemical Company, Limited | Polyphenylene ether resin composition and process for producing the same |
CN106459704A (zh) * | 2014-08-27 | 2017-02-22 | 东洋纺株式会社 | 低介电性粘合剂组合物 |
CN107075335A (zh) * | 2014-09-24 | 2017-08-18 | 东亚合成株式会社 | 粘接剂组合物和使用了其的带有粘接剂层的层叠体 |
Also Published As
Publication number | Publication date |
---|---|
JP6941308B2 (ja) | 2021-09-29 |
EP3719093A1 (en) | 2020-10-07 |
JPWO2019230445A1 (ja) | 2020-09-10 |
KR102552552B1 (ko) | 2023-07-06 |
JP2020180300A (ja) | 2020-11-05 |
JP6764586B2 (ja) | 2020-10-07 |
US20210002523A1 (en) | 2021-01-07 |
EP3719093B1 (en) | 2022-10-26 |
KR20210015745A (ko) | 2021-02-10 |
EP3719093A4 (en) | 2021-08-11 |
WO2019230445A1 (ja) | 2019-12-05 |
CN111670236A (zh) | 2020-09-15 |
CN111670236B (zh) | 2022-07-08 |
TW202003760A (zh) | 2020-01-16 |
US11732164B2 (en) | 2023-08-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI812720B (zh) | 低介電黏接劑組成物 | |
CN106459704B (zh) | 低介电性粘合剂组合物 | |
CN107849429B (zh) | 低介电粘合剂组合物 | |
TW201702341A (zh) | 包含低介電性接著劑層的疊層體 | |
TW201829176A (zh) | 具有低介電性黏著劑層之疊層體 | |
JP6981571B2 (ja) | ポリオレフィン系接着剤組成物 | |
WO2021045125A1 (ja) | ポリオレフィン系接着剤組成物 | |
JP6919777B1 (ja) | 接着剤組成物、接着シート、積層体およびプリント配線板 | |
JP7120497B1 (ja) | 接着剤組成物、ならびにこれを含有する接着シート、積層体およびプリント配線板 | |
CN114555740B (zh) | 粘接膜、层叠体以及印刷线路板 | |
CN114080439B (zh) | 粘合剂组合物、粘合片、层叠体以及印刷线路板 | |
WO2021075367A1 (ja) | ポリオレフィン系接着剤組成物 | |
TW202337949A (zh) | 黏接劑組成物、黏接片、電磁波屏蔽薄膜、疊層體及印刷配線板 | |
CN116997627A (zh) | 粘接剂组合物及含有其的粘接片材、层叠体和印刷线路板 | |
TW202242060A (zh) | 黏接劑組成物、及含有此黏接劑之黏接片、疊層體及印刷配線板 |