JP6022431B2 - 基板液処理装置及び基板液処理方法 - Google Patents

基板液処理装置及び基板液処理方法 Download PDF

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Publication number
JP6022431B2
JP6022431B2 JP2013216725A JP2013216725A JP6022431B2 JP 6022431 B2 JP6022431 B2 JP 6022431B2 JP 2013216725 A JP2013216725 A JP 2013216725A JP 2013216725 A JP2013216725 A JP 2013216725A JP 6022431 B2 JP6022431 B2 JP 6022431B2
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processing liquid
tank
processing
substrate
nozzle
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Japanese (ja)
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JP2015079884A5 (enExample
JP2015079884A (ja
Inventor
木 康 弘 高
木 康 弘 高
中 幸 二 田
中 幸 二 田
永 瞬 冨
永 瞬 冨
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2013216725A priority Critical patent/JP6022431B2/ja
Priority to TW103134893A priority patent/TWI619188B/zh
Priority to US14/510,160 priority patent/US9716020B2/en
Priority to KR1020140138921A priority patent/KR102301023B1/ko
Publication of JP2015079884A publication Critical patent/JP2015079884A/ja
Publication of JP2015079884A5 publication Critical patent/JP2015079884A5/ja
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    • H10P72/0414—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H10P72/0402—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
JP2013216725A 2013-10-17 2013-10-17 基板液処理装置及び基板液処理方法 Active JP6022431B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013216725A JP6022431B2 (ja) 2013-10-17 2013-10-17 基板液処理装置及び基板液処理方法
TW103134893A TWI619188B (zh) 2013-10-17 2014-10-07 基板液處理裝置及基板液處理方法
US14/510,160 US9716020B2 (en) 2013-10-17 2014-10-09 Substrate liquid processing apparatus and substrate liquid processing method
KR1020140138921A KR102301023B1 (ko) 2013-10-17 2014-10-15 기판 액처리 장치 및 기판 액처리 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013216725A JP6022431B2 (ja) 2013-10-17 2013-10-17 基板液処理装置及び基板液処理方法

Publications (3)

Publication Number Publication Date
JP2015079884A JP2015079884A (ja) 2015-04-23
JP2015079884A5 JP2015079884A5 (enExample) 2015-11-12
JP6022431B2 true JP6022431B2 (ja) 2016-11-09

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Family Applications (1)

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JP2013216725A Active JP6022431B2 (ja) 2013-10-17 2013-10-17 基板液処理装置及び基板液処理方法

Country Status (4)

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US (1) US9716020B2 (enExample)
JP (1) JP6022431B2 (enExample)
KR (1) KR102301023B1 (enExample)
TW (1) TWI619188B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6010457B2 (ja) * 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
JP6404189B2 (ja) * 2015-08-07 2018-10-10 東京エレクトロン株式会社 基板液処理装置、基板液処理方法及び記憶媒体
JP6887836B2 (ja) * 2017-03-16 2021-06-16 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置、基板処理装置、および処理液供給方法
KR20180134465A (ko) * 2017-06-08 2018-12-19 삼성전자주식회사 기판 처리 장치 및 방법
KR101987810B1 (ko) * 2017-10-30 2019-06-11 세메스 주식회사 기판 처리 장치
KR102063320B1 (ko) * 2017-11-29 2020-01-08 세메스 주식회사 기판 처리 장치 및 방법
KR20190045109A (ko) 2019-04-11 2019-05-02 신민영 자동차 및 배관용 니플 자동화 제조 방법 및 그 시스템
KR20190125238A (ko) 2019-10-18 2019-11-06 경일대학교산학협력단 자동차 배관용 니플의 자동화 제조 시스템 및 자동화 제조 방법
KR102622445B1 (ko) * 2020-04-24 2024-01-09 세메스 주식회사 기판 처리 장치 및 액 공급 방법
JP6939960B1 (ja) * 2020-07-30 2021-09-22 栗田工業株式会社 ウェハ洗浄水供給装置
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム
JP7438172B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給装置、供給システム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094783A (en) * 1977-09-29 1978-06-13 Jackson George F Centrifugal flotation separator
JP4692997B2 (ja) 1998-07-07 2011-06-01 東京エレクトロン株式会社 処理装置及び処理方法
JP4426036B2 (ja) * 1999-12-02 2010-03-03 東京エレクトロン株式会社 基板処理装置
CN1656601A (zh) * 2002-03-12 2005-08-17 奥林巴斯株式会社 半导体制造方法及其装置
JP2004228467A (ja) * 2003-01-27 2004-08-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2006032802A (ja) * 2004-07-20 2006-02-02 Pioneer Electronic Corp ウェット装置、ディスプレイパネルの製造装置およびウェット処理方法
JP4841376B2 (ja) * 2006-02-07 2011-12-21 大日本スクリーン製造株式会社 基板処理装置
JP5173500B2 (ja) * 2008-03-11 2013-04-03 大日本スクリーン製造株式会社 処理液供給装置およびそれを備えた基板処理装置
CA2634672C (en) * 2008-06-09 2013-03-12 Jerry Hanna Water reaction tank
JP5785454B2 (ja) * 2011-07-29 2015-09-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Also Published As

Publication number Publication date
US9716020B2 (en) 2017-07-25
KR102301023B1 (ko) 2021-09-09
KR20150044813A (ko) 2015-04-27
US20150107622A1 (en) 2015-04-23
JP2015079884A (ja) 2015-04-23
TW201528404A (zh) 2015-07-16
TWI619188B (zh) 2018-03-21

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