JP6013336B2 - 冗長シリコン貫通ビアを伴う半導体チップ - Google Patents
冗長シリコン貫通ビアを伴う半導体チップ Download PDFInfo
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- JP6013336B2 JP6013336B2 JP2013528332A JP2013528332A JP6013336B2 JP 6013336 B2 JP6013336 B2 JP 6013336B2 JP 2013528332 A JP2013528332 A JP 2013528332A JP 2013528332 A JP2013528332 A JP 2013528332A JP 6013336 B2 JP6013336 B2 JP 6013336B2
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| PCT/US2011/051027 WO2012034034A1 (en) | 2010-09-09 | 2011-09-09 | Semiconductor chip with redundant thru-silicon-vias |
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| US8314498B2 (en) * | 2010-09-10 | 2012-11-20 | Aptina Imaging Corporation | Isolated bond pad with conductive via interconnect |
| WO2013057886A1 (ja) * | 2011-10-17 | 2013-04-25 | パナソニック株式会社 | 集積回路、マルチコアプロセッサ装置及び集積回路の製造方法 |
| US9030010B2 (en) * | 2012-09-20 | 2015-05-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaging devices and methods |
| US8866287B2 (en) * | 2012-09-29 | 2014-10-21 | Intel Corporation | Embedded structures for package-on-package architecture |
| CN104037149A (zh) * | 2013-03-05 | 2014-09-10 | 飞思卡尔半导体公司 | 引线框和基板半导体封装 |
| WO2014209330A1 (en) * | 2013-06-27 | 2014-12-31 | Intel IP Corporation | High conductivity high frequency via for electronic systems |
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| US9389972B2 (en) | 2014-05-13 | 2016-07-12 | International Business Machines Corporation | Data retrieval from stacked computer memory |
| US9405468B2 (en) | 2014-05-13 | 2016-08-02 | Globalfoundries Inc. | Stacked memory device control |
| KR101640076B1 (ko) * | 2014-11-05 | 2016-07-15 | 앰코 테크놀로지 코리아 주식회사 | 웨이퍼 레벨의 칩 적층형 패키지 및 이의 제조 방법 |
| US9515017B2 (en) * | 2014-12-18 | 2016-12-06 | Intel Corporation | Ground via clustering for crosstalk mitigation |
| US9515035B2 (en) | 2014-12-19 | 2016-12-06 | International Business Machines Corporation | Three-dimensional integrated circuit integration |
| CN105990282B (zh) * | 2015-02-27 | 2019-03-01 | 华为技术有限公司 | 一种转接板及电子组件 |
| US9971970B1 (en) | 2015-04-27 | 2018-05-15 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with VIAS and methods for making the same |
| US10090251B2 (en) | 2015-07-24 | 2018-10-02 | Infineon Technologies Ag | Semiconductor chip having a dense arrangement of contact terminals |
| US10236245B2 (en) * | 2016-03-23 | 2019-03-19 | Dyi-chung Hu | Package substrate with embedded circuit |
| WO2018125069A1 (en) * | 2016-12-28 | 2018-07-05 | Intel Corporation | Methods of forming substrate interconnect structures for enhanced thin seed conduction |
| US11276727B1 (en) | 2017-06-19 | 2022-03-15 | Rigetti & Co, Llc | Superconducting vias for routing electrical signals through substrates and their methods of manufacture |
| US11121301B1 (en) | 2017-06-19 | 2021-09-14 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafers and their methods of manufacture |
| KR102019355B1 (ko) | 2017-11-01 | 2019-09-09 | 삼성전자주식회사 | 반도체 패키지 |
| KR102498883B1 (ko) | 2018-01-31 | 2023-02-13 | 삼성전자주식회사 | 전류를 분산시키는 관통 전극들을 포함하는 반도체 장치 |
| TWI705547B (zh) * | 2019-03-12 | 2020-09-21 | 力成科技股份有限公司 | 晶片封裝結構及其製造方法 |
| US11804479B2 (en) * | 2019-09-27 | 2023-10-31 | Advanced Micro Devices, Inc. | Scheme for enabling die reuse in 3D stacked products |
| KR20210071539A (ko) | 2019-12-06 | 2021-06-16 | 삼성전자주식회사 | 인터포저, 반도체 패키지, 및 인터포저의 제조 방법 |
| US11515173B2 (en) * | 2019-12-27 | 2022-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices and methods of manufacturing |
| CN113053758A (zh) | 2019-12-27 | 2021-06-29 | 台湾积体电路制造股份有限公司 | 半导体器件的制造方法 |
| TWI773360B (zh) * | 2021-06-03 | 2022-08-01 | 矽品精密工業股份有限公司 | 電子封裝件及其承載結構與製法 |
| US11955417B2 (en) | 2021-12-14 | 2024-04-09 | Industrial Technology Research Institute | Electronic device having substrate with electrically floating vias |
| US12292603B2 (en) | 2022-09-19 | 2025-05-06 | Globalfoundries U.S. Inc. | PIC structure with wire(s) between z-stop supports on side of optical device attach cavity |
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| JPS6124240A (ja) | 1984-07-13 | 1986-02-01 | Toshiba Corp | 半導体基板 |
| US6355950B1 (en) * | 1998-09-23 | 2002-03-12 | Intel Corporation | Substrate interconnect for power distribution on integrated circuits |
| US6352923B1 (en) * | 1999-03-01 | 2002-03-05 | United Microelectronics Corp. | Method of fabricating direct contact through hole type |
| JP4123682B2 (ja) * | 2000-05-16 | 2008-07-23 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
| US7345350B2 (en) * | 2003-09-23 | 2008-03-18 | Micron Technology, Inc. | Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias |
| JP4426482B2 (ja) | 2005-02-28 | 2010-03-03 | Okiセミコンダクタ株式会社 | パッケージ基台およびその製造方法、並びにそのパッケージ基台を備えた半導体パッケージ |
| US20070032059A1 (en) * | 2005-08-02 | 2007-02-08 | Harry Hedler | Method of manufacturing a semiconductor structure having a wafer through-contact and a corresponding semiconductor structure |
| US20070045844A1 (en) * | 2005-08-24 | 2007-03-01 | Andry Paul S | Alpha particle shields in chip packaging |
| JP4847072B2 (ja) | 2005-08-26 | 2011-12-28 | 本田技研工業株式会社 | 半導体集積回路装置およびその製造方法 |
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| US8134235B2 (en) * | 2007-04-23 | 2012-03-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three-dimensional semiconductor device |
| KR101052870B1 (ko) * | 2008-04-21 | 2011-07-29 | 주식회사 하이닉스반도체 | 관통 전극, 이를 갖는 회로 기판, 이를 갖는 반도체 패키지및 반도체 패키지를 갖는 적층 반도체 패키지 |
| JP2009295616A (ja) | 2008-06-02 | 2009-12-17 | Philtech Inc | シリコン基板、デバイスの製造方法、デバイスおよびテスト方法 |
| US7939449B2 (en) * | 2008-06-03 | 2011-05-10 | Micron Technology, Inc. | Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends |
| US8288872B2 (en) | 2008-08-05 | 2012-10-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Through silicon via layout |
| JP2010135348A (ja) | 2008-12-02 | 2010-06-17 | Panasonic Corp | 貫通電極形成方法 |
| US8232137B2 (en) * | 2009-12-10 | 2012-07-31 | Intersil Americas Inc. | Heat conduction for chip stacks and 3-D circuits |
| US20110193212A1 (en) * | 2010-02-08 | 2011-08-11 | Qualcomm Incorporated | Systems and Methods Providing Arrangements of Vias |
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