JP5984018B2 - 固体撮像素子、および撮像装置 - Google Patents

固体撮像素子、および撮像装置 Download PDF

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Publication number
JP5984018B2
JP5984018B2 JP2013032089A JP2013032089A JP5984018B2 JP 5984018 B2 JP5984018 B2 JP 5984018B2 JP 2013032089 A JP2013032089 A JP 2013032089A JP 2013032089 A JP2013032089 A JP 2013032089A JP 5984018 B2 JP5984018 B2 JP 5984018B2
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pixel
pixels
substrate
imaging device
solid
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JP2013032089A
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Japanese (ja)
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JP2014165520A (ja
JP2014165520A5 (enExample
Inventor
馬渕　圭司
圭司 馬渕
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Sony Corp
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Sony Corp
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Priority to JP2013032089A priority Critical patent/JP5984018B2/ja
Priority to TW102146451A priority patent/TWI592016B/zh
Priority to KR1020157018330A priority patent/KR20150122630A/ko
Priority to CN201480005997.8A priority patent/CN104956663B/zh
Priority to US14/767,055 priority patent/US9621833B2/en
Priority to KR1020237026630A priority patent/KR20230119734A/ko
Priority to CN201810263386.3A priority patent/CN108419034B/zh
Priority to PCT/JP2014/000734 priority patent/WO2014129148A1/en
Priority to KR1020217011997A priority patent/KR102566553B1/ko
Priority to CN202010263907.2A priority patent/CN111556263B/zh
Publication of JP2014165520A publication Critical patent/JP2014165520A/ja
Publication of JP2014165520A5 publication Critical patent/JP2014165520A5/ja
Application granted granted Critical
Publication of JP5984018B2 publication Critical patent/JP5984018B2/ja
Priority to US15/445,669 priority patent/US10070087B2/en
Priority to US16/055,509 priority patent/US10375335B2/en
Priority to US16/521,368 priority patent/US10694135B2/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/745—Circuitry for generating timing or clock signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/767—Horizontal readout lines, multiplexers or registers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/7795—Circuitry for generating timing or clock signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/63—Generation or supply of power specially adapted for television receivers

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2013032089A 2013-02-21 2013-02-21 固体撮像素子、および撮像装置 Active JP5984018B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2013032089A JP5984018B2 (ja) 2013-02-21 2013-02-21 固体撮像素子、および撮像装置
TW102146451A TWI592016B (zh) 2013-02-21 2013-12-16 固態成像器件及成像裝置，以及驅動影像感測器之方法
KR1020217011997A KR102566553B1 (ko) 2013-02-21 2014-02-13 고체 촬상 소자 및 촬상 장치
CN201480005997.8A CN104956663B (zh) 2013-02-21 2014-02-13 固态成像元件和成像装置
US14/767,055 US9621833B2 (en) 2013-02-21 2014-02-13 Solid-state imaging device and imaging apparatus
KR1020237026630A KR20230119734A (ko) 2013-02-21 2014-02-13 고체 촬상 소자 및 촬상 장치
CN201810263386.3A CN108419034B (zh) 2013-02-21 2014-02-13 固态成像元件、电子设备和图像传感器的驱动方法
PCT/JP2014/000734 WO2014129148A1 (en) 2013-02-21 2014-02-13 Solid-state imaging device and imaging apparatus
KR1020157018330A KR20150122630A (ko) 2013-02-21 2014-02-13 고체 촬상 소자 및 촬상 장치
CN202010263907.2A CN111556263B (zh) 2013-02-21 2014-02-13 固态成像元件和成像装置
US15/445,669 US10070087B2 (en) 2013-02-21 2017-02-28 Solid-state imaging device and imaging apparatus
US16/055,509 US10375335B2 (en) 2013-02-21 2018-08-06 Solid-state imaging device and imaging apparatus
US16/521,368 US10694135B2 (en) 2013-02-21 2019-07-24 Solid-state imaging device and imaging apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013032089A JP5984018B2 (ja) 2013-02-21 2013-02-21 固体撮像素子、および撮像装置

Publications (3)

Publication Number Publication Date
JP2014165520A JP2014165520A (ja) 2014-09-08
JP2014165520A5 JP2014165520A5 (enExample) 2015-03-19
JP5984018B2 true JP5984018B2 (ja) 2016-09-06

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JP2013032089A Active JP5984018B2 (ja) 2013-02-21 2013-02-21 固体撮像素子、および撮像装置

Country Status (6)

Country Link
US (4) US9621833B2 (enExample)
JP (1) JP5984018B2 (enExample)
KR (3) KR102566553B1 (enExample)
CN (3) CN104956663B (enExample)
TW (1) TWI592016B (enExample)
WO (1) WO2014129148A1 (enExample)

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JP5984018B2 (ja) * 2013-02-21 2016-09-06 ソニー株式会社 固体撮像素子、および撮像装置
JP6515999B2 (ja) * 2015-03-30 2019-05-22 株式会社ニコン 撮像素子および撮像装置
CN108141575B (zh) * 2015-05-19 2020-10-30 奇跃公司 半全局快门成像器
JP6289425B2 (ja) 2015-09-25 2018-03-07 キヤノン株式会社 撮像素子およびその製造方法、撮像装置、撮像方法ならびにプログラム
WO2017187811A1 (ja) 2016-04-27 2017-11-02 ソニー株式会社 撮像制御装置及び撮像制御方法、並びに撮像装置
EP3748955A1 (en) * 2016-05-31 2020-12-09 Sony Semiconductor Solutions Corporation Imaging apparatus and imaging method, camera module, and electronic apparatus
WO2018088121A1 (ja) * 2016-11-14 2018-05-17 富士フイルム株式会社 撮像装置、撮像方法、及び、撮像プログラム
JP6832155B2 (ja) 2016-12-28 2021-02-24 ソニーセミコンダクタソリューションズ株式会社 画像処理装置、画像処理方法、及び画像処理システム
KR102406996B1 (ko) 2017-04-07 2022-06-08 삼성전자주식회사 이미지 센서
JP7198507B2 (ja) * 2017-08-08 2023-01-04 国立大学法人静岡大学 距離画像測定装置及び距離画像測定方法
JP7023659B2 (ja) 2017-09-29 2022-02-22 キヤノン株式会社 撮像装置、撮像システム、移動体
JP2019149713A (ja) * 2018-02-27 2019-09-05 ソニーセミコンダクタソリューションズ株式会社 センサ素子および電子機器
JP2020028098A (ja) * 2018-08-17 2020-02-20 ソニーセミコンダクタソリューションズ株式会社 撮像装置、電子機器
EP3627830B1 (en) 2018-09-18 2024-11-20 IniVation AG Image sensor and sensor device for imaging temporal and spatial contrast

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JPH0518309A (ja) 1991-07-12 1993-01-26 Daihatsu Motor Co Ltd エンジン冷却水温の検出値校正装置
JP4349232B2 (ja) * 2004-07-30 2009-10-21 ソニー株式会社 半導体モジュール及びｍｏｓ型固体撮像装置
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JP5165520B2 (ja) * 2008-10-01 2013-03-21 ソニー株式会社 固体撮像装置、撮像装置、および固体撮像装置のａｄ変換方法
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Also Published As

Publication number Publication date
US20190349548A1 (en) 2019-11-14
US20150381918A1 (en) 2015-12-31
US20170171490A1 (en) 2017-06-15
US9621833B2 (en) 2017-04-11
US10375335B2 (en) 2019-08-06
JP2014165520A (ja) 2014-09-08
KR20230119734A (ko) 2023-08-16
KR20210048581A (ko) 2021-05-03
CN111556263A (zh) 2020-08-18
CN108419034B (zh) 2021-01-19
KR20150122630A (ko) 2015-11-02
WO2014129148A1 (en) 2014-08-28
CN104956663A (zh) 2015-09-30
CN104956663B (zh) 2020-04-14
CN108419034A (zh) 2018-08-17
US20180343411A1 (en) 2018-11-29
US10694135B2 (en) 2020-06-23
TW201434316A (zh) 2014-09-01
TWI592016B (zh) 2017-07-11
CN111556263B (zh) 2023-03-24
KR102566553B1 (ko) 2023-08-14
US10070087B2 (en) 2018-09-04

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