JP5967045B2 - 処理液供給装置及び処理液供給方法 - Google Patents

処理液供給装置及び処理液供給方法 Download PDF

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Publication number
JP5967045B2
JP5967045B2 JP2013207748A JP2013207748A JP5967045B2 JP 5967045 B2 JP5967045 B2 JP 5967045B2 JP 2013207748 A JP2013207748 A JP 2013207748A JP 2013207748 A JP2013207748 A JP 2013207748A JP 5967045 B2 JP5967045 B2 JP 5967045B2
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Prior art keywords
pump
processing liquid
filter device
discharge
liquid
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Japanese (ja)
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JP2015073007A5 (https=
JP2015073007A (ja
Inventor
寺下　裕一
裕一 寺下
吉原　孝介
孝介 吉原
康治 ▲高▼▲柳▼
康治 ▲高▼▲柳▼
智伸 古庄
智伸 古庄
卓志 佐々
卓志 佐々
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2013207748A priority Critical patent/JP5967045B2/ja
Priority to US14/485,914 priority patent/US10074546B2/en
Priority to KR1020140130245A priority patent/KR101872056B1/ko
Priority to CN201410514563.2A priority patent/CN104517814B/zh
Priority to TW103133983A priority patent/TWI621472B/zh
Publication of JP2015073007A publication Critical patent/JP2015073007A/ja
Publication of JP2015073007A5 publication Critical patent/JP2015073007A5/ja
Application granted granted Critical
Publication of JP5967045B2 publication Critical patent/JP5967045B2/ja
Priority to US16/052,875 priority patent/US11342198B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

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  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Degasification And Air Bubble Elimination (AREA)
  • Filtration Of Liquid (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2013207748A 2013-10-02 2013-10-02 処理液供給装置及び処理液供給方法 Active JP5967045B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2013207748A JP5967045B2 (ja) 2013-10-02 2013-10-02 処理液供給装置及び処理液供給方法
US14/485,914 US10074546B2 (en) 2013-10-02 2014-09-15 Processing liquid supplying apparatus and processing liquid supplying method
CN201410514563.2A CN104517814B (zh) 2013-10-02 2014-09-29 处理液供给装置和处理液供给方法
KR1020140130245A KR101872056B1 (ko) 2013-10-02 2014-09-29 처리액 공급 장치 및 처리액 공급 방법
TW103133983A TWI621472B (zh) 2013-10-02 2014-09-30 處理液供給裝置及處理液供給方法
US16/052,875 US11342198B2 (en) 2013-10-02 2018-08-02 Processing liquid supplying apparatus and processing liquid supplying method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013207748A JP5967045B2 (ja) 2013-10-02 2013-10-02 処理液供給装置及び処理液供給方法

Publications (3)

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JP2015073007A JP2015073007A (ja) 2015-04-16
JP2015073007A5 JP2015073007A5 (https=) 2015-10-01
JP5967045B2 true JP5967045B2 (ja) 2016-08-10

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JP2013207748A Active JP5967045B2 (ja) 2013-10-02 2013-10-02 処理液供給装置及び処理液供給方法

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US (2) US10074546B2 (https=)
JP (1) JP5967045B2 (https=)
KR (1) KR101872056B1 (https=)
CN (1) CN104517814B (https=)
TW (1) TWI621472B (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3137768B1 (en) * 2014-04-30 2020-10-14 Anthony George Hurter Supercritical water used fuel oil purification apparatus and process
WO2015175790A1 (en) * 2014-05-15 2015-11-19 Tokyo Electron Limited Method and apparatus for increased recirculation and filtration in a photoresist dispense system
US11000782B2 (en) 2015-12-09 2021-05-11 Acm Research (Shanghai) Inc. Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device
JP6685754B2 (ja) * 2016-02-16 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス ポンプ装置および基板処理装置
JP6685759B2 (ja) * 2016-02-18 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6736989B2 (ja) * 2016-06-07 2020-08-05 東京エレクトロン株式会社 処理液供給装置、機器ユニット、処理液供給方法及び記憶媒体
CN110520965B (zh) * 2017-04-06 2023-06-02 东京毅力科创株式会社 供液装置和供液方法
JP6920133B2 (ja) * 2017-08-23 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置
JP6966265B2 (ja) * 2017-08-31 2021-11-10 株式会社Ｓｃｒｅｅｎホールディングス ポンプ装置、処理液供給装置、基板処理装置、液抜き方法および液置換方法
JP6905902B2 (ja) * 2017-09-11 2021-07-21 東京エレクトロン株式会社 処理液供給装置
WO2019117043A1 (ja) * 2017-12-12 2019-06-20 東京エレクトロン株式会社 液供給装置及び液供給方法
JP6987649B2 (ja) * 2018-01-12 2022-01-05 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置及びその脱気方法
TWI800623B (zh) * 2018-03-23 2023-05-01 日商東京威力科創股份有限公司 液處理裝置及液處理方法
US10663865B2 (en) * 2018-06-29 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Photoresist recycling apparatus
US11273396B2 (en) 2018-08-31 2022-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Liquid supply system with improved bubble venting capacity
JP7202817B2 (ja) * 2018-09-05 2023-01-12 東京エレクトロン株式会社 送液システム
KR20200126552A (ko) 2019-04-30 2020-11-09 삼성전자주식회사 다중 필터들을 가진 레지스트 필터링 시스템 및 레지스트 코팅 설비
KR102444840B1 (ko) * 2019-11-07 2022-09-16 세메스 주식회사 약액공급장치
CN112786479B (zh) * 2019-11-08 2022-12-02 夏泰鑫半导体(青岛)有限公司 管理液体供应的系统与方法
CN115210934B (zh) * 2020-10-23 2025-04-22 株式会社Lg新能源 电极绝缘液供应设备及电极绝缘液供应方法
CN114609866A (zh) * 2021-02-02 2022-06-10 台湾积体电路制造股份有限公司 用于改进光致抗蚀剂涂覆操作的系统、装置和方法
JP7578535B2 (ja) * 2021-04-15 2024-11-06 株式会社コガネイ 液体供給装置
JP7530861B2 (ja) * 2021-04-27 2024-08-08 東京エレクトロン株式会社 処理液供給装置、液体置換方法、および記憶媒体
KR102932761B1 (ko) 2021-07-02 2026-03-05 삼성전자주식회사 웨이퍼 건조 장치 및 웨이퍼 건조 방법
CN114446841B (zh) * 2022-04-12 2022-07-29 广州粤芯半导体技术有限公司 供酸装置及湿刻系统
CN119572956B (zh) * 2025-02-08 2026-03-13 沈阳芯源微电子设备股份有限公司 一种流体处理装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970008315A (ko) * 1995-07-26 1997-02-24 김광호 반도체장치
JP3461725B2 (ja) 1998-06-26 2003-10-27 東京エレクトロン株式会社 処理液供給装置及び処理液供給方法
JP3340394B2 (ja) * 1998-10-08 2002-11-05 東京エレクトロン株式会社 薬液供給システムおよび基板処理システムおよび基板処理方法
JP4011210B2 (ja) * 1998-10-13 2007-11-21 株式会社コガネイ 薬液供給方法および薬液供給装置
JP3952771B2 (ja) * 2001-12-27 2007-08-01 凸版印刷株式会社 塗布装置
JP3890229B2 (ja) * 2001-12-27 2007-03-07 株式会社コガネイ 薬液供給装置および薬液供給装置の脱気方法
JP3947398B2 (ja) * 2001-12-28 2007-07-18 株式会社コガネイ 薬液供給装置および薬液供給方法
US6848458B1 (en) * 2002-02-05 2005-02-01 Novellus Systems, Inc. Apparatus and methods for processing semiconductor substrates using supercritical fluids
JP4541069B2 (ja) * 2004-08-09 2010-09-08 東京エレクトロン株式会社 薬液供給システム
KR100643494B1 (ko) * 2004-10-13 2006-11-10 삼성전자주식회사 반도체 제조용 포토레지스트의 디스펜싱장치
US20070272327A1 (en) * 2006-04-27 2007-11-29 Applied Materials, Inc. Chemical dispense system
US8580117B2 (en) 2007-03-20 2013-11-12 Taiwan Semiconductor Manufactuing Company, Ltd. System and method for replacing resist filter to reduce resist filter-induced wafer defects
JP5018255B2 (ja) * 2007-06-07 2012-09-05 東京エレクトロン株式会社 薬液供給システム及び薬液供給方法並びに記憶媒体
JP4879253B2 (ja) * 2008-12-04 2012-02-22 東京エレクトロン株式会社 処理液供給装置
JP5451515B2 (ja) * 2010-05-06 2014-03-26 東京エレクトロン株式会社 薬液供給システム、これを備える基板処理装置、およびこの基板処理装置を備える塗布現像システム
JP5524154B2 (ja) * 2011-09-09 2014-06-18 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5571056B2 (ja) 2011-11-04 2014-08-13 東京エレクトロン株式会社 処理液供給方法、プログラム、コンピュータ記憶媒体及び処理液供給装置
KR101849799B1 (ko) * 2012-02-16 2018-04-17 도쿄엘렉트론가부시키가이샤 액 처리 방법 및 필터 내의 기체의 제거 장치
JP5439579B2 (ja) * 2012-02-27 2014-03-12 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5741549B2 (ja) * 2012-10-09 2015-07-01 東京エレクトロン株式会社 処理液供給方法、処理液供給装置及び記憶媒体
JP5453561B1 (ja) * 2012-12-20 2014-03-26 東京エレクトロン株式会社 液処理装置、液処理方法及び液処理用記憶媒体
US9446331B2 (en) * 2013-03-15 2016-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for dispensing photoresist

Also Published As

Publication number Publication date
US10074546B2 (en) 2018-09-11
US20150092167A1 (en) 2015-04-02
KR101872056B1 (ko) 2018-06-27
TWI621472B (zh) 2018-04-21
CN104517814A (zh) 2015-04-15
CN104517814B (zh) 2019-05-10
US11342198B2 (en) 2022-05-24
US20200227286A1 (en) 2020-07-16
TW201529142A (zh) 2015-08-01
KR20150039569A (ko) 2015-04-10
JP2015073007A (ja) 2015-04-16

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