KR101872056B1 - 처리액 공급 장치 및 처리액 공급 방법 - Google Patents

처리액 공급 장치 및 처리액 공급 방법 Download PDF

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KR101872056B1
KR101872056B1 KR1020140130245A KR20140130245A KR101872056B1 KR 101872056 B1 KR101872056 B1 KR 101872056B1 KR 1020140130245 A KR1020140130245 A KR 1020140130245A KR 20140130245 A KR20140130245 A KR 20140130245A KR 101872056 B1 KR101872056 B1 KR 101872056B1
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South Korea
Prior art keywords
pump
filter device
liquid
supply
discharge
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Korean (ko)
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KR20150039569A (ko
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유이치 데라시타
고우스케 요시하라
고지 다카야나기
도시노부 후루쇼
다카시 사사
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

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  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Degasification And Air Bubble Elimination (AREA)
  • Filtration Of Liquid (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020140130245A 2013-10-02 2014-09-29 처리액 공급 장치 및 처리액 공급 방법 Active KR101872056B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-207748 2013-10-02
JP2013207748A JP5967045B2 (ja) 2013-10-02 2013-10-02 処理液供給装置及び処理液供給方法

Publications (2)

Publication Number Publication Date
KR20150039569A KR20150039569A (ko) 2015-04-10
KR101872056B1 true KR101872056B1 (ko) 2018-06-27

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KR1020140130245A Active KR101872056B1 (ko) 2013-10-02 2014-09-29 처리액 공급 장치 및 처리액 공급 방법

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US (2) US10074546B2 (https=)
JP (1) JP5967045B2 (https=)
KR (1) KR101872056B1 (https=)
CN (1) CN104517814B (https=)
TW (1) TWI621472B (https=)

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US11000782B2 (en) 2015-12-09 2021-05-11 Acm Research (Shanghai) Inc. Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device
JP6685754B2 (ja) * 2016-02-16 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス ポンプ装置および基板処理装置
JP6685759B2 (ja) * 2016-02-18 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6736989B2 (ja) * 2016-06-07 2020-08-05 東京エレクトロン株式会社 処理液供給装置、機器ユニット、処理液供給方法及び記憶媒体
CN110520965B (zh) * 2017-04-06 2023-06-02 东京毅力科创株式会社 供液装置和供液方法
JP6920133B2 (ja) * 2017-08-23 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置
JP6966265B2 (ja) * 2017-08-31 2021-11-10 株式会社Ｓｃｒｅｅｎホールディングス ポンプ装置、処理液供給装置、基板処理装置、液抜き方法および液置換方法
JP6905902B2 (ja) * 2017-09-11 2021-07-21 東京エレクトロン株式会社 処理液供給装置
WO2019117043A1 (ja) * 2017-12-12 2019-06-20 東京エレクトロン株式会社 液供給装置及び液供給方法
JP6987649B2 (ja) * 2018-01-12 2022-01-05 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置及びその脱気方法
TWI800623B (zh) * 2018-03-23 2023-05-01 日商東京威力科創股份有限公司 液處理裝置及液處理方法
US10663865B2 (en) * 2018-06-29 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Photoresist recycling apparatus
US11273396B2 (en) 2018-08-31 2022-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Liquid supply system with improved bubble venting capacity
JP7202817B2 (ja) * 2018-09-05 2023-01-12 東京エレクトロン株式会社 送液システム
KR20200126552A (ko) 2019-04-30 2020-11-09 삼성전자주식회사 다중 필터들을 가진 레지스트 필터링 시스템 및 레지스트 코팅 설비
KR102444840B1 (ko) * 2019-11-07 2022-09-16 세메스 주식회사 약액공급장치
CN112786479B (zh) * 2019-11-08 2022-12-02 夏泰鑫半导体(青岛)有限公司 管理液体供应的系统与方法
CN115210934B (zh) * 2020-10-23 2025-04-22 株式会社Lg新能源 电极绝缘液供应设备及电极绝缘液供应方法
CN114609866A (zh) * 2021-02-02 2022-06-10 台湾积体电路制造股份有限公司 用于改进光致抗蚀剂涂覆操作的系统、装置和方法
JP7578535B2 (ja) * 2021-04-15 2024-11-06 株式会社コガネイ 液体供給装置
JP7530861B2 (ja) * 2021-04-27 2024-08-08 東京エレクトロン株式会社 処理液供給装置、液体置換方法、および記憶媒体
KR102932761B1 (ko) 2021-07-02 2026-03-05 삼성전자주식회사 웨이퍼 건조 장치 및 웨이퍼 건조 방법
CN114446841B (zh) * 2022-04-12 2022-07-29 广州粤芯半导体技术有限公司 供酸装置及湿刻系统
CN119572956B (zh) * 2025-02-08 2026-03-13 沈阳芯源微电子设备股份有限公司 一种流体处理装置

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US20080230492A1 (en) 2007-03-20 2008-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. System and Method for Replacing Resist Filter to Reduce Resist Filter-Induced Wafer Defects

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JP4011210B2 (ja) * 1998-10-13 2007-11-21 株式会社コガネイ 薬液供給方法および薬液供給装置
JP3952771B2 (ja) * 2001-12-27 2007-08-01 凸版印刷株式会社 塗布装置
JP3890229B2 (ja) * 2001-12-27 2007-03-07 株式会社コガネイ 薬液供給装置および薬液供給装置の脱気方法
JP3947398B2 (ja) * 2001-12-28 2007-07-18 株式会社コガネイ 薬液供給装置および薬液供給方法
US6848458B1 (en) * 2002-02-05 2005-02-01 Novellus Systems, Inc. Apparatus and methods for processing semiconductor substrates using supercritical fluids
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KR100643494B1 (ko) * 2004-10-13 2006-11-10 삼성전자주식회사 반도체 제조용 포토레지스트의 디스펜싱장치
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KR101849799B1 (ko) * 2012-02-16 2018-04-17 도쿄엘렉트론가부시키가이샤 액 처리 방법 및 필터 내의 기체의 제거 장치
JP5439579B2 (ja) * 2012-02-27 2014-03-12 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5741549B2 (ja) * 2012-10-09 2015-07-01 東京エレクトロン株式会社 処理液供給方法、処理液供給装置及び記憶媒体
JP5453561B1 (ja) * 2012-12-20 2014-03-26 東京エレクトロン株式会社 液処理装置、液処理方法及び液処理用記憶媒体
US9446331B2 (en) * 2013-03-15 2016-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for dispensing photoresist

Patent Citations (2)

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JP2000012449A (ja) * 1998-06-26 2000-01-14 Tokyo Electron Ltd 処理液供給装置及び処理液供給方法
US20080230492A1 (en) 2007-03-20 2008-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. System and Method for Replacing Resist Filter to Reduce Resist Filter-Induced Wafer Defects

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Publication number Publication date
US10074546B2 (en) 2018-09-11
US20150092167A1 (en) 2015-04-02
TWI621472B (zh) 2018-04-21
CN104517814A (zh) 2015-04-15
CN104517814B (zh) 2019-05-10
US11342198B2 (en) 2022-05-24
US20200227286A1 (en) 2020-07-16
TW201529142A (zh) 2015-08-01
JP5967045B2 (ja) 2016-08-10
KR20150039569A (ko) 2015-04-10
JP2015073007A (ja) 2015-04-16

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