JP5961409B2 - 半導体記憶装置 - Google Patents
半導体記憶装置 Download PDFInfo
- Publication number
- JP5961409B2 JP5961409B2 JP2012048891A JP2012048891A JP5961409B2 JP 5961409 B2 JP5961409 B2 JP 5961409B2 JP 2012048891 A JP2012048891 A JP 2012048891A JP 2012048891 A JP2012048891 A JP 2012048891A JP 5961409 B2 JP5961409 B2 JP 5961409B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- conductive film
- transistor
- oxide semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/70—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Dram (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012048891A JP5961409B2 (ja) | 2011-03-10 | 2012-03-06 | 半導体記憶装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011052270 | 2011-03-10 | ||
| JP2011052270 | 2011-03-10 | ||
| JP2012048891A JP5961409B2 (ja) | 2011-03-10 | 2012-03-06 | 半導体記憶装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016126477A Division JP6197075B2 (ja) | 2011-03-10 | 2016-06-27 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012199536A JP2012199536A (ja) | 2012-10-18 |
| JP2012199536A5 JP2012199536A5 (enExample) | 2015-03-26 |
| JP5961409B2 true JP5961409B2 (ja) | 2016-08-02 |
Family
ID=46794749
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012048891A Expired - Fee Related JP5961409B2 (ja) | 2011-03-10 | 2012-03-06 | 半導体記憶装置 |
| JP2016126477A Expired - Fee Related JP6197075B2 (ja) | 2011-03-10 | 2016-06-27 | 半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016126477A Expired - Fee Related JP6197075B2 (ja) | 2011-03-10 | 2016-06-27 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8772849B2 (enExample) |
| JP (2) | JP5961409B2 (enExample) |
| KR (2) | KR101954592B1 (enExample) |
| TW (1) | TWI550829B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100753600B1 (ko) * | 2007-05-28 | 2007-08-30 | 원철수 | 몰딩부재 장착유닛 및 이를 이용한 몰딩부재 코팅장치 |
| US20120298998A1 (en) | 2011-05-25 | 2012-11-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming oxide semiconductor film, semiconductor device, and method for manufacturing semiconductor device |
| WO2013054823A1 (en) * | 2011-10-14 | 2013-04-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9607991B2 (en) | 2013-09-05 | 2017-03-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN111048509B (zh) | 2014-03-28 | 2023-12-01 | 株式会社半导体能源研究所 | 半导体装置 |
| TWI735206B (zh) | 2014-04-10 | 2021-08-01 | 日商半導體能源研究所股份有限公司 | 記憶體裝置及半導體裝置 |
| WO2015170220A1 (en) | 2014-05-09 | 2015-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and electronic device |
| US10671204B2 (en) * | 2015-05-04 | 2020-06-02 | Semiconductor Energy Laboratory Co., Ltd. | Touch panel and data processor |
| US9741400B2 (en) | 2015-11-05 | 2017-08-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, memory device, electronic device, and method for operating the semiconductor device |
| DE102021101243A1 (de) | 2020-05-29 | 2021-12-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Speicherblock-kanalregionen |
| US11710790B2 (en) | 2020-05-29 | 2023-07-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory array channel regions |
| US11695073B2 (en) | 2020-05-29 | 2023-07-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory array gate structures |
| DE102020127831A1 (de) | 2020-05-29 | 2021-12-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Speicherarray-gatestrukturen |
| US11640974B2 (en) | 2020-06-30 | 2023-05-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory array isolation structures |
| US11729987B2 (en) | 2020-06-30 | 2023-08-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory array source/drain electrode structures |
| US11647634B2 (en) | 2020-07-16 | 2023-05-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three-dimensional memory device and method |
| WO2024141883A1 (ja) * | 2022-12-28 | 2024-07-04 | 株式会社半導体エネルギー研究所 | 半導体装置 |
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-
2012
- 2012-03-02 US US13/410,608 patent/US8772849B2/en not_active Expired - Fee Related
- 2012-03-06 TW TW101107467A patent/TWI550829B/zh not_active IP Right Cessation
- 2012-03-06 JP JP2012048891A patent/JP5961409B2/ja not_active Expired - Fee Related
- 2012-03-06 KR KR1020120022669A patent/KR101954592B1/ko not_active Expired - Fee Related
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- 2016-06-27 JP JP2016126477A patent/JP6197075B2/ja not_active Expired - Fee Related
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- 2019-02-22 KR KR1020190020958A patent/KR101988211B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI550829B (zh) | 2016-09-21 |
| JP6197075B2 (ja) | 2017-09-13 |
| KR101954592B1 (ko) | 2019-03-06 |
| US20120228687A1 (en) | 2012-09-13 |
| US8772849B2 (en) | 2014-07-08 |
| KR20190022591A (ko) | 2019-03-06 |
| JP2012199536A (ja) | 2012-10-18 |
| KR20120103466A (ko) | 2012-09-19 |
| TW201244065A (en) | 2012-11-01 |
| JP2016213479A (ja) | 2016-12-15 |
| KR101988211B1 (ko) | 2019-06-13 |
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