JP5954991B2 - オプトエレクロニクス半導体構成部材 - Google Patents
オプトエレクロニクス半導体構成部材 Download PDFInfo
- Publication number
- JP5954991B2 JP5954991B2 JP2011546655A JP2011546655A JP5954991B2 JP 5954991 B2 JP5954991 B2 JP 5954991B2 JP 2011546655 A JP2011546655 A JP 2011546655A JP 2011546655 A JP2011546655 A JP 2011546655A JP 5954991 B2 JP5954991 B2 JP 5954991B2
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- semiconductor chip
- scattering element
- optoelectronic semiconductor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009005907.5 | 2009-01-23 | ||
| DE102009005907A DE102009005907A1 (de) | 2009-01-23 | 2009-01-23 | Optoelektronisches Halbleiterbauteil |
| PCT/EP2009/067888 WO2010083929A1 (de) | 2009-01-23 | 2009-12-23 | Optoelektronisches halbleiterbauteil |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012516044A JP2012516044A (ja) | 2012-07-12 |
| JP2012516044A5 JP2012516044A5 (enExample) | 2012-12-27 |
| JP5954991B2 true JP5954991B2 (ja) | 2016-07-20 |
Family
ID=41862160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011546655A Active JP5954991B2 (ja) | 2009-01-23 | 2009-12-23 | オプトエレクロニクス半導体構成部材 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8916886B2 (enExample) |
| EP (1) | EP2382673B1 (enExample) |
| JP (1) | JP5954991B2 (enExample) |
| KR (1) | KR101647866B1 (enExample) |
| CN (1) | CN102292836B (enExample) |
| DE (1) | DE102009005907A1 (enExample) |
| TW (1) | TWI420647B (enExample) |
| WO (1) | WO2010083929A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010034915A1 (de) | 2010-08-20 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Streukörper |
| DE102011013369A1 (de) * | 2010-12-30 | 2012-07-05 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer Mehrzahl von Halbleiterbauelementen |
| DE102011050450A1 (de) | 2011-05-18 | 2012-11-22 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
| DE102011087614A1 (de) * | 2011-12-02 | 2013-06-06 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung |
| DE102012200973A1 (de) | 2012-01-24 | 2013-07-25 | Osram Opto Semiconductors Gmbh | Leuchte und verfahren zur herstellung einer leuchte |
| DE102012101892B4 (de) * | 2012-03-06 | 2021-05-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement und Anzeigevorrichtung damit sowie Verfahren zur Herstellung eines Wellenlängenkonversionselements |
| DE102012206970A1 (de) * | 2012-04-26 | 2013-10-31 | Osram Gmbh | Optische vorrichtung und beleuchtungseinrichtung |
| JP5960565B2 (ja) * | 2012-09-28 | 2016-08-02 | スタンレー電気株式会社 | 自動車ヘッドランプ用発光装置及びその製造方法 |
| JP6093611B2 (ja) * | 2013-03-18 | 2017-03-08 | スタンレー電気株式会社 | 発光装置及びその製造方法 |
| DE102013207460A1 (de) * | 2013-04-24 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE102013214877A1 (de) | 2013-07-30 | 2015-02-19 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines Abdeckelements und eines optoelektronischen Bauelements, Abdeckelement und optoelektronisches Bauelement |
| DE102013214896B4 (de) * | 2013-07-30 | 2021-09-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines Konverterelements und eines optoelektronischen Bauelements, Konverterelement und optoelektronisches Bauelement |
| EP3036777B1 (en) | 2013-08-20 | 2020-03-11 | Lumileds Holding B.V. | Shaped phosphor to reduce repeated reflections |
| JP6079544B2 (ja) * | 2013-10-07 | 2017-02-15 | 豊田合成株式会社 | 発光装置および発光装置の製造方法 |
| US9499740B2 (en) | 2013-11-22 | 2016-11-22 | Nitto Denko Corporation | Light extraction element |
| DE102014102828A1 (de) * | 2014-03-04 | 2015-09-10 | Osram Opto Semiconductors Gmbh | Anordnung mit einer lichtemittierenden Diode |
| JP6757716B2 (ja) * | 2014-09-02 | 2020-09-23 | ルミレッズ ホールディング ベーフェー | 光源、その製造方法、及びライト |
| DE102014112883A1 (de) * | 2014-09-08 | 2016-03-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
| DE102014112973A1 (de) * | 2014-09-09 | 2016-03-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
| JP6552190B2 (ja) * | 2014-12-11 | 2019-07-31 | シチズン電子株式会社 | 発光装置及び発光装置の製造方法 |
| DE102015105474A1 (de) * | 2015-04-10 | 2016-10-13 | Osram Opto Semiconductors Gmbh | Konverterbauteil für eine optoelektronische Leuchtvorrichtung |
| DE102015106865A1 (de) * | 2015-05-04 | 2016-11-10 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines Konverterbauteils |
| JP6217705B2 (ja) | 2015-07-28 | 2017-10-25 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP2017224867A (ja) * | 2017-09-28 | 2017-12-21 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP7083647B2 (ja) | 2018-01-16 | 2022-06-13 | スタンレー電気株式会社 | 発光装置 |
| US11489005B2 (en) | 2019-12-13 | 2022-11-01 | Lumileds Llc | Segmented LED arrays with diffusing elements |
| US11680696B2 (en) | 2019-12-13 | 2023-06-20 | Lumileds Llc | Segmented LED arrays with diffusing elements |
| JP7531090B2 (ja) * | 2022-04-28 | 2024-08-09 | 日亜化学工業株式会社 | 発光装置及び発光モジュール |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48102585A (enExample) * | 1972-04-04 | 1973-12-22 | ||
| JP3114805B2 (ja) | 1998-04-15 | 2000-12-04 | 日亜化学工業株式会社 | 面状光源及びそれを用いたディスプレイのバックライト、照光式操作スイッチ |
| JP4109756B2 (ja) * | 1998-07-07 | 2008-07-02 | スタンレー電気株式会社 | 発光ダイオード |
| DE19845229C1 (de) | 1998-10-01 | 2000-03-09 | Wustlich Daniel | Mit Weißlicht arbeitende Hintergrundbeleuchtung |
| US6271631B1 (en) | 1998-10-15 | 2001-08-07 | E.L. Specialists, Inc. | Alerting system using elastomeric EL lamp structure |
| GB2373368B (en) * | 2001-03-12 | 2004-10-27 | Arima Optoelectronics Corp | Light emitting devices |
| JP2003110146A (ja) * | 2001-07-26 | 2003-04-11 | Matsushita Electric Works Ltd | 発光装置 |
| JP2003191521A (ja) | 2001-12-26 | 2003-07-09 | Kyocera Corp | 光プリンタヘッドの組立方法 |
| AU2003268980A1 (en) * | 2002-05-22 | 2003-12-02 | Applied Optotech Limited | Led array |
| JP4401681B2 (ja) * | 2003-05-19 | 2010-01-20 | 日東樹脂工業株式会社 | 光拡散体及びそれを用いた光学部材乃至光学デバイス |
| US7250715B2 (en) * | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
| JP4360945B2 (ja) | 2004-03-10 | 2009-11-11 | シチズン電子株式会社 | 照明装置 |
| JP3983793B2 (ja) * | 2004-04-19 | 2007-09-26 | 松下電器産業株式会社 | Led照明光源の製造方法およびled照明光源 |
| JP4667803B2 (ja) * | 2004-09-14 | 2011-04-13 | 日亜化学工業株式会社 | 発光装置 |
| JP2006140362A (ja) * | 2004-11-15 | 2006-06-01 | Nitto Denko Corp | 光半導体素子封止用シートおよび該シートを用いた光半導体装置の製造方法 |
| US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
| JP2006162846A (ja) | 2004-12-06 | 2006-06-22 | Asahi Glass Co Ltd | 直下型バックライト用拡散板 |
| US20060138938A1 (en) * | 2004-12-27 | 2006-06-29 | Tan Kheng L | White LED utilizing organic dyes |
| US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
| US7879258B2 (en) * | 2005-03-14 | 2011-02-01 | Koninklijke Philips Electronics N.V. | Phosphor in polycrystalline ceramic structure and a light-emitting element comprising same |
| KR100593933B1 (ko) | 2005-03-18 | 2006-06-30 | 삼성전기주식회사 | 산란 영역을 갖는 측면 방출형 발광다이오드 패키지 및이를 포함하는 백라이트 장치 |
| US7358543B2 (en) | 2005-05-27 | 2008-04-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device |
| JP2007067204A (ja) * | 2005-08-31 | 2007-03-15 | Toshiba Lighting & Technology Corp | 発光ダイオード装置 |
| TWM289865U (en) * | 2005-11-08 | 2006-04-21 | Lighthouse Technology Co Ltd | Sectional light emitting diode backlight unit |
| JP4969119B2 (ja) * | 2006-03-20 | 2012-07-04 | 日本碍子株式会社 | 発光ダイオード装置 |
| DE102006024165A1 (de) * | 2006-05-23 | 2007-11-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Optoelektronischer Halbleiterchip mit einem Wellenlängenkonversionsstoff sowie optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip und Verfahren zur Herstellung des optoelektronischen Halbleiterchips |
| CN101467266A (zh) | 2006-06-08 | 2009-06-24 | 皇家飞利浦电子股份有限公司 | 发光器件 |
| DE102007021009A1 (de) * | 2006-09-27 | 2008-04-10 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung und Verfahren zur Herstellung einer solchen |
| DE102006051746A1 (de) | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit einer Lumineszenzkonversionsschicht |
| TWI338380B (en) * | 2006-10-11 | 2011-03-01 | Chuan Yu Hung | Light emitting diode incorporating high refractive index material |
| JP5392978B2 (ja) | 2006-10-30 | 2014-01-22 | 住友ベークライト株式会社 | 樹脂組成物および該樹脂組成物を用いて作製した半導体パッケージ |
| US20080121911A1 (en) * | 2006-11-28 | 2008-05-29 | Cree, Inc. | Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same |
| US7902560B2 (en) | 2006-12-15 | 2011-03-08 | Koninklijke Philips Electronics N.V. | Tunable white point light source using a wavelength converting element |
| CN201137827Y (zh) * | 2006-12-29 | 2008-10-22 | 东莞市科锐德数码光电科技有限公司 | 高光量led日光灯 |
| US9159888B2 (en) | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
| US20080179618A1 (en) * | 2007-01-26 | 2008-07-31 | Ching-Tai Cheng | Ceramic led package |
| JP5158472B2 (ja) | 2007-05-24 | 2013-03-06 | スタンレー電気株式会社 | 半導体発光装置 |
| US8177382B2 (en) * | 2008-03-11 | 2012-05-15 | Cree, Inc. | Apparatus and methods for multiplanar optical diffusers and display panels for using the same |
| DE102008054029A1 (de) * | 2008-10-30 | 2010-05-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
-
2009
- 2009-01-23 DE DE102009005907A patent/DE102009005907A1/de not_active Withdrawn
- 2009-12-23 KR KR1020117019381A patent/KR101647866B1/ko active Active
- 2009-12-23 JP JP2011546655A patent/JP5954991B2/ja active Active
- 2009-12-23 WO PCT/EP2009/067888 patent/WO2010083929A1/de not_active Ceased
- 2009-12-23 EP EP09798937.0A patent/EP2382673B1/de active Active
- 2009-12-23 CN CN200980155142.2A patent/CN102292836B/zh active Active
- 2009-12-23 US US13/146,124 patent/US8916886B2/en active Active
-
2010
- 2010-01-21 TW TW099101615A patent/TWI420647B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20120161162A1 (en) | 2012-06-28 |
| EP2382673A1 (de) | 2011-11-02 |
| US8916886B2 (en) | 2014-12-23 |
| JP2012516044A (ja) | 2012-07-12 |
| CN102292836B (zh) | 2016-05-25 |
| KR20110107384A (ko) | 2011-09-30 |
| EP2382673B1 (de) | 2019-01-30 |
| WO2010083929A1 (de) | 2010-07-29 |
| CN102292836A (zh) | 2011-12-21 |
| DE102009005907A1 (de) | 2010-07-29 |
| TW201044549A (en) | 2010-12-16 |
| KR101647866B1 (ko) | 2016-08-11 |
| TWI420647B (zh) | 2013-12-21 |
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