TWI420647B - 光電半導體裝置 - Google Patents

光電半導體裝置 Download PDF

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Publication number
TWI420647B
TWI420647B TW099101615A TW99101615A TWI420647B TW I420647 B TWI420647 B TW I420647B TW 099101615 A TW099101615 A TW 099101615A TW 99101615 A TW99101615 A TW 99101615A TW I420647 B TWI420647 B TW I420647B
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TW
Taiwan
Prior art keywords
scattering
semiconductor wafer
semiconductor device
light
conversion element
Prior art date
Application number
TW099101615A
Other languages
English (en)
Chinese (zh)
Other versions
TW201044549A (en
Inventor
摩利茲 恩格
約阿欣 瑞爾
約克艾瑞克 索格
湯瑪斯 塞勒
Original Assignee
歐斯朗奧托半導體股份有限公司
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Publication date
Application filed by 歐斯朗奧托半導體股份有限公司 filed Critical 歐斯朗奧托半導體股份有限公司
Publication of TW201044549A publication Critical patent/TW201044549A/zh
Application granted granted Critical
Publication of TWI420647B publication Critical patent/TWI420647B/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
TW099101615A 2009-01-23 2010-01-21 光電半導體裝置 TWI420647B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009005907A DE102009005907A1 (de) 2009-01-23 2009-01-23 Optoelektronisches Halbleiterbauteil

Publications (2)

Publication Number Publication Date
TW201044549A TW201044549A (en) 2010-12-16
TWI420647B true TWI420647B (zh) 2013-12-21

Family

ID=41862160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099101615A TWI420647B (zh) 2009-01-23 2010-01-21 光電半導體裝置

Country Status (8)

Country Link
US (1) US8916886B2 (enExample)
EP (1) EP2382673B1 (enExample)
JP (1) JP5954991B2 (enExample)
KR (1) KR101647866B1 (enExample)
CN (1) CN102292836B (enExample)
DE (1) DE102009005907A1 (enExample)
TW (1) TWI420647B (enExample)
WO (1) WO2010083929A1 (enExample)

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DE102011050450A1 (de) * 2011-05-18 2012-11-22 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE102011087614A1 (de) * 2011-12-02 2013-06-06 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung
DE102012200973A1 (de) * 2012-01-24 2013-07-25 Osram Opto Semiconductors Gmbh Leuchte und verfahren zur herstellung einer leuchte
DE102012101892B4 (de) 2012-03-06 2021-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Wellenlängenkonversionselement, Licht emittierendes Halbleiterbauelement und Anzeigevorrichtung damit sowie Verfahren zur Herstellung eines Wellenlängenkonversionselements
DE102012206970A1 (de) * 2012-04-26 2013-10-31 Osram Gmbh Optische vorrichtung und beleuchtungseinrichtung
JP5960565B2 (ja) * 2012-09-28 2016-08-02 スタンレー電気株式会社 自動車ヘッドランプ用発光装置及びその製造方法
JP6093611B2 (ja) * 2013-03-18 2017-03-08 スタンレー電気株式会社 発光装置及びその製造方法
DE102013207460A1 (de) * 2013-04-24 2014-10-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE102013214877A1 (de) 2013-07-30 2015-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Abdeckelements und eines optoelektronischen Bauelements, Abdeckelement und optoelektronisches Bauelement
DE102013214896B4 (de) * 2013-07-30 2021-09-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines Konverterelements und eines optoelektronischen Bauelements, Konverterelement und optoelektronisches Bauelement
CN105453282B (zh) * 2013-08-20 2020-12-15 亮锐控股有限公司 减少重复反射的成形磷光体
JP6079544B2 (ja) * 2013-10-07 2017-02-15 豊田合成株式会社 発光装置および発光装置の製造方法
WO2015077357A1 (en) * 2013-11-22 2015-05-28 Nitto Denko Corporation Light extraction element
DE102014102828A1 (de) * 2014-03-04 2015-09-10 Osram Opto Semiconductors Gmbh Anordnung mit einer lichtemittierenden Diode
EP3189550B8 (en) * 2014-09-02 2018-08-29 Lumileds Holding B.V. Light source
DE102014112883A1 (de) 2014-09-08 2016-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
DE102014112973A1 (de) * 2014-09-09 2016-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
JP6552190B2 (ja) * 2014-12-11 2019-07-31 シチズン電子株式会社 発光装置及び発光装置の製造方法
DE102015105474A1 (de) * 2015-04-10 2016-10-13 Osram Opto Semiconductors Gmbh Konverterbauteil für eine optoelektronische Leuchtvorrichtung
DE102015106865A1 (de) * 2015-05-04 2016-11-10 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Konverterbauteils
JP6217705B2 (ja) 2015-07-28 2017-10-25 日亜化学工業株式会社 発光装置及びその製造方法
JP2017224867A (ja) * 2017-09-28 2017-12-21 日亜化学工業株式会社 発光装置及びその製造方法
JP7083647B2 (ja) * 2018-01-16 2022-06-13 スタンレー電気株式会社 発光装置
US11680696B2 (en) 2019-12-13 2023-06-20 Lumileds Llc Segmented LED arrays with diffusing elements
US11489005B2 (en) 2019-12-13 2022-11-01 Lumileds Llc Segmented LED arrays with diffusing elements
JP7531090B2 (ja) * 2022-04-28 2024-08-09 日亜化学工業株式会社 発光装置及び発光モジュール

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Also Published As

Publication number Publication date
DE102009005907A1 (de) 2010-07-29
KR101647866B1 (ko) 2016-08-11
EP2382673B1 (de) 2019-01-30
TW201044549A (en) 2010-12-16
CN102292836A (zh) 2011-12-21
JP5954991B2 (ja) 2016-07-20
KR20110107384A (ko) 2011-09-30
JP2012516044A (ja) 2012-07-12
EP2382673A1 (de) 2011-11-02
WO2010083929A1 (de) 2010-07-29
CN102292836B (zh) 2016-05-25
US20120161162A1 (en) 2012-06-28
US8916886B2 (en) 2014-12-23

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