JP5915610B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP5915610B2
JP5915610B2 JP2013193389A JP2013193389A JP5915610B2 JP 5915610 B2 JP5915610 B2 JP 5915610B2 JP 2013193389 A JP2013193389 A JP 2013193389A JP 2013193389 A JP2013193389 A JP 2013193389A JP 5915610 B2 JP5915610 B2 JP 5915610B2
Authority
JP
Japan
Prior art keywords
group
resin composition
substituent
epoxy resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013193389A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015059170A (ja
JP2015059170A5 (enrdf_load_stackoverflow
Inventor
真俊 渡邊
真俊 渡邊
嘉生 西村
嘉生 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2013193389A priority Critical patent/JP5915610B2/ja
Priority to TW103127760A priority patent/TWI635129B/zh
Priority to CN201410467165.XA priority patent/CN104448700B/zh
Priority to KR1020140122846A priority patent/KR102238854B1/ko
Publication of JP2015059170A publication Critical patent/JP2015059170A/ja
Publication of JP2015059170A5 publication Critical patent/JP2015059170A5/ja
Application granted granted Critical
Publication of JP5915610B2 publication Critical patent/JP5915610B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2013193389A 2013-09-18 2013-09-18 樹脂組成物 Active JP5915610B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013193389A JP5915610B2 (ja) 2013-09-18 2013-09-18 樹脂組成物
TW103127760A TWI635129B (zh) 2013-09-18 2014-08-13 Resin composition, sheet-like laminate, cured product, multilayer printed wiring board, and semiconductor device
CN201410467165.XA CN104448700B (zh) 2013-09-18 2014-09-15 树脂组合物
KR1020140122846A KR102238854B1 (ko) 2013-09-18 2014-09-16 수지 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013193389A JP5915610B2 (ja) 2013-09-18 2013-09-18 樹脂組成物

Publications (3)

Publication Number Publication Date
JP2015059170A JP2015059170A (ja) 2015-03-30
JP2015059170A5 JP2015059170A5 (enrdf_load_stackoverflow) 2015-07-30
JP5915610B2 true JP5915610B2 (ja) 2016-05-11

Family

ID=52816962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013193389A Active JP5915610B2 (ja) 2013-09-18 2013-09-18 樹脂組成物

Country Status (4)

Country Link
JP (1) JP5915610B2 (enrdf_load_stackoverflow)
KR (1) KR102238854B1 (enrdf_load_stackoverflow)
CN (1) CN104448700B (enrdf_load_stackoverflow)
TW (1) TWI635129B (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6558055B2 (ja) * 2015-04-30 2019-08-14 味の素株式会社 樹脂組成物
JP6950732B2 (ja) * 2015-08-07 2021-10-13 味の素株式会社 樹脂組成物
JP6610928B2 (ja) * 2015-08-13 2019-11-27 味の素株式会社 熱硬化性樹脂組成物
JP6750202B2 (ja) * 2015-10-14 2020-09-02 味の素株式会社 樹脂組成物、接着フィルムおよびコアレス基板の製造方法
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
JP6787210B2 (ja) * 2017-03-23 2020-11-18 味の素株式会社 樹脂組成物
JP7258453B2 (ja) * 2017-03-31 2023-04-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP6676593B2 (ja) * 2017-09-08 2020-04-08 リンテック株式会社 樹脂シートおよび半導体装置
JP7328240B2 (ja) * 2018-09-21 2023-08-16 サンアプロ株式会社 エポキシ樹脂組成物
JP2020094089A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN109608828B (zh) * 2018-12-20 2020-10-27 广东生益科技股份有限公司 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板
CN109810467B (zh) * 2019-01-25 2021-12-28 苏州生益科技有限公司 一种热固性树脂组合物及应用其制备的半固化片和层压板
JP2020143245A (ja) * 2019-03-08 2020-09-10 太陽ホールディングス株式会社 熱硬化性エポキシ樹脂組成物
KR102584266B1 (ko) * 2019-05-10 2023-10-05 주식회사 엘지화학 반도체 회로 접속용 접착제 조성물, 이를 이용한 반도체용 접착 필름, 반도체 패키지 제조방법 및 반도체 패키지

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900003809A (ko) * 1988-08-11 1990-03-27 안시환 전자 올겐의 데몬 발생 장치 및 방법
JP3343443B2 (ja) * 1994-07-04 2002-11-11 松下電器産業株式会社 樹脂組成物およびプリプレグ
KR101211604B1 (ko) * 2006-10-31 2012-12-12 주식회사 엘지화학 표면 개질 아민계 경화제, 이를 이용한 마스킹형 경화제 및일액형 에폭시 수지 조성물
JP2008189824A (ja) * 2007-02-06 2008-08-21 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物および半導体装置
JP4782870B2 (ja) * 2008-07-31 2011-09-28 積水化学工業株式会社 硬化体、シート状成形体、積層板及び多層積層板
US20110217512A1 (en) * 2008-09-01 2011-09-08 Sekisui Chemical Co., Ltd. Laminated body and method for producing laminated body
JP5550875B2 (ja) * 2009-09-25 2014-07-16 パナソニック株式会社 液状熱硬化性樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP5340203B2 (ja) 2010-02-26 2013-11-13 積水化学工業株式会社 成形体
KR101301688B1 (ko) 2011-09-08 2013-08-29 (주) 에듀트리즈 원격 교육 시스템 및 그 관리 방법

Also Published As

Publication number Publication date
JP2015059170A (ja) 2015-03-30
KR102238854B1 (ko) 2021-04-12
KR20150032485A (ko) 2015-03-26
CN104448700A (zh) 2015-03-25
CN104448700B (zh) 2019-01-22
TW201527399A (zh) 2015-07-16
TWI635129B (zh) 2018-09-11

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