JP2015059170A5 - - Google Patents

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Publication number
JP2015059170A5
JP2015059170A5 JP2013193389A JP2013193389A JP2015059170A5 JP 2015059170 A5 JP2015059170 A5 JP 2015059170A5 JP 2013193389 A JP2013193389 A JP 2013193389A JP 2013193389 A JP2013193389 A JP 2013193389A JP 2015059170 A5 JP2015059170 A5 JP 2015059170A5
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JP
Japan
Prior art keywords
group
resin composition
component
composition according
resin
Prior art date
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Application number
JP2013193389A
Other languages
English (en)
Japanese (ja)
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JP2015059170A (ja
JP5915610B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2013193389A priority Critical patent/JP5915610B2/ja
Priority claimed from JP2013193389A external-priority patent/JP5915610B2/ja
Priority to TW103127760A priority patent/TWI635129B/zh
Priority to CN201410467165.XA priority patent/CN104448700B/zh
Priority to KR1020140122846A priority patent/KR102238854B1/ko
Publication of JP2015059170A publication Critical patent/JP2015059170A/ja
Publication of JP2015059170A5 publication Critical patent/JP2015059170A5/ja
Application granted granted Critical
Publication of JP5915610B2 publication Critical patent/JP5915610B2/ja
Active legal-status Critical Current
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JP2013193389A 2013-09-18 2013-09-18 樹脂組成物 Active JP5915610B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013193389A JP5915610B2 (ja) 2013-09-18 2013-09-18 樹脂組成物
TW103127760A TWI635129B (zh) 2013-09-18 2014-08-13 Resin composition, sheet-like laminate, cured product, multilayer printed wiring board, and semiconductor device
CN201410467165.XA CN104448700B (zh) 2013-09-18 2014-09-15 树脂组合物
KR1020140122846A KR102238854B1 (ko) 2013-09-18 2014-09-16 수지 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013193389A JP5915610B2 (ja) 2013-09-18 2013-09-18 樹脂組成物

Publications (3)

Publication Number Publication Date
JP2015059170A JP2015059170A (ja) 2015-03-30
JP2015059170A5 true JP2015059170A5 (enrdf_load_stackoverflow) 2015-07-30
JP5915610B2 JP5915610B2 (ja) 2016-05-11

Family

ID=52816962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013193389A Active JP5915610B2 (ja) 2013-09-18 2013-09-18 樹脂組成物

Country Status (4)

Country Link
JP (1) JP5915610B2 (enrdf_load_stackoverflow)
KR (1) KR102238854B1 (enrdf_load_stackoverflow)
CN (1) CN104448700B (enrdf_load_stackoverflow)
TW (1) TWI635129B (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6558055B2 (ja) * 2015-04-30 2019-08-14 味の素株式会社 樹脂組成物
JP6950732B2 (ja) * 2015-08-07 2021-10-13 味の素株式会社 樹脂組成物
JP6610928B2 (ja) * 2015-08-13 2019-11-27 味の素株式会社 熱硬化性樹脂組成物
JP6750202B2 (ja) * 2015-10-14 2020-09-02 味の素株式会社 樹脂組成物、接着フィルムおよびコアレス基板の製造方法
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
JP6787210B2 (ja) * 2017-03-23 2020-11-18 味の素株式会社 樹脂組成物
JP7258453B2 (ja) * 2017-03-31 2023-04-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP6676593B2 (ja) * 2017-09-08 2020-04-08 リンテック株式会社 樹脂シートおよび半導体装置
JP7328240B2 (ja) * 2018-09-21 2023-08-16 サンアプロ株式会社 エポキシ樹脂組成物
JP2020094089A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN109608828B (zh) * 2018-12-20 2020-10-27 广东生益科技股份有限公司 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板
CN109810467B (zh) * 2019-01-25 2021-12-28 苏州生益科技有限公司 一种热固性树脂组合物及应用其制备的半固化片和层压板
JP2020143245A (ja) * 2019-03-08 2020-09-10 太陽ホールディングス株式会社 熱硬化性エポキシ樹脂組成物
KR102584266B1 (ko) * 2019-05-10 2023-10-05 주식회사 엘지화학 반도체 회로 접속용 접착제 조성물, 이를 이용한 반도체용 접착 필름, 반도체 패키지 제조방법 및 반도체 패키지

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900003809A (ko) * 1988-08-11 1990-03-27 안시환 전자 올겐의 데몬 발생 장치 및 방법
JP3343443B2 (ja) * 1994-07-04 2002-11-11 松下電器産業株式会社 樹脂組成物およびプリプレグ
KR101211604B1 (ko) * 2006-10-31 2012-12-12 주식회사 엘지화학 표면 개질 아민계 경화제, 이를 이용한 마스킹형 경화제 및일액형 에폭시 수지 조성물
JP2008189824A (ja) * 2007-02-06 2008-08-21 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物および半導体装置
JP4782870B2 (ja) * 2008-07-31 2011-09-28 積水化学工業株式会社 硬化体、シート状成形体、積層板及び多層積層板
US20110217512A1 (en) * 2008-09-01 2011-09-08 Sekisui Chemical Co., Ltd. Laminated body and method for producing laminated body
JP5550875B2 (ja) * 2009-09-25 2014-07-16 パナソニック株式会社 液状熱硬化性樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP5340203B2 (ja) 2010-02-26 2013-11-13 積水化学工業株式会社 成形体
KR101301688B1 (ko) 2011-09-08 2013-08-29 (주) 에듀트리즈 원격 교육 시스템 및 그 관리 방법

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