KR102238854B1 - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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Publication number
KR102238854B1
KR102238854B1 KR1020140122846A KR20140122846A KR102238854B1 KR 102238854 B1 KR102238854 B1 KR 102238854B1 KR 1020140122846 A KR1020140122846 A KR 1020140122846A KR 20140122846 A KR20140122846 A KR 20140122846A KR 102238854 B1 KR102238854 B1 KR 102238854B1
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KR
South Korea
Prior art keywords
group
resin composition
substituent
component
epoxy resin
Prior art date
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KR1020140122846A
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English (en)
Korean (ko)
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KR20150032485A (ko
Inventor
마사토시 와타나베
요시오 니시무라
Original Assignee
아지노모토 가부시키가이샤
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Publication of KR20150032485A publication Critical patent/KR20150032485A/ko
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Publication of KR102238854B1 publication Critical patent/KR102238854B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020140122846A 2013-09-18 2014-09-16 수지 조성물 Active KR102238854B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-193389 2013-09-18
JP2013193389A JP5915610B2 (ja) 2013-09-18 2013-09-18 樹脂組成物

Publications (2)

Publication Number Publication Date
KR20150032485A KR20150032485A (ko) 2015-03-26
KR102238854B1 true KR102238854B1 (ko) 2021-04-12

Family

ID=52816962

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140122846A Active KR102238854B1 (ko) 2013-09-18 2014-09-16 수지 조성물

Country Status (4)

Country Link
JP (1) JP5915610B2 (enrdf_load_stackoverflow)
KR (1) KR102238854B1 (enrdf_load_stackoverflow)
CN (1) CN104448700B (enrdf_load_stackoverflow)
TW (1) TWI635129B (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6558055B2 (ja) * 2015-04-30 2019-08-14 味の素株式会社 樹脂組成物
JP6950732B2 (ja) * 2015-08-07 2021-10-13 味の素株式会社 樹脂組成物
JP6610928B2 (ja) * 2015-08-13 2019-11-27 味の素株式会社 熱硬化性樹脂組成物
JP6750202B2 (ja) * 2015-10-14 2020-09-02 味の素株式会社 樹脂組成物、接着フィルムおよびコアレス基板の製造方法
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
JP6787210B2 (ja) * 2017-03-23 2020-11-18 味の素株式会社 樹脂組成物
JP7258453B2 (ja) * 2017-03-31 2023-04-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP6676593B2 (ja) * 2017-09-08 2020-04-08 リンテック株式会社 樹脂シートおよび半導体装置
JP7328240B2 (ja) * 2018-09-21 2023-08-16 サンアプロ株式会社 エポキシ樹脂組成物
JP2020094089A (ja) * 2018-12-10 2020-06-18 積水化学工業株式会社 樹脂材料及び多層プリント配線板
CN109608828B (zh) * 2018-12-20 2020-10-27 广东生益科技股份有限公司 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板
CN109810467B (zh) * 2019-01-25 2021-12-28 苏州生益科技有限公司 一种热固性树脂组合物及应用其制备的半固化片和层压板
JP2020143245A (ja) * 2019-03-08 2020-09-10 太陽ホールディングス株式会社 熱硬化性エポキシ樹脂組成物
KR102584266B1 (ko) * 2019-05-10 2023-10-05 주식회사 엘지화학 반도체 회로 접속용 접착제 조성물, 이를 이용한 반도체용 접착 필름, 반도체 패키지 제조방법 및 반도체 패키지

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900003809A (ko) * 1988-08-11 1990-03-27 안시환 전자 올겐의 데몬 발생 장치 및 방법
JP3343443B2 (ja) * 1994-07-04 2002-11-11 松下電器産業株式会社 樹脂組成物およびプリプレグ
KR101211604B1 (ko) * 2006-10-31 2012-12-12 주식회사 엘지화학 표면 개질 아민계 경화제, 이를 이용한 마스킹형 경화제 및일액형 에폭시 수지 조성물
JP2008189824A (ja) * 2007-02-06 2008-08-21 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物および半導体装置
JP4782870B2 (ja) * 2008-07-31 2011-09-28 積水化学工業株式会社 硬化体、シート状成形体、積層板及び多層積層板
US20110217512A1 (en) * 2008-09-01 2011-09-08 Sekisui Chemical Co., Ltd. Laminated body and method for producing laminated body
JP5550875B2 (ja) * 2009-09-25 2014-07-16 パナソニック株式会社 液状熱硬化性樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP5340203B2 (ja) 2010-02-26 2013-11-13 積水化学工業株式会社 成形体
KR101301688B1 (ko) 2011-09-08 2013-08-29 (주) 에듀트리즈 원격 교육 시스템 및 그 관리 방법

Also Published As

Publication number Publication date
JP2015059170A (ja) 2015-03-30
KR20150032485A (ko) 2015-03-26
CN104448700A (zh) 2015-03-25
JP5915610B2 (ja) 2016-05-11
CN104448700B (zh) 2019-01-22
TW201527399A (zh) 2015-07-16
TWI635129B (zh) 2018-09-11

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