JP2015004010A5 - - Google Patents

Download PDF

Info

Publication number
JP2015004010A5
JP2015004010A5 JP2013130626A JP2013130626A JP2015004010A5 JP 2015004010 A5 JP2015004010 A5 JP 2015004010A5 JP 2013130626 A JP2013130626 A JP 2013130626A JP 2013130626 A JP2013130626 A JP 2013130626A JP 2015004010 A5 JP2015004010 A5 JP 2015004010A5
Authority
JP
Japan
Prior art keywords
resin composition
curable resin
component
mass
epoxy resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013130626A
Other languages
English (en)
Japanese (ja)
Other versions
JP6195219B2 (ja
JP2015004010A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013130626A priority Critical patent/JP6195219B2/ja
Priority claimed from JP2013130626A external-priority patent/JP6195219B2/ja
Publication of JP2015004010A publication Critical patent/JP2015004010A/ja
Publication of JP2015004010A5 publication Critical patent/JP2015004010A5/ja
Application granted granted Critical
Publication of JP6195219B2 publication Critical patent/JP6195219B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013130626A 2013-06-21 2013-06-21 硬化性樹脂組成物 Active JP6195219B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013130626A JP6195219B2 (ja) 2013-06-21 2013-06-21 硬化性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013130626A JP6195219B2 (ja) 2013-06-21 2013-06-21 硬化性樹脂組成物

Publications (3)

Publication Number Publication Date
JP2015004010A JP2015004010A (ja) 2015-01-08
JP2015004010A5 true JP2015004010A5 (enrdf_load_stackoverflow) 2016-09-01
JP6195219B2 JP6195219B2 (ja) 2017-09-13

Family

ID=52300166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013130626A Active JP6195219B2 (ja) 2013-06-21 2013-06-21 硬化性樹脂組成物

Country Status (1)

Country Link
JP (1) JP6195219B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6672630B2 (ja) * 2015-08-07 2020-03-25 味の素株式会社 樹脂組成物
CN112771094A (zh) * 2018-09-27 2021-05-07 昭和电工材料株式会社 密封用树脂组合物、电子部件装置及电子部件装置的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4836134B2 (ja) * 2005-11-04 2011-12-14 独立行政法人産業技術総合研究所 新規リン含有アルカジエン重合体及びその製造方法
JP4993031B2 (ja) * 2011-10-11 2012-08-08 住友ベークライト株式会社 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁シート、多層プリント配線板及び半導体装置

Similar Documents

Publication Publication Date Title
JP2007277525A5 (ja) 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート、電子部品
JP6297260B2 (ja) 軟磁性熱硬化性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2015059170A5 (enrdf_load_stackoverflow)
JP2017222881A5 (enrdf_load_stackoverflow)
JP2014019799A5 (enrdf_load_stackoverflow)
MX357441B (es) Material de revestimiento conductor para estructuras compuestas.
WO2013032238A3 (en) Epoxy resin compound and radiant heat circuit board using the same
JP2015004009A5 (enrdf_load_stackoverflow)
JP2009280823A5 (enrdf_load_stackoverflow)
MY155358A (en) Resin compound for forming adhesive layer of multilayered flexible printed wiring board
PH12020500254A1 (en) Copper foil with carrier,method of producing same, copper foil with carrier for printed wiring board, and printed wiring board
JP2010248473A5 (enrdf_load_stackoverflow)
IN2014CN04162A (enrdf_load_stackoverflow)
TW201613991A (en) Dry film, cured product and printed wiring board
JP2014111773A5 (enrdf_load_stackoverflow)
JP2014005464A5 (enrdf_load_stackoverflow)
MY161045A (en) Resin composition for forming adhesive layer of multilayer flexible printed wiring board, resin varnish, resin coated copper foil, method for manufacturing resin coated copper foil for manufacturing multilayer flexible printed wiring board, and multilayer flexible printed wiring board
JP2014240499A5 (enrdf_load_stackoverflow)
WO2012091320A3 (en) Epoxy resin compound and radiant heat circuit board using the same
JP2013083960A5 (enrdf_load_stackoverflow)
WO2012044029A3 (ko) 성형성이 우수한 에폭시수지를 포함한 적층체 및 그 제조방법
JP2017220543A5 (enrdf_load_stackoverflow)
JP2007262126A5 (enrdf_load_stackoverflow)
JP2014037544A5 (enrdf_load_stackoverflow)
WO2019160287A8 (ko) 반도체 패키지용 열경화성 수지 조성물 및 이를 이용한 프리프레그