JP2014240499A5 - - Google Patents

Download PDF

Info

Publication number
JP2014240499A5
JP2014240499A5 JP2014188223A JP2014188223A JP2014240499A5 JP 2014240499 A5 JP2014240499 A5 JP 2014240499A5 JP 2014188223 A JP2014188223 A JP 2014188223A JP 2014188223 A JP2014188223 A JP 2014188223A JP 2014240499 A5 JP2014240499 A5 JP 2014240499A5
Authority
JP
Japan
Prior art keywords
resin composition
liquid resin
electronic component
electronic components
furthermore
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014188223A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014240499A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014188223A priority Critical patent/JP2014240499A/ja
Priority claimed from JP2014188223A external-priority patent/JP2014240499A/ja
Publication of JP2014240499A publication Critical patent/JP2014240499A/ja
Publication of JP2014240499A5 publication Critical patent/JP2014240499A5/ja
Pending legal-status Critical Current

Links

JP2014188223A 2009-03-31 2014-09-16 電子部品用液状樹脂組成物及び電子部品装置 Pending JP2014240499A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014188223A JP2014240499A (ja) 2009-03-31 2014-09-16 電子部品用液状樹脂組成物及び電子部品装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009085509 2009-03-31
JP2009085509 2009-03-31
JP2014188223A JP2014240499A (ja) 2009-03-31 2014-09-16 電子部品用液状樹脂組成物及び電子部品装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013087660A Division JP2013147666A (ja) 2009-03-31 2013-04-18 電子部品用液状樹脂組成物及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016000194A Division JP6386483B2 (ja) 2009-03-31 2016-01-04 電子部品用液状樹脂組成物及び電子部品装置

Publications (2)

Publication Number Publication Date
JP2014240499A JP2014240499A (ja) 2014-12-25
JP2014240499A5 true JP2014240499A5 (enrdf_load_stackoverflow) 2015-04-30

Family

ID=43316226

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2009254889A Active JP5556133B2 (ja) 2009-03-31 2009-11-06 電子部品用液状樹脂組成物及び電子部品装置
JP2013087660A Pending JP2013147666A (ja) 2009-03-31 2013-04-18 電子部品用液状樹脂組成物及び電子部品装置
JP2014188223A Pending JP2014240499A (ja) 2009-03-31 2014-09-16 電子部品用液状樹脂組成物及び電子部品装置
JP2016000194A Active JP6386483B2 (ja) 2009-03-31 2016-01-04 電子部品用液状樹脂組成物及び電子部品装置
JP2017113039A Active JP6610616B2 (ja) 2009-03-31 2017-06-07 電子部品用液状樹脂組成物及び電子部品装置

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP2009254889A Active JP5556133B2 (ja) 2009-03-31 2009-11-06 電子部品用液状樹脂組成物及び電子部品装置
JP2013087660A Pending JP2013147666A (ja) 2009-03-31 2013-04-18 電子部品用液状樹脂組成物及び電子部品装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2016000194A Active JP6386483B2 (ja) 2009-03-31 2016-01-04 電子部品用液状樹脂組成物及び電子部品装置
JP2017113039A Active JP6610616B2 (ja) 2009-03-31 2017-06-07 電子部品用液状樹脂組成物及び電子部品装置

Country Status (3)

Country Link
JP (5) JP5556133B2 (enrdf_load_stackoverflow)
CN (2) CN104629262B (enrdf_load_stackoverflow)
TW (3) TWI480307B (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4965715B1 (ja) * 2011-02-03 2012-07-04 ナミックス株式会社 エポキシ樹脂組成物およびそれを用いた半導体封止材
JP4906152B1 (ja) * 2011-03-15 2012-03-28 ナミックス株式会社 液状樹脂組成物
CN105315618B (zh) * 2011-12-27 2018-05-29 日立化成工业株式会社 电子部件用液状树脂组合物及其制造方法、以及电子部件装置
CN103102858A (zh) * 2013-01-29 2013-05-15 深圳市宝力科技有限公司 Cob液态环氧树脂封装料及其制备方法
JP6098470B2 (ja) * 2013-10-21 2017-03-22 信越化学工業株式会社 スクリーン印刷用導電性エポキシ樹脂組成物、それを用いたダイアタッチ方法および該組成物の硬化物を有する半導体装置
CN104479291A (zh) * 2014-12-04 2015-04-01 中国科学院过程工程研究所 一种导热绝缘环氧树脂组合物、制备方法及其用途
JP6916997B2 (ja) * 2016-03-17 2021-08-11 富士電機株式会社 半導体装置
MY188479A (en) * 2016-05-11 2021-12-13 Hitachi Chemical Co Ltd Liquid resin composition for sealing and electronic component device
JP7455017B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP2018088306A (ja) * 2016-11-28 2018-06-07 富士フイルム株式会社 固体電解質組成物、固体電解質含有シートおよび全固体二次電池、ならびに、固体電解質含有シートおよび全固体二次電池の製造方法
JP6829462B2 (ja) 2017-02-21 2021-02-10 ナミックス株式会社 液状エポキシ樹脂封止材
WO2019065950A1 (ja) * 2017-09-29 2019-04-04 パナソニックＩｐマネジメント株式会社 蓄電デバイス
CA3084127A1 (fr) * 2017-12-21 2019-06-27 Compagnie Generale Des Etablissements Michelin Composition de caoutchouc reticulee par un diacide et comprenant un compose phenolique
JP7404620B2 (ja) * 2018-10-25 2023-12-26 株式会社レゾナック 液状樹脂組成物並びに電子部品装置及びその製造方法
JP7440626B2 (ja) * 2020-05-15 2024-02-28 富士フイルム株式会社 硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス、化合物
KR20240137592A (ko) * 2022-02-03 2024-09-20 아지노모토 가부시키가이샤 수지 조성물

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066622B2 (ja) * 1986-08-13 1994-01-26 新日本理化株式会社 液状エポキシ樹脂組成物
JPH03152151A (ja) * 1989-11-08 1991-06-28 Daicel Chem Ind Ltd エポキシ樹脂組成物
JP3017888B2 (ja) * 1992-09-09 2000-03-13 日東電工株式会社 半導体装置
US5919844A (en) * 1995-12-28 1999-07-06 Toray Industries, Inc. Epoxy resin composition
JPH10279779A (ja) * 1997-04-07 1998-10-20 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物及び該組成物を用いたプリプレグ、金属張り積層板
JP4656269B2 (ja) * 2000-09-22 2011-03-23 信越化学工業株式会社 液状エポキシ樹脂組成物及び半導体装置
JP3905363B2 (ja) * 2001-06-28 2007-04-18 ハリマ化成株式会社 封止充填剤用液状エポキシ樹脂組成物
JP3973138B2 (ja) * 2002-01-21 2007-09-12 住友ベークライト株式会社 光半導体封止用エポキシ樹脂組成物及び光半導体装置
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
JP2007016087A (ja) * 2005-07-06 2007-01-25 Kyocera Chemical Corp 光半導体封止用樹脂組成物および光半導体装置
JP2007162001A (ja) * 2005-11-21 2007-06-28 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物
CN102850721A (zh) * 2005-11-25 2013-01-02 日立化成工业株式会社 电子零件用液状树脂组合物及电子零件装置
JP2007182493A (ja) * 2006-01-06 2007-07-19 Sekisui Chem Co Ltd 絶縁材料用硬化性組成物、絶縁材料、及び電子部品装置の製造方法及び電子部品装置
JP2007297601A (ja) * 2006-04-06 2007-11-15 Hitachi Chem Co Ltd 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置
JP2007308683A (ja) * 2006-04-17 2007-11-29 Hitachi Chem Co Ltd エポキシ樹脂硬化剤、エポキシ樹脂組成物、エポキシ樹脂硬化物及びそれを用いた光学部材
JPWO2008108326A1 (ja) * 2007-03-05 2010-06-17 積水化学工業株式会社 光半導体用熱硬化性組成物、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材、光半導体素子用封止剤及び光半導体素子
JP2008274083A (ja) * 2007-04-27 2008-11-13 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2008297373A (ja) * 2007-05-29 2008-12-11 Somar Corp 液状エポキシ樹脂組成物からなるアンダーフィル材及びフリップチップ型半導体装置
JP5351233B2 (ja) * 2011-10-14 2013-11-27 日野自動車株式会社 内燃機関の制御装置
JP6049518B2 (ja) * 2013-03-27 2016-12-21 オリンパス株式会社 画像処理装置、内視鏡装置、プログラム及び画像処理装置の作動方法

Similar Documents

Publication Publication Date Title
JP2014240499A5 (enrdf_load_stackoverflow)
PH12016501787A1 (en) Resin composition
BR112017006161A2 (pt) composição de dois componentes
MX2016015503A (es) Composicion adhesiva termicamente y electricamente conductiva.
MX2015011234A (es) Composiciones de recubrimiento de epoxi-siloxano.
BR112017013230A2 (pt) composição de resina epóxi
JP2017222881A5 (enrdf_load_stackoverflow)
BR112017012644A2 (pt) processo de fabricação para produzir um artigo moldado por infusão de resina líquida, composição curável, artigo moldado curado, e, uso de uma composição curável.
MY184315A (en) Liquid sealing material, and electronic component using same
BR112017020768A2 (pt) composição aditiva de resina e composição de resina termoplástica antiestática
SG10201403101WA (en) Resin Composition
BR112015009576A2 (pt) sistemas de resina de epóxi de cura rápida
BR112015032696A2 (pt) composição à base de resina epoxídica como carga para células em forma de colmeia
MY176228A (en) Epoxy resin composition, semiconductor sealing agent, and semiconductor device
MY161129A (en) Epoxy resin composition for sealing and electronic component device
JP2013506030A5 (enrdf_load_stackoverflow)
BR112018010312A2 (pt) adesivo estrutural com resistência à corrosão melhorada
WO2014133992A3 (en) Anhydride accelerators for epoxy resin systems
JP2014169450A5 (enrdf_load_stackoverflow)
JP2016094511A5 (enrdf_load_stackoverflow)
BR112016024139A2 (pt) método para a provisão de uma superfície metálica ou concreta de uma instalação química com um revestimento, instalação química, e composição de revestimento adequada para a provisão de uma superfície metálica ou concreta de uma instalação química com um revestimento
MY161086A (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
BR112015009388A2 (pt) composição de agente de cura, processo para preparar uma composição de agente de cura, composição curável, processo para preparar uma composição curável, processo para preparar um termofixo e artigo termofixo curado
JP2016204420A5 (enrdf_load_stackoverflow)
BR112017004797A2 (pt) película, processo para a fabricação de um laminado, e, laminado com uma camada de vidro frontal.