CN104629262B - 电子部件用液体状树脂组合物及电子部件装置 - Google Patents
电子部件用液体状树脂组合物及电子部件装置 Download PDFInfo
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- CN104629262B CN104629262B CN201510024373.7A CN201510024373A CN104629262B CN 104629262 B CN104629262 B CN 104629262B CN 201510024373 A CN201510024373 A CN 201510024373A CN 104629262 B CN104629262 B CN 104629262B
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- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
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- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
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| CN2010101563231A CN101851388B (zh) | 2009-03-31 | 2010-03-30 | 电子部件用液体状树脂组合物及电子部件装置 |
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| JP4965715B1 (ja) * | 2011-02-03 | 2012-07-04 | ナミックス株式会社 | エポキシ樹脂組成物およびそれを用いた半導体封止材 |
| JP4906152B1 (ja) * | 2011-03-15 | 2012-03-28 | ナミックス株式会社 | 液状樹脂組成物 |
| CN105315618B (zh) * | 2011-12-27 | 2018-05-29 | 日立化成工业株式会社 | 电子部件用液状树脂组合物及其制造方法、以及电子部件装置 |
| CN103102858A (zh) * | 2013-01-29 | 2013-05-15 | 深圳市宝力科技有限公司 | Cob液态环氧树脂封装料及其制备方法 |
| JP6098470B2 (ja) * | 2013-10-21 | 2017-03-22 | 信越化学工業株式会社 | スクリーン印刷用導電性エポキシ樹脂組成物、それを用いたダイアタッチ方法および該組成物の硬化物を有する半導体装置 |
| CN104479291A (zh) * | 2014-12-04 | 2015-04-01 | 中国科学院过程工程研究所 | 一种导热绝缘环氧树脂组合物、制备方法及其用途 |
| JP6916997B2 (ja) * | 2016-03-17 | 2021-08-11 | 富士電機株式会社 | 半導体装置 |
| MY188479A (en) * | 2016-05-11 | 2021-12-13 | Hitachi Chemical Co Ltd | Liquid resin composition for sealing and electronic component device |
| JP7455017B2 (ja) * | 2016-10-14 | 2024-03-25 | 株式会社レゾナック | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 |
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