WO2012044029A3 - 성형성이 우수한 에폭시수지를 포함한 적층체 및 그 제조방법 - Google Patents
성형성이 우수한 에폭시수지를 포함한 적층체 및 그 제조방법 Download PDFInfo
- Publication number
- WO2012044029A3 WO2012044029A3 PCT/KR2011/007080 KR2011007080W WO2012044029A3 WO 2012044029 A3 WO2012044029 A3 WO 2012044029A3 KR 2011007080 W KR2011007080 W KR 2011007080W WO 2012044029 A3 WO2012044029 A3 WO 2012044029A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laminate
- printed circuit
- circuit board
- metal base
- present
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 인쇄회로층, 절연층, 방열금속층으로 구성되는 금속 베이스 인쇄회로기판용 적층체에 관한 것으로, 절연층 수지조성물이 고당량에폭시와 저당량에폭시를 혼합사용되고 다량의 무기필러가 포함되어 벤딩성, 펀칭성, 접착강도 등 성형성이 우수할 뿐만 아니라 열전도율이 높고, 내전압 등 전기적 특성 또한 우수한 금속 베이스 인쇄회로기판용 적층체에 관한 것이다. 특히, 본 발명은 종합적인 성형성 테스트를 실시한 결과 금속 베이스 인쇄회로기판 성형성으로서 최적의 성능을 나타내는 것이다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180057196.2A CN103228437B (zh) | 2010-09-29 | 2011-09-27 | 含成型性良好的环氧树脂的层叠体及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0094151 | 2010-09-29 | ||
KR1020100094151A KR101116181B1 (ko) | 2010-09-29 | 2010-09-29 | 성형성이 우수한 에폭시수지를 포함한 적층체 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012044029A2 WO2012044029A2 (ko) | 2012-04-05 |
WO2012044029A3 true WO2012044029A3 (ko) | 2012-06-07 |
Family
ID=45893627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/007080 WO2012044029A2 (ko) | 2010-09-29 | 2011-09-27 | 성형성이 우수한 에폭시수지를 포함한 적층체 및 그 제조방법 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101116181B1 (ko) |
CN (1) | CN103228437B (ko) |
TW (1) | TWI454377B (ko) |
WO (1) | WO2012044029A2 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101477353B1 (ko) * | 2012-11-09 | 2014-12-29 | 주식회사 두산 | 수지 조성물 및 이를 포함하는 인쇄 회로 기판용 적층체 |
KR101377356B1 (ko) * | 2012-12-26 | 2014-03-25 | 주식회사 두산 | 접착성이 우수한 에폭시 수지 조성물 및 이를 이용한 수지 복합 동박 |
KR101377312B1 (ko) * | 2012-12-26 | 2014-03-25 | 주식회사 두산 | 접착성이 우수한 에폭시 수지 조성물 및 이를 이용한 수지 복합 동박 |
KR101506781B1 (ko) * | 2013-04-05 | 2015-03-27 | 주식회사 두산 | 동박 적층판용 수지 조성물, 이를 이용한 수지 부착 동박, 동박 적층판 및 그 제조방법 |
KR102056500B1 (ko) * | 2014-10-24 | 2019-12-16 | 주식회사 두산 | 커버레이용 금속박 적층체 및 커버레이 비포함 다층 연성 인쇄회로기판 |
KR20180001912A (ko) * | 2016-06-28 | 2018-01-05 | 주식회사 두산 | 프라이머 코팅-동박 및 동박 적층판 |
KR20190025538A (ko) * | 2016-07-07 | 2019-03-11 | 메이코 일렉트로닉스 컴파니 리미티드 | 입체 배선 기판, 입체 배선 기판의 제조 방법, 입체 배선 기판용 기재 |
CN107760241A (zh) * | 2017-10-27 | 2018-03-06 | 金安国纪科技(珠海)有限公司 | 一种胶粘剂、胶粘剂的制备方法、应用该胶粘剂制成的涂胶铜箔 |
CN110218414B (zh) * | 2019-05-09 | 2022-02-15 | 全球能源互联网研究院有限公司 | 一种环氧树脂组合物及其制备方法和应用 |
CN112373149A (zh) * | 2020-11-12 | 2021-02-19 | 西安航天三沃化学有限公司 | 一种可挠曲铝基板的制备方法 |
CN114025472B (zh) * | 2021-11-12 | 2022-12-16 | 百强电子(深圳)有限公司 | 高散热金属基印刷电路板及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05267808A (ja) * | 1992-03-18 | 1993-10-15 | Hitachi Chem Co Ltd | 金属ベース基板 |
JP2003268075A (ja) * | 2002-03-15 | 2003-09-25 | Meidensha Corp | 屋内外用絶縁高分子材料組成物 |
JP2009286889A (ja) * | 2008-05-29 | 2009-12-10 | Taiyo Ink Mfg Ltd | 熱硬化性樹脂組成物及びプリント配線板 |
JP2010087013A (ja) * | 2008-09-29 | 2010-04-15 | Kyocera Chemical Corp | 層間絶縁シート、ビルドアップ型多層基板および回路基板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100509889C (zh) * | 2006-10-31 | 2009-07-08 | 华东理工大学华昌聚合物有限公司 | 气干性环氧乙烯基酯树脂的合成工艺 |
KR101276590B1 (ko) * | 2009-03-26 | 2013-06-19 | 파나소닉 주식회사 | 에폭시 수지 조성물, 프리프레그, 수지 부착 금속박, 수지 시트, 적층판, 및 다층판 |
-
2010
- 2010-09-29 KR KR1020100094151A patent/KR101116181B1/ko active IP Right Grant
-
2011
- 2011-09-27 WO PCT/KR2011/007080 patent/WO2012044029A2/ko active Application Filing
- 2011-09-27 CN CN201180057196.2A patent/CN103228437B/zh active Active
- 2011-09-28 TW TW100135082A patent/TWI454377B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05267808A (ja) * | 1992-03-18 | 1993-10-15 | Hitachi Chem Co Ltd | 金属ベース基板 |
JP2003268075A (ja) * | 2002-03-15 | 2003-09-25 | Meidensha Corp | 屋内外用絶縁高分子材料組成物 |
JP2009286889A (ja) * | 2008-05-29 | 2009-12-10 | Taiyo Ink Mfg Ltd | 熱硬化性樹脂組成物及びプリント配線板 |
JP2010087013A (ja) * | 2008-09-29 | 2010-04-15 | Kyocera Chemical Corp | 層間絶縁シート、ビルドアップ型多層基板および回路基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2012044029A2 (ko) | 2012-04-05 |
TW201213113A (en) | 2012-04-01 |
KR101116181B1 (ko) | 2012-03-06 |
TWI454377B (zh) | 2014-10-01 |
CN103228437A (zh) | 2013-07-31 |
CN103228437B (zh) | 2015-09-16 |
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