WO2011040752A3 - Conductive polymer adhesive using nanofiber and method for preparing the same - Google Patents

Conductive polymer adhesive using nanofiber and method for preparing the same Download PDF

Info

Publication number
WO2011040752A3
WO2011040752A3 PCT/KR2010/006623 KR2010006623W WO2011040752A3 WO 2011040752 A3 WO2011040752 A3 WO 2011040752A3 KR 2010006623 W KR2010006623 W KR 2010006623W WO 2011040752 A3 WO2011040752 A3 WO 2011040752A3
Authority
WO
WIPO (PCT)
Prior art keywords
nanofiber
polymer resin
flow
adhesive
conductive
Prior art date
Application number
PCT/KR2010/006623
Other languages
French (fr)
Other versions
WO2011040752A2 (en
Inventor
Kyung Wook Paik
Chang Kyu Chung
Kyoung Lim Suk
Original Assignee
Korea Advanced Institute Of Science And Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090092623A external-priority patent/KR101115686B1/en
Priority claimed from KR1020100001674A external-priority patent/KR101146351B1/en
Priority claimed from KR1020100090520A external-priority patent/KR101160971B1/en
Application filed by Korea Advanced Institute Of Science And Technology filed Critical Korea Advanced Institute Of Science And Technology
Priority to JP2012532008A priority Critical patent/JP5496343B2/en
Publication of WO2011040752A2 publication Critical patent/WO2011040752A2/en
Publication of WO2011040752A3 publication Critical patent/WO2011040752A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Disclosed is an adhesive for electronic packaging component for selectively conducting electrical connection parts of the electronic components, wherein a non-conductive polymer nanofiber structure having an irregularly shaped net structure is included in one or two or more adhesive layer, and a space defined by the adjacent nanofiber structures includes a portion in which one or more conductive particle is distributed. The adhesive prevents the free flow of the conductive particles in the polymer resin by suppressing the flow of the polymer resin and the flow of the conductive particle and has excellent mechanical strength by having a composite structure of the polymer resin and the polymer nanofiber structure having a net structure.
PCT/KR2010/006623 2009-09-29 2010-09-29 Conductive polymer adhesive using nanofiber and method for preparing the same WO2011040752A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012532008A JP5496343B2 (en) 2009-09-29 2010-09-29 Conductive polymer adhesive using nanofiber and method for producing the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020090092623A KR101115686B1 (en) 2009-09-29 2009-09-29 Anisotropic Conductive Film
KR10-2009-0092623 2009-09-29
KR1020100001674A KR101146351B1 (en) 2010-01-08 2010-01-08 Fabrication Method of Adhesive Film for Electronic Packaging
KR10-2010-0001674 2010-01-08
KR10-2010-0090520 2010-09-15
KR1020100090520A KR101160971B1 (en) 2010-09-15 2010-09-15 Conductive polymer adhesive using nano-fiber

Publications (2)

Publication Number Publication Date
WO2011040752A2 WO2011040752A2 (en) 2011-04-07
WO2011040752A3 true WO2011040752A3 (en) 2011-09-29

Family

ID=43826782

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/006623 WO2011040752A2 (en) 2009-09-29 2010-09-29 Conductive polymer adhesive using nanofiber and method for preparing the same

Country Status (2)

Country Link
JP (1) JP5496343B2 (en)
WO (1) WO2011040752A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101460304B1 (en) * 2012-05-18 2014-11-21 주식회사 아모그린텍 Waterproof sound passing sheet, method for manufacturing the same and electronic device having the waterproof sound passing sheet
KR101460303B1 (en) * 2012-05-18 2014-11-14 주식회사 아모그린텍 Waterproof sound passing sheet, method for manufacturing the same and electronic device having the waterproof sound passing sheet
KR101511284B1 (en) * 2012-06-04 2015-04-10 주식회사 아모그린텍 A conductive pressure-sensitive adhesive tape and preparation method thereof
US20160059535A1 (en) * 2014-08-29 2016-03-03 Materion Corporation Conductive bond foils
JP6443839B2 (en) * 2015-03-25 2018-12-26 パナソニックＩｐマネジメント株式会社 Film material manufacturing method and manufacturing apparatus
KR102609199B1 (en) * 2015-09-25 2023-12-05 세키스이가가쿠 고교가부시키가이샤 Manufacturing method of bonded structure, conductive particles, conductive film, and bonded structure
CN106297967B (en) 2016-08-26 2018-01-16 京东方科技集团股份有限公司 Flexible conductive film and preparation method thereof, flexible touch screen and display panel
CN109628002B (en) * 2018-11-21 2020-06-02 武汉华星光电半导体显示技术有限公司 Anisotropic conductive adhesive tape and manufacturing method thereof
CN109536057B (en) * 2018-11-27 2021-08-31 深圳市南科康达科技有限公司 Polymer fiber/conductive particle composite material and preparation method and application thereof
TWI818191B (en) * 2020-08-18 2023-10-11 國立臺灣大學 Modified cellulose nanofiber-nanosilver wire conductive film and its manufacturing method and photovoltaic device containing the same
KR20230091296A (en) * 2021-12-16 2023-06-23 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Electrically conductive bonding tape and electronic device including the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1160890A (en) * 1997-08-22 1999-03-05 Res Dev Corp Of Japan Metal/organic polymer composite structure having high metal content, porous body, and preparation thereof
JP2001096499A (en) * 1999-07-15 2001-04-10 Lucent Technol Inc Nano-scale structural body assembly, electric field emission device, microwave vacuum tube amplifier, display device, and manufacture of electric field emission structural body
KR20080098841A (en) * 2007-05-07 2008-11-12 주식회사 엘지화학 Anisotropic electricconnection material and method of circuit connection

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03124407A (en) * 1989-10-06 1991-05-28 Osaka Gas Co Ltd Production of high-conductivity carbon fiber structural body
JP2001279102A (en) * 2000-03-29 2001-10-10 Yazaki Corp Electroconductive paste
US7056409B2 (en) * 2003-04-17 2006-06-06 Nanosys, Inc. Structures, systems and methods for joining articles and materials and uses therefor
US7312261B2 (en) * 2004-05-11 2007-12-25 International Business Machines Corporation Thermal interface adhesive and rework

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1160890A (en) * 1997-08-22 1999-03-05 Res Dev Corp Of Japan Metal/organic polymer composite structure having high metal content, porous body, and preparation thereof
JP2001096499A (en) * 1999-07-15 2001-04-10 Lucent Technol Inc Nano-scale structural body assembly, electric field emission device, microwave vacuum tube amplifier, display device, and manufacture of electric field emission structural body
KR20080098841A (en) * 2007-05-07 2008-11-12 주식회사 엘지화학 Anisotropic electricconnection material and method of circuit connection

Also Published As

Publication number Publication date
JP2013506260A (en) 2013-02-21
JP5496343B2 (en) 2014-05-21
WO2011040752A2 (en) 2011-04-07

Similar Documents

Publication Publication Date Title
WO2011040752A3 (en) Conductive polymer adhesive using nanofiber and method for preparing the same
WO2008005816A3 (en) Electromagnetic wave shielding gasket having elasticity and adhesiveness
WO2011063217A3 (en) Compositions comprising conductive particles with surface-modified nanoparticles covalently attached thereto, and methods of making
EP2595460A4 (en) Composite material and high frequency circuit substrate manufactured with the composite material and the manufacturing method thereof
PL2301044T3 (en) Antennas based on a conductive polymer composite and methods for production thereof
EP2624671A4 (en) Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board, and printed wiring board
WO2011084235A3 (en) Glass core substrate for integrated circuit devices and methods of making the same
EP2412743A4 (en) Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
EP2380732A4 (en) Laminated body, manufacturing method thereof, and laminated circuit board
WO2009092064A3 (en) Electrically conductive adhesive
WO2008005782A3 (en) Conductive adhesive tape having different adhesion on both surfaces and method for manufacturing the same
EP2258748A4 (en) Resin particle and method for producing the same
HK1157048A1 (en) Conductive particle, anisotropic conductive film, joined structure, and joining method
MY175198A (en) Copper foil excellent in adherence with resin, method for manufacturing the copper foil, and printed wiring board or battery negative electrode material using the electrolytic copper foil
WO2009069308A1 (en) Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
HK1174433A1 (en) Conductive particle, method for producing same, anisotropic conductive film, assembly and connection method
EP2656955A4 (en) Bonding method, bonding structure, electronic device, manufacturing method for electronic device, and electronic component
EP2422918A4 (en) Soldering material and electronic component assembly
WO2013095908A3 (en) Process for preparing cured epoxy composites
WO2007082205A3 (en) Electrical connections made with dissimilar metals
WO2008117513A1 (en) Conductive bump, method for producing the same, and electronic component mounted structure
WO2012044029A3 (en) Laminate comprising an epoxy resin and having superior formability, and method for producing same
TW200705463A (en) Electrically conductive polymer resin and method for making same
WO2011078492A3 (en) Multifunctional resin composite and moulded articles employing the same
WO2012150817A3 (en) Printed circuit board and method for manufacturing the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10820825

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2012532008

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10820825

Country of ref document: EP

Kind code of ref document: A2