MX357441B - Material de revestimiento conductor para estructuras compuestas. - Google Patents

Material de revestimiento conductor para estructuras compuestas.

Info

Publication number
MX357441B
MX357441B MX2015006452A MX2015006452A MX357441B MX 357441 B MX357441 B MX 357441B MX 2015006452 A MX2015006452 A MX 2015006452A MX 2015006452 A MX2015006452 A MX 2015006452A MX 357441 B MX357441 B MX 357441B
Authority
MX
Mexico
Prior art keywords
coating material
resin film
conductive
conductive coating
ream
Prior art date
Application number
MX2015006452A
Other languages
English (en)
Other versions
MX2015006452A (es
Inventor
Jeffrey Sang Junjie
Kumar Kohli Dalip
Original Assignee
Cytec Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Ind Inc filed Critical Cytec Ind Inc
Publication of MX2015006452A publication Critical patent/MX2015006452A/es
Publication of MX357441B publication Critical patent/MX357441B/es

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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G13/00—Installations of lightning conductors; Fastening thereof to supporting structure
    • H02G13/80—Discharge by conduction or dissipation, e.g. rods, arresters, spark gaps
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
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    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K7/16—Solid spheres
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
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    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y10T428/249974—Metal- or silicon-containing element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Organic Insulating Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

Se describe un material de revestimiento conductor eléctrico capaz de proveer suficiente conductividad para la protección contra rayos (LSP) y/o el blindaje contra interferencia electromagnética (EMI). El material de revestimiento conductor es una estructura de múltiples capas con una capa conductora muy delgada (por ejemplo, lámina de metal sólido) y una película de resina formada sobre al menos una superficie de la capa conductora. La película de resina se forma a partir de una composición de resma curable que contiene una resina epoxi novolac, una resina epoxi trifuncional o tetrafuncional, microesferas de cerámica, un agente de curado en base a aminas latente, relleno inorgánico en forma de partículas y un componente de endurecimiento. De manera opcional, la película de resma incluye adicionalmente aditivos conductores para aumentar la conductividad eléctrica del material de revestimiento. La película de resina exhibe una Tg elevada, así como alta resistencia a soluciones removedoras de pintura. Además, el material de revestimiento conductor es adecuado para el curado conjunto con los sustratos del compuesto de resina reforzado con fibras.
MX2015006452A 2012-12-05 2013-11-25 Material de revestimiento conductor para estructuras compuestas. MX357441B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261733597P 2012-12-05 2012-12-05
PCT/US2013/071685 WO2014088866A1 (en) 2012-12-05 2013-11-25 Conductive surfacing material for composite structures

Publications (2)

Publication Number Publication Date
MX2015006452A MX2015006452A (es) 2015-08-14
MX357441B true MX357441B (es) 2018-07-10

Family

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Family Applications (1)

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MX2015006452A MX357441B (es) 2012-12-05 2013-11-25 Material de revestimiento conductor para estructuras compuestas.

Country Status (14)

Country Link
US (2) US9620949B2 (es)
EP (1) EP2900468B1 (es)
JP (1) JP6176802B2 (es)
KR (1) KR102123475B1 (es)
CN (1) CN104853910B (es)
AU (1) AU2013356422B2 (es)
BR (1) BR112015012619B1 (es)
CA (1) CA2893646C (es)
ES (1) ES2604784T3 (es)
MX (1) MX357441B (es)
MY (1) MY176165A (es)
RU (1) RU2605131C1 (es)
TW (1) TWI584947B (es)
WO (1) WO2014088866A1 (es)

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KR101644714B1 (ko) * 2014-12-30 2016-08-01 충북대학교 산학협력단 박막형 전도 노이즈 흡수체
US10399276B2 (en) 2015-08-12 2019-09-03 General Electric Company System and method for controlling at least one variable during layup of a composite part using automated fiber placement
EP3131097A1 (en) * 2015-08-14 2017-02-15 Crompton Technology Group Limited Composite material
US11027856B2 (en) * 2015-11-30 2021-06-08 Cytec Industries Inc. Surfacing materials for composite structures
JP6826601B2 (ja) * 2015-12-22 2021-02-03 サイテック インダストリーズ インコーポレイテッド 複合材部材のための離型性表面材
AU2016380284B2 (en) * 2015-12-30 2021-10-28 Cytec Industries Inc. Multifunctional surfacing material with burn-through resistance
CN105517423B (zh) * 2016-01-25 2018-06-19 衡山县佳诚新材料有限公司 一种高导热石墨烯散热金属箔
JP6754617B2 (ja) * 2016-05-25 2020-09-16 日産自動車株式会社 繊維強化樹脂成形品および繊維強化樹脂成形品の製造方法
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CA2893646C (en) 2020-08-11
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WO2014088866A1 (en) 2014-06-12
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