JP5878535B2 - 寸法のあるシリカ系シリコン構造およびその製造方法 - Google Patents

寸法のあるシリカ系シリコン構造およびその製造方法 Download PDF

Info

Publication number
JP5878535B2
JP5878535B2 JP2013525950A JP2013525950A JP5878535B2 JP 5878535 B2 JP5878535 B2 JP 5878535B2 JP 2013525950 A JP2013525950 A JP 2013525950A JP 2013525950 A JP2013525950 A JP 2013525950A JP 5878535 B2 JP5878535 B2 JP 5878535B2
Authority
JP
Japan
Prior art keywords
glass substrate
silica glass
silica
porous silicon
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013525950A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013536151A5 (enExample
JP2013536151A (ja
Inventor
エー ベルマン，ロバート
エー ベルマン，ロバート
ボレリ，ニコラス　エフ
エフ ボレリ，ニコラス
エー デネカ，ディヴィッド
エー デネカ，ディヴィッド
エム オマリー，シャウン
エム オマリー，シャウン
エム シュナイダー，ヴィター
エム シュナイダー，ヴィター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of JP2013536151A publication Critical patent/JP2013536151A/ja
Publication of JP2013536151A5 publication Critical patent/JP2013536151A5/ja
Application granted granted Critical
Publication of JP5878535B2 publication Critical patent/JP5878535B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0095—Solution impregnating; Solution doping; Molecular stuffing, e.g. of porous glass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/008—Other surface treatment of glass not in the form of fibres or filaments comprising a lixiviation step
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3204—Materials thereof being Group IVA semiconducting materials
    • H10P14/3211—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242—Structure
    • H10P14/3256—Microstructure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/36—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H10P32/1408—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
    • H10P32/1414—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer being silicon, silicide or SIPOS, e.g. polysilicon or porous silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249967—Inorganic matrix in void-containing component
    • Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Recrystallisation Techniques (AREA)
  • Surface Treatment Of Glass (AREA)
  • Silicon Compounds (AREA)
  • Laminated Bodies (AREA)
  • Photovoltaic Devices (AREA)
  • Glass Compositions (AREA)
JP2013525950A 2010-08-24 2011-08-11 寸法のあるシリカ系シリコン構造およびその製造方法 Expired - Fee Related JP5878535B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37637910P 2010-08-24 2010-08-24
US61/376,379 2010-08-24
US13/100,593 US8415555B2 (en) 2010-08-24 2011-05-04 Dimensional silica-based porous silicon structures and methods of fabrication
US13/100,593 2011-05-04
PCT/US2011/047367 WO2012027121A2 (en) 2010-08-24 2011-08-11 Dimensional silica-based porous silicon structures and methods of fabrication

Publications (3)

Publication Number Publication Date
JP2013536151A JP2013536151A (ja) 2013-09-19
JP2013536151A5 JP2013536151A5 (enExample) 2014-09-25
JP5878535B2 true JP5878535B2 (ja) 2016-03-08

Family

ID=45697815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013525950A Expired - Fee Related JP5878535B2 (ja) 2010-08-24 2011-08-11 寸法のあるシリカ系シリコン構造およびその製造方法

Country Status (8)

Country Link
US (2) US8415555B2 (enExample)
EP (1) EP2609234A4 (enExample)
JP (1) JP5878535B2 (enExample)
KR (1) KR20130108531A (enExample)
CN (1) CN103069055B (enExample)
AU (1) AU2011293715A1 (enExample)
TW (1) TWI560163B (enExample)
WO (1) WO2012027121A2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10629900B2 (en) 2011-05-04 2020-04-21 Corning Incorporated Porous silicon compositions and devices and methods thereof
US9285332B2 (en) 2011-12-12 2016-03-15 Korea Institute Of Science And Technology Low power consumption type gas sensor and method for manufacturing the same
KR101344738B1 (ko) * 2011-12-12 2013-12-26 한국과학기술연구원 고감도 투명 가스 센서 및 그 제조방법
KR101602418B1 (ko) * 2012-04-06 2016-03-10 코닝정밀소재 주식회사 광추출 효율이 향상된 유기 발광소자용 기판, 그 제조방법 및 이를 구비하는 유기 발광소자
US8921841B2 (en) * 2012-05-09 2014-12-30 Samsung Corning Precision Materials Co., Ltd. Porous glass substrate for displays and method of manufacturing the same
JP2017514273A (ja) 2014-04-09 2017-06-01 コーニング インコーポレイテッド リチウムイオン電池アノードのための方法及び材料
EP3224881A1 (en) 2014-11-25 2017-10-04 Corning Incorporated Method and material for lithium ion battery anodes
CN107004630A (zh) * 2014-12-10 2017-08-01 应用材料公司 用于全卷绕多孔硅形成的系统和方法
US10593592B2 (en) 2015-01-09 2020-03-17 Applied Materials, Inc. Laminate and core shell formation of silicide nanowire
CN108290740B (zh) 2015-11-25 2022-03-04 康宁股份有限公司 多孔硅组合物和装置以及其方法
CN111051256A (zh) * 2017-07-31 2020-04-21 康宁股份有限公司 具有非玻璃芯体和玻璃包封物的层压制品及其方法
CN119069675A (zh) * 2017-12-01 2024-12-03 大洲电子材料株式会社 包含氧化硅复合物的用于非水电解质二次电池的负极活性物质及其制备方法
WO2019151774A1 (ko) 2018-01-30 2019-08-08 주식회사 엘지화학 음극 활물질, 상기 음극 활물질의 제조 방법, 상기 음극 활물질을 포함하는 음극, 및 상기 음극을 포함하는 이차 전지
KR102799193B1 (ko) 2019-07-26 2025-04-23 주식회사 엘지에너지솔루션 복합 음극 활물질, 이의 제조방법, 이를 포함하는 음극 및 이차전지
CN115010380B (zh) * 2022-08-09 2022-11-15 中国华能集团清洁能源技术研究院有限公司 一种基于无序光子晶体的光伏玻璃的制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757511A (en) * 1971-05-17 1973-09-11 Motorola Inc Light emitting diode display for electronic timepiece
US6376859B1 (en) * 1998-07-29 2002-04-23 Texas Instruments Incorporated Variable porosity porous silicon isolation
KR100434537B1 (ko) 1999-03-31 2004-06-05 삼성전자주식회사 다공질 실리콘 혹은 다공질 산화 실리콘을 이용한 두꺼운 희생층을 가진 다층 구조 웨이퍼 및 그 제조방법
US7473969B2 (en) * 2004-08-18 2009-01-06 Corning Incorporated High strain glass/glass-ceramic containing semiconductor-on-insulator structures
US7615206B2 (en) * 2006-08-11 2009-11-10 Georgia Tech Research Corporation Methods of fabricating nanoscale-to-microscale structures
KR101375328B1 (ko) * 2007-07-27 2014-03-19 삼성에스디아이 주식회사 Ｓｉ／Ｃ 복합물, 이를 포함하는 음극활물질 및 리튬전지
US20090056797A1 (en) * 2007-08-28 2009-03-05 Blue Square Energy Incorporated Photovoltaic Thin-Film Solar Cell and Method Of Making The Same
US8813522B2 (en) * 2008-10-14 2014-08-26 University Of Central Florida Research Foundation, Inc. Silicon photonic fiber and method of manufacture

Also Published As

Publication number Publication date
US8415555B2 (en) 2013-04-09
JP2013536151A (ja) 2013-09-19
TWI560163B (en) 2016-12-01
EP2609234A4 (en) 2015-11-04
TW201217290A (en) 2012-05-01
WO2012027121A2 (en) 2012-03-01
WO2012027121A3 (en) 2012-08-09
CN103069055A (zh) 2013-04-24
KR20130108531A (ko) 2013-10-04
EP2609234A2 (en) 2013-07-03
CN103069055B (zh) 2016-08-03
AU2011293715A1 (en) 2013-01-31
US20130209781A1 (en) 2013-08-15
US20120052656A1 (en) 2012-03-01

Similar Documents

Publication Publication Date Title
JP5878535B2 (ja) 寸法のあるシリカ系シリコン構造およびその製造方法
KR100973697B1 (ko) 다이아몬드의 고온 처리를 통한 ａａ 적층그라핀-다이아몬드 하이브리드 물질 및 그 제조 방법
US20130220211A1 (en) Crystal to crystal oxygen extraction
CN101643196B (zh) 纳米线、纳米线的生产方法及电子装置
JP2011513591A (ja) シリコン太陽電池用基板およびその作製方法
JP2007182370A (ja) 酸化亜鉛ナノワイヤの製造方法及びその製造方法により製造された酸化亜鉛ナノワイヤ
JP2008537765A (ja) 半球粒状シリコン及びナノ結晶粒サイズのポリシリコンのための単一ウエハ熱ｃｖｄプロセス
JP2009149481A (ja) 半導体基板の製造方法
Nakagawa et al. On the mechanism of BaSi2 thin film formation on Si substrate by vacuum evaporation
US20100068505A1 (en) Condensed materials
JP5408517B2 (ja) 複合構造体、その製造方法及びそれを用いた熱電変換素子
KR102127024B1 (ko) 고밀도 정렬된 실리콘 나노와이어
KR20240009063A (ko) 고균일 3차원 계층구조를 가지는 전이금속 디칼코제나이드 박막의 제조 방법
Shan et al. The Carrier Transport Properties of B‐Doped Si Nanocrystal Films with Various Doping Concentrations
JP2012148393A (ja) 半導体素子及び半導体素子の製造方法
Sami Co-Growth of 3D Silicon and 2D Silicon Telluride Crystals: Roles of Catalysts and Effects of Catalyst Stabilities
Greene et al. Thin single crystal silicon on oxide by lateral solid phase epitaxy of amorphous silicon and silicon germanium
Hilleringmann Deposition Process
KR101139914B1 (ko) Ｎｉ 박막이 증착된 Ｓｉ-과잉산화막을 이용한 실리카 나노선의 제조 방법
US8658246B2 (en) Manufacturing method of group of whiskers
JP4631041B2 (ja) 非金属不純物を添加した光触媒材料とその作製法
CN119108262A (zh) 制造半导体结构的方法及半导体处理系统
CN118715591A (zh) 降低超纳米结晶金刚石膜粗糙度的方法
JP2010262947A (ja) 選択的膜製造方法
WO2012002795A1 (en) A process for producing silicon carbide (sic) nanowires on a silicon substrate

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140811

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140811

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150312

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150317

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20150617

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20150717

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150817

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151006

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151215

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160105

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160128

R150 Certificate of patent or registration of utility model

Ref document number: 5878535

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees