JP5859536B2 - 高温用途で使用のための放射線硬化性一時貼合せ用接着剤 - Google Patents

高温用途で使用のための放射線硬化性一時貼合せ用接着剤 Download PDF

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JP5859536B2
JP5859536B2 JP2013524861A JP2013524861A JP5859536B2 JP 5859536 B2 JP5859536 B2 JP 5859536B2 JP 2013524861 A JP2013524861 A JP 2013524861A JP 2013524861 A JP2013524861 A JP 2013524861A JP 5859536 B2 JP5859536 B2 JP 5859536B2
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adhesive
group
hydrogenated polybutadiene
acrylate
substrate
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Japanese (ja)
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JP2013539489A5 (enExample
JP2013539489A (ja
Inventor
ドナルド・ハー
コン・ションチアン
シャロン・アン・チャプリンスキー
アリソン・ユエ・シャオ
Original Assignee
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J147/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J115/00—Adhesives based on rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/06—Crosslinking by radiation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2013524861A 2010-08-18 2011-07-28 高温用途で使用のための放射線硬化性一時貼合せ用接着剤 Expired - Fee Related JP5859536B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37479410P 2010-08-18 2010-08-18
US61/374,794 2010-08-18
PCT/US2011/045712 WO2012024070A2 (en) 2010-08-18 2011-07-28 Radiation curable temporary laminating adhesive for use in high temperature applications

Publications (3)

Publication Number Publication Date
JP2013539489A JP2013539489A (ja) 2013-10-24
JP2013539489A5 JP2013539489A5 (enExample) 2014-09-11
JP5859536B2 true JP5859536B2 (ja) 2016-02-10

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JP2013524861A Expired - Fee Related JP5859536B2 (ja) 2010-08-18 2011-07-28 高温用途で使用のための放射線硬化性一時貼合せ用接着剤

Country Status (7)

Country Link
US (1) US8921443B2 (enExample)
EP (1) EP2606098A4 (enExample)
JP (1) JP5859536B2 (enExample)
KR (1) KR101747179B1 (enExample)
CN (1) CN103068945B (enExample)
TW (1) TWI535807B (enExample)
WO (1) WO2012024070A2 (enExample)

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US9394479B2 (en) 2011-10-05 2016-07-19 Nitto Denko Corporation Wavelength conversion film having pressure sensitive adhesive layer to enhance solar harvesting efficiency
US9399730B2 (en) 2011-12-06 2016-07-26 Nitto Denko Corporation Wavelength conversion material as encapsulate for solar module systems to enhance solar harvesting efficiency
TWI440414B (zh) * 2012-05-11 2014-06-01 Au Optronics Corp 基板製造方法及多層堆疊結構
WO2014197393A1 (en) * 2013-06-04 2014-12-11 Nitto Denko Corporation Photostable wavelength conversion composition
JP6340765B2 (ja) * 2013-08-21 2018-06-13 三菱ケミカル株式会社 両面粘着シートおよび画像表示装置
JP6241575B1 (ja) * 2016-03-31 2017-12-06 横浜ゴム株式会社 光硬化性樹脂、混合物及び光硬化性樹脂組成物
KR102197327B1 (ko) * 2016-09-29 2020-12-31 동우 화인켐 주식회사 점착제 조성물 및 그를 이용한 점착 시트
US20190212102A1 (en) * 2018-01-09 2019-07-11 Walter Shannon Personal Safety Baton
TWI798722B (zh) * 2021-06-18 2023-04-11 臺灣永光化學工業股份有限公司 紫外光固化組成物
CN115491132B (zh) * 2021-06-18 2024-02-23 台湾永光化学工业股份有限公司 紫外光固化组成物
CN115197664B (zh) * 2022-08-01 2023-06-02 业成科技（成都）有限公司 光学胶组合物、光学胶膜及制造光学胶膜之方法
JPWO2024162059A1 (enExample) * 2023-01-31 2024-08-08

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Publication number Publication date
US20140011904A1 (en) 2014-01-09
EP2606098A2 (en) 2013-06-26
EP2606098A4 (en) 2014-04-02
TWI535807B (zh) 2016-06-01
US8921443B2 (en) 2014-12-30
TW201219524A (en) 2012-05-16
CN103068945A (zh) 2013-04-24
WO2012024070A2 (en) 2012-02-23
CN103068945B (zh) 2015-04-08
JP2013539489A (ja) 2013-10-24
KR101747179B1 (ko) 2017-06-14
WO2012024070A3 (en) 2012-05-31
KR20130097724A (ko) 2013-09-03

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