JP5768498B2 - 記憶素子、記憶装置 - Google Patents
記憶素子、記憶装置 Download PDFInfo
- Publication number
- JP5768498B2 JP5768498B2 JP2011114440A JP2011114440A JP5768498B2 JP 5768498 B2 JP5768498 B2 JP 5768498B2 JP 2011114440 A JP2011114440 A JP 2011114440A JP 2011114440 A JP2011114440 A JP 2011114440A JP 5768498 B2 JP5768498 B2 JP 5768498B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- magnetization
- storage
- oxide
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1659—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Materials of the active region
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011114440A JP5768498B2 (ja) | 2011-05-23 | 2011-05-23 | 記憶素子、記憶装置 |
| TW101111507A TWI540684B (zh) | 2011-05-23 | 2012-03-30 | Memory elements and memory devices |
| US13/462,538 US8854876B2 (en) | 2011-05-23 | 2012-05-02 | Perpendicular magnetization storage element and storage device |
| KR1020120051401A KR101983856B1 (ko) | 2011-05-23 | 2012-05-15 | 기억 소자, 기억 장치 |
| CN201210152403.9A CN102800803B (zh) | 2011-05-23 | 2012-05-16 | 存储元件和存储设备 |
| US14/478,642 US9356230B2 (en) | 2011-05-23 | 2014-09-05 | Perpendicular magnetization storage element and storage device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011114440A JP5768498B2 (ja) | 2011-05-23 | 2011-05-23 | 記憶素子、記憶装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012244031A JP2012244031A (ja) | 2012-12-10 |
| JP2012244031A5 JP2012244031A5 (enExample) | 2014-06-19 |
| JP5768498B2 true JP5768498B2 (ja) | 2015-08-26 |
Family
ID=47199843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011114440A Expired - Fee Related JP5768498B2 (ja) | 2011-05-23 | 2011-05-23 | 記憶素子、記憶装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8854876B2 (enExample) |
| JP (1) | JP5768498B2 (enExample) |
| KR (1) | KR101983856B1 (enExample) |
| CN (1) | CN102800803B (enExample) |
| TW (1) | TWI540684B (enExample) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5786341B2 (ja) | 2010-09-06 | 2015-09-30 | ソニー株式会社 | 記憶素子、メモリ装置 |
| JP5768498B2 (ja) * | 2011-05-23 | 2015-08-26 | ソニー株式会社 | 記憶素子、記憶装置 |
| FR2992466A1 (fr) | 2012-06-22 | 2013-12-27 | Soitec Silicon On Insulator | Procede de realisation de contact pour led et structure resultante |
| JP2014072393A (ja) * | 2012-09-28 | 2014-04-21 | Sony Corp | 記憶素子、記憶装置、磁気ヘッド |
| US10522589B2 (en) * | 2012-12-24 | 2019-12-31 | Shanghai Ciyu Information Technologies Co., Ltd. | Method of making a magnetoresistive element |
| US9178137B2 (en) * | 2013-03-22 | 2015-11-03 | Youngmin EEH | Magnetoresistive element and magnetic memory |
| KR102105078B1 (ko) | 2013-05-30 | 2020-04-27 | 삼성전자주식회사 | 자기 기억 소자 |
| TWI569483B (zh) * | 2013-06-05 | 2017-02-01 | 財團法人工業技術研究院 | 垂直磁化穿隧式磁阻元件及其製造方法 |
| US9147833B2 (en) | 2013-07-05 | 2015-09-29 | Headway Technologies, Inc. | Hybridized oxide capping layer for perpendicular magnetic anisotropy |
| US9461242B2 (en) | 2013-09-13 | 2016-10-04 | Micron Technology, Inc. | Magnetic memory cells, methods of fabrication, semiconductor devices, memory systems, and electronic systems |
| US9608197B2 (en) | 2013-09-18 | 2017-03-28 | Micron Technology, Inc. | Memory cells, methods of fabrication, and semiconductor devices |
| US10454024B2 (en) | 2014-02-28 | 2019-10-22 | Micron Technology, Inc. | Memory cells, methods of fabrication, and memory devices |
| US9281466B2 (en) | 2014-04-09 | 2016-03-08 | Micron Technology, Inc. | Memory cells, semiconductor structures, semiconductor devices, and methods of fabrication |
| US9583380B2 (en) * | 2014-07-17 | 2017-02-28 | Globalfoundries Inc. | Anisotropic material damage process for etching low-K dielectric materials |
| US9349945B2 (en) | 2014-10-16 | 2016-05-24 | Micron Technology, Inc. | Memory cells, semiconductor devices, and methods of fabrication |
| KR102268187B1 (ko) * | 2014-11-10 | 2021-06-24 | 삼성전자주식회사 | 자기 기억 소자 및 그 제조 방법 |
| US9768377B2 (en) | 2014-12-02 | 2017-09-19 | Micron Technology, Inc. | Magnetic cell structures, and methods of fabrication |
| US10439131B2 (en) | 2015-01-15 | 2019-10-08 | Micron Technology, Inc. | Methods of forming semiconductor devices including tunnel barrier materials |
| CN104733606B (zh) * | 2015-04-01 | 2017-12-15 | 上海磁宇信息科技有限公司 | 一种具有双层优化层的磁电阻元件 |
| CN104868052B (zh) * | 2015-04-16 | 2017-12-15 | 上海磁宇信息科技有限公司 | 一种可调的垂直式磁电阻元件 |
| US9472281B1 (en) * | 2015-06-30 | 2016-10-18 | HGST Netherlands B.V. | Non-volatile memory with adjustable cell bit shape |
| KR20170012791A (ko) * | 2015-07-24 | 2017-02-03 | 에스케이하이닉스 주식회사 | 전자 장치의 제조 방법 |
| US9647034B2 (en) * | 2015-09-09 | 2017-05-09 | Kabushiki Kaisha Toshiba | Magnetoresistive memory device and manufacturing method of the same |
| US11563169B2 (en) | 2015-11-18 | 2023-01-24 | Tohoku University | Magnetic tunnel junction element and magnetic memory |
| US10256399B2 (en) * | 2016-05-18 | 2019-04-09 | International Business Machines Corporation | Fabricating a cap layer for a magnetic random access memory (MRAM) device |
| JP6374452B2 (ja) * | 2016-08-04 | 2018-08-15 | 株式会社東芝 | 磁気メモリ |
| KR102511914B1 (ko) * | 2016-08-04 | 2023-03-21 | 삼성전자주식회사 | 자기 기억 소자 및 이의 제조 방법 |
| US10230043B2 (en) * | 2017-03-21 | 2019-03-12 | International Business Machines Corporation | Boron segregation in magnetic tunnel junctions |
| WO2018182651A1 (en) * | 2017-03-30 | 2018-10-04 | Intel Corporation | Perpendicular spin transfer torque memory (psttm) devices with enhanced anisotropy and methods to form the same |
| WO2018182644A1 (en) * | 2017-03-30 | 2018-10-04 | Intel Corporation | Spintronic memory with low oxygen precipitation |
| US10014465B1 (en) | 2017-04-03 | 2018-07-03 | Headway Technologies, Inc. | Maintaining coercive field after high temperature anneal for magnetic device applications with perpendicular magnetic anisotropy |
| JP6832818B2 (ja) | 2017-09-21 | 2021-02-24 | キオクシア株式会社 | 磁気記憶装置 |
| KR102514506B1 (ko) | 2017-12-19 | 2023-03-29 | 삼성전자주식회사 | 자기 메모리 장치 및 그 제조 방법 |
| US10431275B2 (en) | 2018-03-02 | 2019-10-01 | Samsung Electronics Co., Ltd. | Method and system for providing magnetic junctions having hybrid oxide and noble metal capping layers |
| JP2019164848A (ja) * | 2018-03-19 | 2019-09-26 | 東芝メモリ株式会社 | 磁気記憶装置 |
| CN110867511B (zh) * | 2018-08-28 | 2021-09-21 | 中电海康集团有限公司 | 垂直磁化的mtj器件 |
| US11009570B2 (en) * | 2018-11-16 | 2021-05-18 | Samsung Electronics Co., Ltd. | Hybrid oxide/metal cap layer for boron-free free layer |
| JP2021044369A (ja) | 2019-09-11 | 2021-03-18 | キオクシア株式会社 | 磁気装置 |
| CN112635653A (zh) * | 2019-10-08 | 2021-04-09 | 上海磁宇信息科技有限公司 | 磁性隧道结结构及其磁性存储单元 |
| US11404632B2 (en) | 2019-11-22 | 2022-08-02 | Western Digital Technologies, Inc. | Magnetoresistive memory device including a magnesium containing dust layer |
| US11005034B1 (en) * | 2019-11-22 | 2021-05-11 | Western Digital Technologies, Inc. | Magnetoresistive memory device including a high dielectric constant capping layer and methods of making the same |
| US11056640B2 (en) | 2019-11-22 | 2021-07-06 | Western Digital Technologies, Inc. | Magnetoresistive memory device including a high dielectric constant capping layer and methods of making the same |
| US12225828B2 (en) | 2019-11-22 | 2025-02-11 | SanDisk Technologies, Inc. | Voltage controlled magnetic anisotropy (VCMA) memory devices including platinum containing layer in contact with free layer |
| CN113330592B (zh) * | 2019-11-22 | 2024-08-16 | 西部数据技术公司 | 包括高介电常数帽盖层的磁阻存储器设备及其制造方法 |
| US11871679B2 (en) | 2021-06-07 | 2024-01-09 | Western Digital Technologies, Inc. | Voltage-controlled magnetic anisotropy memory device including an anisotropy-enhancing dust layer and methods for forming the same |
| US11839162B2 (en) | 2019-11-22 | 2023-12-05 | Western Digital Technologies, Inc. | Magnetoresistive memory device including a plurality of reference layers |
| US11361805B2 (en) * | 2019-11-22 | 2022-06-14 | Western Digital Technologies, Inc. | Magnetoresistive memory device including a reference layer side dielectric spacer layer |
| US10991407B1 (en) * | 2019-11-22 | 2021-04-27 | Western Digital Technologies, Inc. | Magnetoresistive memory device including a high dielectric constant capping layer and methods of making the same |
| US11404193B2 (en) | 2019-11-22 | 2022-08-02 | Western Digital Technologies, Inc. | Magnetoresistive memory device including a magnesium containing dust layer |
| KR102702693B1 (ko) * | 2019-12-13 | 2024-09-05 | 에스케이하이닉스 주식회사 | 전자 장치 |
| CN111208455A (zh) * | 2020-01-08 | 2020-05-29 | 华东师范大学 | 一种铁磁体探针探测反铁磁体磁各向异性的方法 |
| KR20230022163A (ko) * | 2020-06-10 | 2023-02-14 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 자기 저항 효과 소자, 반도체 장치 및 전자 기기 |
| US11887640B2 (en) | 2021-06-07 | 2024-01-30 | Western Digital Technologies, Inc. | Voltage-controlled magnetic anisotropy memory device including an anisotropy-enhancing dust layer and methods for forming the same |
| US11889702B2 (en) | 2021-06-07 | 2024-01-30 | Western Digital Technologies, Inc. | Voltage-controlled magnetic anisotropy memory device including an anisotropy-enhancing dust layer and methods for forming the same |
| US12114578B2 (en) | 2021-12-03 | 2024-10-08 | Samsung Electronics Co., Ltd. | Magnetoresistive memory elements for spin-transfer torque (STT) and spin-orbit torque (SOT) random access memories |
| JP2023120885A (ja) * | 2022-02-18 | 2023-08-30 | キオクシア株式会社 | 磁気記憶装置 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6621667B1 (en) * | 2000-08-15 | 2003-09-16 | Seagate Technology Llc | Giant magnetoresistive sensor with a multilayer cap layer |
| JP4371781B2 (ja) | 2002-11-26 | 2009-11-25 | 株式会社東芝 | 磁気セル及び磁気メモリ |
| JP2005032780A (ja) * | 2003-07-07 | 2005-02-03 | Tdk Corp | 磁気抵抗効果素子、これを用いた磁気ヘッド、ヘッドサスペンションアセンブリ及び磁気ディスク装置 |
| US7190557B2 (en) * | 2004-04-14 | 2007-03-13 | Hitachi Global Storage Technologies Netherlands B.V. | Current-in-the-plane spin valve magnetoresistive sensor with dual metal oxide capping layers |
| JP2006060044A (ja) * | 2004-08-20 | 2006-03-02 | Canon Anelva Corp | 磁気抵抗効果素子の製造方法 |
| JP2008283207A (ja) * | 2005-10-19 | 2008-11-20 | Toshiba Corp | 磁気抵抗効果素子、磁気ランダムアクセスメモリ、電子カード及び電子装置 |
| JP5040105B2 (ja) * | 2005-12-01 | 2012-10-03 | ソニー株式会社 | 記憶素子、メモリ |
| JP2007165572A (ja) * | 2005-12-14 | 2007-06-28 | Alps Electric Co Ltd | 磁気検出素子 |
| JP2007266498A (ja) * | 2006-03-29 | 2007-10-11 | Toshiba Corp | 磁気記録素子及び磁気メモリ |
| JP2008098523A (ja) * | 2006-10-13 | 2008-04-24 | Toshiba Corp | 磁気抵抗効果素子および磁気メモリ |
| JP2009081215A (ja) | 2007-09-25 | 2009-04-16 | Toshiba Corp | 磁気抵抗効果素子およびそれを用いた磁気ランダムアクセスメモリ |
| JP4649457B2 (ja) * | 2007-09-26 | 2011-03-09 | 株式会社東芝 | 磁気抵抗素子及び磁気メモリ |
| JP2009239121A (ja) * | 2008-03-27 | 2009-10-15 | Toshiba Corp | 磁気抵抗効果素子及び磁気ランダムアクセスメモリ |
| WO2010080542A1 (en) * | 2008-12-17 | 2010-07-15 | Yadav Technology, Inc. | Spin-transfer torque magnetic random access memory having magnetic tunnel junction with perpendicular magnetic anisotropy |
| US8411494B2 (en) * | 2009-07-21 | 2013-04-02 | Alexander Mikhailovich Shukh | Three-dimensional magnetic random access memory with high speed writing |
| US8913350B2 (en) * | 2009-08-10 | 2014-12-16 | Grandis, Inc. | Method and system for providing magnetic tunneling junction elements having improved performance through capping layer induced perpendicular anisotropy and memories using such magnetic elements |
| US10446209B2 (en) * | 2009-08-10 | 2019-10-15 | Samsung Semiconductor Inc. | Method and system for providing magnetic tunneling junction elements having improved performance through capping layer induced perpendicular anisotropy and memories using such magnetic elements |
| JP2011054873A (ja) * | 2009-09-04 | 2011-03-17 | Sony Corp | 不揮発性メモリ素子の製造方法 |
| JP5768498B2 (ja) * | 2011-05-23 | 2015-08-26 | ソニー株式会社 | 記憶素子、記憶装置 |
-
2011
- 2011-05-23 JP JP2011114440A patent/JP5768498B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-30 TW TW101111507A patent/TWI540684B/zh not_active IP Right Cessation
- 2012-05-02 US US13/462,538 patent/US8854876B2/en not_active Expired - Fee Related
- 2012-05-15 KR KR1020120051401A patent/KR101983856B1/ko not_active Expired - Fee Related
- 2012-05-16 CN CN201210152403.9A patent/CN102800803B/zh not_active Expired - Fee Related
-
2014
- 2014-09-05 US US14/478,642 patent/US9356230B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI540684B (zh) | 2016-07-01 |
| US8854876B2 (en) | 2014-10-07 |
| KR20120130701A (ko) | 2012-12-03 |
| CN102800803A (zh) | 2012-11-28 |
| CN102800803B (zh) | 2016-12-14 |
| KR101983856B1 (ko) | 2019-05-29 |
| US9356230B2 (en) | 2016-05-31 |
| TW201248785A (en) | 2012-12-01 |
| JP2012244031A (ja) | 2012-12-10 |
| US20120300542A1 (en) | 2012-11-29 |
| US20140374752A1 (en) | 2014-12-25 |
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