JP5733893B2 - 電子部品装置 - Google Patents

電子部品装置 Download PDF

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Publication number
JP5733893B2
JP5733893B2 JP2009290655A JP2009290655A JP5733893B2 JP 5733893 B2 JP5733893 B2 JP 5733893B2 JP 2009290655 A JP2009290655 A JP 2009290655A JP 2009290655 A JP2009290655 A JP 2009290655A JP 5733893 B2 JP5733893 B2 JP 5733893B2
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JP
Japan
Prior art keywords
heat
chip
wiring board
plate
foot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009290655A
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English (en)
Japanese (ja)
Other versions
JP2011134769A (ja
JP2011134769A5 (enExample
Inventor
卓也 黒澤
卓也 黒澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009290655A priority Critical patent/JP5733893B2/ja
Priority to US12/967,312 priority patent/US8520388B2/en
Publication of JP2011134769A publication Critical patent/JP2011134769A/ja
Publication of JP2011134769A5 publication Critical patent/JP2011134769A5/ja
Application granted granted Critical
Publication of JP5733893B2 publication Critical patent/JP5733893B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2009290655A 2009-12-22 2009-12-22 電子部品装置 Active JP5733893B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009290655A JP5733893B2 (ja) 2009-12-22 2009-12-22 電子部品装置
US12/967,312 US8520388B2 (en) 2009-12-22 2010-12-14 Heat-radiating component and electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009290655A JP5733893B2 (ja) 2009-12-22 2009-12-22 電子部品装置

Publications (3)

Publication Number Publication Date
JP2011134769A JP2011134769A (ja) 2011-07-07
JP2011134769A5 JP2011134769A5 (enExample) 2012-10-25
JP5733893B2 true JP5733893B2 (ja) 2015-06-10

Family

ID=44150783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009290655A Active JP5733893B2 (ja) 2009-12-22 2009-12-22 電子部品装置

Country Status (2)

Country Link
US (1) US8520388B2 (enExample)
JP (1) JP5733893B2 (enExample)

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JP2012227374A (ja) * 2011-04-20 2012-11-15 Mitsubishi Electric Corp 電子機器の放熱構造
EP2727445A4 (en) * 2011-06-28 2015-04-15 Ericsson Telefon Ab L M ELECTRONIC DEVICE HAVING A HEAT DISSIPATION STRUCTURE
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
US20130250522A1 (en) * 2012-03-22 2013-09-26 Varian Medical Systems, Inc. Heat sink profile for interface to thermally conductive material
US9230896B2 (en) * 2012-06-05 2016-01-05 Stats Chippac, Ltd. Semiconductor device and method of reflow soldering for conductive column structure in flip chip package
US8941994B2 (en) * 2012-09-13 2015-01-27 International Business Machines Corporation Vapor condenser with three-dimensional folded structure
US10506719B2 (en) * 2013-01-15 2019-12-10 Blackberry Limited Thermal dissipater apparatus for use with electronic devices
TWI478479B (zh) * 2013-01-17 2015-03-21 台達電子工業股份有限公司 整合功率模組封裝結構
US10914539B2 (en) * 2013-05-15 2021-02-09 Osram Sylvania Inc. Two piece aluminum heat sink
US20150098191A1 (en) * 2013-10-06 2015-04-09 Gerald Ho Kim Silicon Heat-Dissipation Package For Compact Electronic Devices
KR102173141B1 (ko) * 2014-02-04 2020-11-02 삼성전자주식회사 히트 파이프를 포함하는 휴대 장치
US9524917B2 (en) * 2014-04-23 2016-12-20 Optiz, Inc. Chip level heat dissipation using silicon
JP2015216199A (ja) * 2014-05-09 2015-12-03 新光電気工業株式会社 半導体装置、熱伝導部材及び半導体装置の製造方法
US20160021788A1 (en) * 2014-07-16 2016-01-21 General Electric Company Electronic device assembly
US9892990B1 (en) * 2014-07-24 2018-02-13 Amkor Technology, Inc. Semiconductor package lid thermal interface material standoffs
JP6421050B2 (ja) * 2015-02-09 2018-11-07 株式会社ジェイデバイス 半導体装置
JP6283379B2 (ja) * 2016-01-29 2018-02-21 本田技研工業株式会社 コンデンサの配置構造
JP6867243B2 (ja) * 2017-06-26 2021-04-28 新光電気工業株式会社 放熱板及びその製造方法と電子部品装置
EP3547360A1 (de) * 2018-03-29 2019-10-02 Siemens Aktiengesellschaft Halbleiterbaugruppe und verfahren zur herstellung der halbleiterbaugruppe
DE112019003372T5 (de) * 2018-07-04 2021-03-18 Mitsubishi Electric Corporation Fahrzeugleistungswandlereinrichtung
WO2020026639A1 (ja) * 2018-08-03 2020-02-06 ソニーセミコンダクタソリューションズ株式会社 半導体装置および撮像装置ならびに半導体装置の製造方法
CN109755197A (zh) * 2019-01-14 2019-05-14 苏州通富超威半导体有限公司 封装结构及其形成方法
CN109887891B (zh) 2019-03-08 2021-01-22 苏州通富超威半导体有限公司 封装结构及其形成方法
CN113133261B (zh) * 2019-12-30 2022-07-22 华为数字能源技术有限公司 一种散热装置、电路板组件及电子设备
US11646302B2 (en) * 2020-03-31 2023-05-09 Apple Inc. Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring
US11444002B2 (en) * 2020-07-29 2022-09-13 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure
CN113543579B (zh) * 2020-11-10 2023-03-21 华为技术有限公司 一种散热组件、电子设备及芯片封装结构
US12262514B2 (en) * 2021-04-08 2025-03-25 International Business Machines Corporation Heat sinks with beyond-board fins
US11557525B2 (en) * 2021-05-25 2023-01-17 Nxp Usa, Inc. Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements
US12119275B2 (en) 2021-08-30 2024-10-15 Apple Inc. Recessed lid and ring designs and lid local peripheral reinforcement designs
GB2611028A (en) * 2021-09-17 2023-03-29 Aptiv Tech Ltd A method of fitting a cooling device to a circuit board and a circuit board cooling device
JP7709902B2 (ja) * 2021-11-30 2025-07-17 Ａｓｔｅｍｏ株式会社 電子制御装置
CN114895171A (zh) * 2022-05-07 2022-08-12 森敏特电子科技(苏州)有限公司 一种基于铟材质的芯片封装测试压头及其测试方法
CN115662907A (zh) * 2022-11-08 2023-01-31 宁波施捷电子有限公司 一种芯片封装方法及设备

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JPS57195841U (enExample) * 1981-06-09 1982-12-11
JPH06252301A (ja) * 1993-02-24 1994-09-09 Hitachi Ltd 電子装置
JP2002343910A (ja) * 2001-05-17 2002-11-29 Tetsuji Kataoka ヒートシンク並びにその製造方法
US6707671B2 (en) * 2001-05-31 2004-03-16 Matsushita Electric Industrial Co., Ltd. Power module and method of manufacturing the same
JP3830860B2 (ja) 2001-05-31 2006-10-11 松下電器産業株式会社 パワーモジュールとその製造方法
US6822867B2 (en) * 2001-06-29 2004-11-23 Intel Corporation Electronic assembly with solderable heat sink and methods of manufacture
JP2004119882A (ja) 2002-09-27 2004-04-15 Sony Corp 半導体装置
JP4039316B2 (ja) * 2003-06-09 2008-01-30 株式会社明電舎 電子機器の冷却構造
US20050111188A1 (en) * 2003-11-26 2005-05-26 Anandaroop Bhattacharya Thermal management device for an integrated circuit
US7633752B2 (en) * 2004-03-29 2009-12-15 Intel Corporation Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
US20080128897A1 (en) * 2006-12-05 2008-06-05 Tong Wa Chao Heat spreader for a multi-chip package
CN101232794B (zh) * 2007-01-24 2011-11-30 富准精密工业(深圳)有限公司 均热板及散热装置
JP2009260169A (ja) * 2008-04-21 2009-11-05 Sumitomo Electric Ind Ltd ヒートシンク及び放熱装置

Also Published As

Publication number Publication date
US8520388B2 (en) 2013-08-27
JP2011134769A (ja) 2011-07-07
US20110149537A1 (en) 2011-06-23

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