JP5726698B2 - ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品 - Google Patents

ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品 Download PDF

Info

Publication number
JP5726698B2
JP5726698B2 JP2011213739A JP2011213739A JP5726698B2 JP 5726698 B2 JP5726698 B2 JP 5726698B2 JP 2011213739 A JP2011213739 A JP 2011213739A JP 2011213739 A JP2011213739 A JP 2011213739A JP 5726698 B2 JP5726698 B2 JP 5726698B2
Authority
JP
Japan
Prior art keywords
glass
mass
glass composition
paste
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011213739A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013032255A5 (enExample
JP2013032255A (ja
Inventor
沢井　裕一
裕一 沢井
内藤　孝
内藤　　孝
拓也 青柳
拓也 青柳
正 藤枝
藤枝　　正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2011213739A priority Critical patent/JP5726698B2/ja
Priority to TW101121331A priority patent/TWI477474B/zh
Priority to TW103146338A priority patent/TWI567043B/zh
Priority to PCT/JP2012/066161 priority patent/WO2013005600A1/ja
Priority to US14/129,483 priority patent/US10252938B2/en
Priority to KR1020137033990A priority patent/KR101521376B1/ko
Priority to CN201280031531.6A priority patent/CN103648999B/zh
Publication of JP2013032255A publication Critical patent/JP2013032255A/ja
Publication of JP2013032255A5 publication Critical patent/JP2013032255A5/ja
Application granted granted Critical
Publication of JP5726698B2 publication Critical patent/JP5726698B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/48—Sealing, e.g. seals specially adapted for leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/90—Leading-in arrangements; Seals therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Gas-Filled Discharge Tubes (AREA)
JP2011213739A 2011-07-04 2011-09-29 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品 Active JP5726698B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011213739A JP5726698B2 (ja) 2011-07-04 2011-09-29 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品
TW103146338A TWI567043B (zh) 2011-07-04 2012-06-14 A glass composition, a glass frit containing it, a glass paste containing it, and an electrical and electronic component
TW101121331A TWI477474B (zh) 2011-07-04 2012-06-14 A glass composition, a glass frit containing it, a glass paste containing it, and an electrical and electronic component
US14/129,483 US10252938B2 (en) 2011-07-04 2012-06-25 Glass composition, glass frit containing same, glass paste containing same, and electrical/electronic component obtained using same
PCT/JP2012/066161 WO2013005600A1 (ja) 2011-07-04 2012-06-25 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品
KR1020137033990A KR101521376B1 (ko) 2011-07-04 2012-06-25 글래스 조성물, 그것을 포함하는 글래스 프릿, 그것을 포함하는 글래스 페이스트 및 그것을 이용한 전기 전자 부품
CN201280031531.6A CN103648999B (zh) 2011-07-04 2012-06-25 玻璃组合物、包含其的玻璃料、包含其的玻璃膏、及利用其的电气电子零件

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011147950 2011-07-04
JP2011147950 2011-07-04
JP2011213739A JP5726698B2 (ja) 2011-07-04 2011-09-29 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015074701A Division JP6027171B2 (ja) 2011-07-04 2015-04-01 封着用ガラスフリット、封着用ガラスペースト、導電性ガラスペースト、およびそれらを利用した電気電子部品

Publications (3)

Publication Number Publication Date
JP2013032255A JP2013032255A (ja) 2013-02-14
JP2013032255A5 JP2013032255A5 (enExample) 2013-10-10
JP5726698B2 true JP5726698B2 (ja) 2015-06-03

Family

ID=47436955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011213739A Active JP5726698B2 (ja) 2011-07-04 2011-09-29 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品

Country Status (5)

Country Link
US (1) US10252938B2 (enExample)
JP (1) JP5726698B2 (enExample)
KR (1) KR101521376B1 (enExample)
TW (2) TWI477474B (enExample)
WO (1) WO2013005600A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021038905A1 (ja) 2019-08-30 2021-03-04 昭和電工マテリアルズ株式会社 無鉛低融点ガラス組成物並びにこれを含む低融点ガラス複合材料及び低融点ガラスペースト並びにこれらを用いた封止構造体、電気電子部品及び塗装部品

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5667970B2 (ja) 2011-12-26 2015-02-12 株式会社日立製作所 複合材料
JP5712123B2 (ja) 2011-12-26 2015-05-07 株式会社日立製作所 複合材料
JP5732414B2 (ja) 2012-01-26 2015-06-10 株式会社日立製作所 接合体および半導体モジュール
JP5816565B2 (ja) 2012-01-26 2015-11-18 株式会社日立産機システム インク、被印字基材、印字装置、印字方法、被印字基材の製造方法
US20150337106A1 (en) * 2012-12-26 2015-11-26 Hitachi, Ltd. Low-Melting-Point Glass Resin Composite Material and Electronic/Electric Apparatus Using Same
KR101633013B1 (ko) * 2012-12-31 2016-06-24 주식회사 아모그린텍 연성인쇄회로기판
CN105073672B (zh) * 2013-02-01 2019-04-12 纳美仕有限公司 玻璃料
EP2960936A4 (en) * 2013-02-22 2016-10-19 Hitachi Ltd RESIN SEALED ELECTRONIC CONTROL DEVICE
JP5947238B2 (ja) 2013-03-25 2016-07-06 株式会社日立製作所 ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法
JP5844299B2 (ja) * 2013-03-25 2016-01-13 株式会社日立製作所 接合材、接合構造体
JP5941006B2 (ja) * 2013-03-25 2016-06-29 株式会社 日立パワーデバイス 接合材、接合構造体およびその製造方法、並びに半導体モジュール
JP2015044695A (ja) * 2013-08-27 2015-03-12 旭硝子株式会社 封着用ガラス、封着材料、および封着用ペースト
JP2015063445A (ja) * 2013-08-29 2015-04-09 セントラル硝子株式会社 無鉛ガラス及び封着材料
EP3078643A4 (en) * 2013-12-04 2017-07-26 Hitachi, Ltd. Sealed structure, multi-layer heat-insulating glass and glass container
TWI652694B (zh) 2014-01-17 2019-03-01 Namics Corporation 導電性糊及使用該導電性糊製造半導體裝置之方法
WO2015123254A1 (en) * 2014-02-13 2015-08-20 Corning Incorporated Ultra low melting glass frit and fibers
KR101670891B1 (ko) * 2014-08-08 2016-11-09 (주)파트론 수정 진동자 패키지 및 이의 제조 방법
JP6350126B2 (ja) * 2014-08-29 2018-07-04 日立化成株式会社 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品
JP6350127B2 (ja) 2014-08-29 2018-07-04 日立化成株式会社 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品
CN106536437B (zh) 2014-09-19 2019-12-13 株式会社日立制作所 散热结构体及利用了散热结构体的半导体模块
DE102014014322B4 (de) 2014-10-01 2017-11-23 Ferro Gmbh Tellurat-Fügeglas mit Verarbeitungstemperaturen ≦ 400 °C
KR20160057583A (ko) * 2014-11-13 2016-05-24 삼성에스디아이 주식회사 태양전지 전극용 페이스트 및 이로부터 제조된 전극
KR20160076002A (ko) * 2014-12-19 2016-06-30 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP2018109073A (ja) * 2015-03-31 2018-07-12 株式会社日立製作所 複合材組成物、及びそれを用いたペースト剤
JP6507826B2 (ja) * 2015-04-28 2019-05-08 日立化成株式会社 導電性接合体および該接合体の製造方法
KR102483950B1 (ko) * 2015-04-28 2023-01-03 삼성디스플레이 주식회사 디스플레이 장치 실링용 조성물, 이를 포함한 유기발광 디스플레이 장치 및 그 제조방법
CN108463440B (zh) 2016-01-18 2021-09-21 株式会社日立制作所 无铅玻璃组合物、玻璃复合材料、玻璃糊剂、密封结构体、电气电子部件和涂装部件
JP6486866B2 (ja) 2016-05-27 2019-03-20 日立オートモティブシステムズ株式会社 物理量測定装置およびその製造方法ならびに物理量測定素子
CN107686248A (zh) * 2016-08-04 2018-02-13 江苏正能电子科技有限公司 一种晶体硅太阳能电池背面银浆用无铅玻璃粉
JP2018058709A (ja) 2016-10-03 2018-04-12 日立化成株式会社 真空断熱部材、それに用いる封止材料、及び真空断熱部材の製造方法
CN110100317B (zh) 2016-12-13 2022-09-30 信越化学工业株式会社 高效背面接触型太阳能电池单元、太阳能电池组件和光伏发电系统
KR101785604B1 (ko) * 2017-03-30 2017-10-17 알무스이앤티 주식회사 바나듐계 유리 조성물 및 이를 이용하여 제조한 바나듐계 유리재
JP6972969B2 (ja) * 2017-11-28 2021-11-24 昭和電工マテリアルズ株式会社 封止材料及びこれを用いた複層ガラスパネル
JP2019123637A (ja) * 2018-01-16 2019-07-25 日立化成株式会社 接合材
JP7090838B2 (ja) * 2018-02-16 2022-06-27 日本電気硝子株式会社 ガラス組成物及び封着材料
WO2019164059A1 (ko) 2018-02-23 2019-08-29 엘지전자 주식회사 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체
KR102379839B1 (ko) * 2018-02-23 2022-03-28 엘지전자 주식회사 강화 유리에 적합한 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체
KR102599092B1 (ko) 2018-06-27 2023-11-08 삼성디스플레이 주식회사 글래스 프릿 및 이를 포함하는 표시장치
JP7185182B2 (ja) * 2018-10-05 2022-12-07 日本電気硝子株式会社 ガラス組成物及び封着材料
KR102217221B1 (ko) 2018-11-09 2021-02-18 엘지전자 주식회사 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체
KR102752872B1 (ko) 2018-11-26 2025-01-09 오웬스 코닝 인텔렉츄얼 캐피탈 엘엘씨 향상된 탄성 계수를 갖는 고성능 섬유 유리 조성물
EP3887328A2 (en) 2018-11-26 2021-10-06 Owens Corning Intellectual Capital, LLC High performance fiberglass composition with improved specific modulus
JP7172650B2 (ja) * 2019-01-25 2022-11-16 日本電気硝子株式会社 ガラス粉末及びそれを用いた封着材料
KR102217222B1 (ko) 2019-01-30 2021-02-19 엘지전자 주식회사 무연계 저온 소성 글라스 프릿, 페이스트 및 이를 이용한 진공 유리 조립체
JP7028226B2 (ja) * 2019-08-30 2022-03-02 昭和電工マテリアルズ株式会社 無鉛低融点ガラス組成物、低融点ガラス複合材料、ガラスペースト及び応用製品
IT201900018890A1 (it) * 2019-10-15 2021-04-15 Luca Toncelli Metodo per la produzione di materiali granulati atti ad essere utilizzati per la realizzazione di manufatti in lastra o blocco a partire da un impasto
US11075308B1 (en) * 2020-06-19 2021-07-27 Pharos Materials, Inc. Vanadium-containing electrodes and interconnects to transparent conductors
JP2021022735A (ja) * 2020-09-21 2021-02-18 アートビーム株式会社 太陽電池および太陽電池の製造方法
KR102979226B1 (ko) * 2020-10-08 2026-06-18 삼성전기주식회사 적층 세라믹 전자부품
CN114031298A (zh) * 2021-11-30 2022-02-11 深圳市绚图新材科技有限公司 一种导电浆料用的低熔点无铅玻璃粉及其制备方法
WO2025038294A1 (en) 2023-08-15 2025-02-20 Restek Corporation Capillary ampules and capillary ampule systems
CN119673522A (zh) * 2024-12-03 2025-03-21 浙江凯盈新材料有限公司 金属化浆料、使用其制造的电极和光伏电池

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798114A (en) 1971-05-11 1974-03-19 Owens Illinois Inc Glasses with high content of silver oxide
JPS571499B1 (enExample) * 1971-05-11 1982-01-11
JPS61242927A (ja) * 1985-04-20 1986-10-29 Agency Of Ind Science & Technol 感湿性ガラス粉末焼結体の製造方法
US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
DE4128804A1 (de) * 1991-08-30 1993-03-04 Demetron Bleifreies, niedrigschmelzendes glas
US5334558A (en) * 1992-10-19 1994-08-02 Diemat, Inc. Low temperature glass with improved thermal stress properties and method of use
JP3339647B2 (ja) * 1993-03-03 2002-10-28 旭テクノグラス株式会社 無鉛系低融点ガラス及び封着用ガラス組成物
JPH08259262A (ja) * 1995-03-20 1996-10-08 Nippon Electric Glass Co Ltd 低融点封着用組成物
JP2001028290A (ja) * 1999-05-07 2001-01-30 Ibiden Co Ltd ホットプレート及び導体ペースト
US6248680B1 (en) * 1999-06-01 2001-06-19 Alliedsignal, Inc. Low temperature burnout screen printing frit vehicles and pastes
JP2003192378A (ja) 2001-12-25 2003-07-09 Yamato Denshi Kk 封着加工用無鉛低融点ガラス
JP4299021B2 (ja) 2003-02-19 2009-07-22 ヤマト電子株式会社 封着加工材及び封着加工用ペースト
US7435361B2 (en) 2005-04-14 2008-10-14 E.I. Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices
JP5041323B2 (ja) 2005-05-09 2012-10-03 日本電気硝子株式会社 粉末材料及びペースト材料
JP5257827B2 (ja) * 2006-09-14 2013-08-07 日本電気硝子株式会社 封着材料
JPWO2008078374A1 (ja) * 2006-12-25 2010-04-15 ナミックス株式会社 太陽電池用導電性ペースト
JP4885781B2 (ja) 2007-03-30 2012-02-29 日立粉末冶金株式会社 導電性ペースト
JP5525714B2 (ja) 2008-02-08 2014-06-18 日立粉末冶金株式会社 ガラス組成物
JP5414409B2 (ja) 2009-01-16 2014-02-12 日立粉末冶金株式会社 低融点ガラス組成物、それを用いた低温封着材料及び電子部品
JP5732381B2 (ja) 2011-12-26 2015-06-10 株式会社日立製作所 積層体及びこれを用いた有機ｅｌ素子、窓、太陽電池モジュール
JP5667970B2 (ja) 2011-12-26 2015-02-12 株式会社日立製作所 複合材料
JP5712123B2 (ja) 2011-12-26 2015-05-07 株式会社日立製作所 複合材料
JP5732414B2 (ja) 2012-01-26 2015-06-10 株式会社日立製作所 接合体および半導体モジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021038905A1 (ja) 2019-08-30 2021-03-04 昭和電工マテリアルズ株式会社 無鉛低融点ガラス組成物並びにこれを含む低融点ガラス複合材料及び低融点ガラスペースト並びにこれらを用いた封止構造体、電気電子部品及び塗装部品
US12606479B2 (en) 2019-08-30 2026-04-21 Resonac Corporation Lead-free low-melting glass composition and low-melting glass composite material and low-melting glass paste containing lead-free low-melting glass composition, and sealing structure, electrical and electronic part and coated part using same

Also Published As

Publication number Publication date
WO2013005600A1 (ja) 2013-01-10
US10252938B2 (en) 2019-04-09
CN103648999A (zh) 2014-03-19
TWI477474B (zh) 2015-03-21
TW201313648A (zh) 2013-04-01
TW201514121A (zh) 2015-04-16
TWI567043B (zh) 2017-01-21
KR20140024020A (ko) 2014-02-27
JP2013032255A (ja) 2013-02-14
US20140145122A1 (en) 2014-05-29
KR101521376B1 (ko) 2015-05-18

Similar Documents

Publication Publication Date Title
JP6434942B2 (ja) ガラス組成物、該ガラス組成物を含むガラスフリット、および該ガラス組成物を含むガラスペースト
KR101521376B1 (ko) 글래스 조성물, 그것을 포함하는 글래스 프릿, 그것을 포함하는 글래스 페이스트 및 그것을 이용한 전기 전자 부품
JP6350127B2 (ja) 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品
JP2013103840A (ja) 導電性ガラスペースト及びそれを利用した電気電子部品
CN102318013B (zh) 导电性浆料及具备使用其的电极配线的电子部件
CN102835192B (zh) 电子部件、导电性浆料以及电子部件的制造方法
JP5673316B2 (ja) 電子部品、それに適用されるアルミニウム電極用導電性ペースト、及びアルミニウム電極用ガラス組成物
WO2013024829A1 (ja) はんだ接着体、はんだ接着体の製造方法、素子、太陽電池、素子の製造方法および太陽電池の製造方法
CN108463440B (zh) 无铅玻璃组合物、玻璃复合材料、玻璃糊剂、密封结构体、电气电子部件和涂装部件
KR20120032568A (ko) 페이스트 조성물 및 그를 이용한 태양 전지 소자
CN102549763A (zh) 太阳能电池电极用无铅导电性组合物
CN103688365A (zh) 元件及太阳能电池
JP6155965B2 (ja) 電極形成用ガラス粉末および電極形成用導電ペースト
JP2005504409A (ja) 銀導体組成物
JP5494619B2 (ja) 電子部品、それに適用されるアルミニウム電極用導電性ペースト、及びアルミニウム電極用ガラス組成物
JP5747096B2 (ja) 導電性ペースト
KR20230055847A (ko) 태양 전지 전극 형성용 유리 프릿 조성물, 이를 사용하여 형성된 태양 전지용 전극, 및 상기 전극을 포함하는 태양 전지
JP5546074B2 (ja) 導電性ペースト及びそれを用いた電極配線を具備する電子部品
JP2021147263A (ja) ガラス組成物のペースト、該ガラス組成物を利用した封止構造体および電気電子部品
CN103648999B (zh) 玻璃组合物、包含其的玻璃料、包含其的玻璃膏、及利用其的电气电子零件

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130823

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130823

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141216

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150212

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150303

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150401

R150 Certificate of patent or registration of utility model

Ref document number: 5726698

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150