JP5707662B2 - 熱硬化型エポキシ樹脂組成物 - Google Patents
熱硬化型エポキシ樹脂組成物 Download PDFInfo
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- JP5707662B2 JP5707662B2 JP2008044587A JP2008044587A JP5707662B2 JP 5707662 B2 JP5707662 B2 JP 5707662B2 JP 2008044587 A JP2008044587 A JP 2008044587A JP 2008044587 A JP2008044587 A JP 2008044587A JP 5707662 B2 JP5707662 B2 JP 5707662B2
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Polyethers (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
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| JP2008044587A JP5707662B2 (ja) | 2008-01-25 | 2008-02-26 | 熱硬化型エポキシ樹脂組成物 |
| PCT/JP2008/069085 WO2009093364A1 (ja) | 2008-01-25 | 2008-10-22 | 熱硬化型エポキシ樹脂組成物 |
| CN2008801254972A CN101925628B (zh) | 2008-01-25 | 2008-10-22 | 热固化型环氧树脂组合物 |
| US12/734,291 US8349973B2 (en) | 2008-01-25 | 2008-10-22 | Thermosetting epoxy resin composition |
| TW097141550A TWI382036B (zh) | 2008-01-25 | 2008-10-29 | Thermosetting epoxy resin composition |
| HK11106279.6A HK1152324A1 (zh) | 2008-01-25 | 2011-06-20 | 熱固化型環氧樹脂組合物 |
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| JP2008014427 | 2008-01-25 | ||
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| JP2008044587A JP5707662B2 (ja) | 2008-01-25 | 2008-02-26 | 熱硬化型エポキシ樹脂組成物 |
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| JP2009197206A JP2009197206A (ja) | 2009-09-03 |
| JP5707662B2 true JP5707662B2 (ja) | 2015-04-30 |
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| JP2008044587A Active JP5707662B2 (ja) | 2008-01-25 | 2008-02-26 | 熱硬化型エポキシ樹脂組成物 |
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| Country | Link |
|---|---|
| US (1) | US8349973B2 (zh) |
| JP (1) | JP5707662B2 (zh) |
| CN (1) | CN101925628B (zh) |
| HK (1) | HK1152324A1 (zh) |
| TW (1) | TWI382036B (zh) |
| WO (1) | WO2009093364A1 (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10669458B2 (en) | 2016-06-15 | 2020-06-02 | Dexerials Corporation | Thermosetting epoxy resin composition and production method for same |
| US11773208B2 (en) | 2018-06-13 | 2023-10-03 | Dexerials Corporation | Cationically curable composition and cured product production method |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4381255B2 (ja) * | 2003-09-08 | 2009-12-09 | ソニーケミカル＆インフォメーションデバイス株式会社 | 潜在性硬化剤 |
| JP5146645B2 (ja) * | 2007-08-28 | 2013-02-20 | デクセリアルズ株式会社 | マイクロカプセル型潜在性硬化剤 |
| JP5321082B2 (ja) * | 2009-01-21 | 2013-10-23 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤及びその製造方法 |
| JP5481995B2 (ja) * | 2009-07-24 | 2014-04-23 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤及びそれらの製造方法 |
| JP5476988B2 (ja) * | 2009-12-30 | 2014-04-23 | デクセリアルズ株式会社 | 電気装置及びそれに用いるエポキシ樹脂組成物 |
| JP5365811B2 (ja) * | 2010-06-28 | 2013-12-11 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤 |
| CN105209425B (zh) * | 2013-05-16 | 2017-12-12 | 信越化学工业株式会社 | 铝螯合化合物以及含有铝螯合化合物的室温固化性树脂组合物 |
| KR102055114B1 (ko) | 2015-06-02 | 2019-12-12 | 데쿠세리아루즈 가부시키가이샤 | 접착제 조성물 |
| US10626215B2 (en) | 2015-12-17 | 2020-04-21 | Dexerials Corporation | Process for producing aluminum-chelate-based latent curing agent, and thermosetting epoxy resin composition |
| JP2017122144A (ja) * | 2016-01-05 | 2017-07-13 | デクセリアルズ株式会社 | 接着剤組成物 |
| JP6670688B2 (ja) * | 2016-06-15 | 2020-03-25 | デクセリアルズ株式会社 | 潜在性硬化剤、及びその製造方法、並びに熱硬化型エポキシ樹脂組成物 |
| JP7257736B2 (ja) * | 2017-07-06 | 2023-04-14 | デクセリアルズ株式会社 | カチオン硬化性組成物 |
| JP7009201B2 (ja) * | 2017-12-21 | 2022-02-10 | デクセリアルズ株式会社 | 化合物、カチオン硬化剤、及びカチオン硬化性組成物 |
| CN113861490B (zh) * | 2021-11-16 | 2022-12-23 | 西北工业大学 | 一种基于液态环氧树脂制备环氧微孔泡沫材料的方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6067531A (ja) * | 1983-09-22 | 1985-04-17 | Toshiba Corp | 樹脂組成物 |
| JPS62227923A (ja) * | 1986-03-31 | 1987-10-06 | Toshiba Corp | エボキシ樹脂組成物 |
| JPH08319342A (ja) * | 1995-05-25 | 1996-12-03 | Dainippon Ink & Chem Inc | 硬化性樹脂組成物 |
| JP3019758B2 (ja) * | 1995-10-02 | 2000-03-13 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
| JP2002212537A (ja) | 2001-01-24 | 2002-07-31 | Sony Chem Corp | 接着剤及び電気装置 |
| JP4089562B2 (ja) * | 2003-08-29 | 2008-05-28 | 日油株式会社 | 熱硬化性組成物 |
| JP4381255B2 (ja) * | 2003-09-08 | 2009-12-09 | ソニーケミカル＆インフォメーションデバイス株式会社 | 潜在性硬化剤 |
| CN1934098B (zh) * | 2004-03-18 | 2012-04-25 | 大赛璐化学工业株式会社 | 高纯度脂环式环氧化合物、其制备方法、可固化环氧树脂组合物、其固化产物及其应用 |
| JP4300418B2 (ja) * | 2004-04-30 | 2009-07-22 | 信越化学工業株式会社 | エポキシ・シリコーン混成樹脂組成物及び発光半導体装置 |
| JP5057011B2 (ja) * | 2005-06-06 | 2012-10-24 | ソニーケミカル＆インフォメーションデバイス株式会社 | 潜在性硬化剤 |
| JP5267757B2 (ja) * | 2006-02-07 | 2013-08-21 | デクセリアルズ株式会社 | 潜在性硬化剤 |
| US8147720B2 (en) * | 2007-01-24 | 2012-04-03 | Sony Corporation | Latent curing agent |
| JP5321082B2 (ja) * | 2009-01-21 | 2013-10-23 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤及びその製造方法 |
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2008
- 2008-02-26 JP JP2008044587A patent/JP5707662B2/ja active Active
- 2008-10-22 US US12/734,291 patent/US8349973B2/en active Active
- 2008-10-22 CN CN2008801254972A patent/CN101925628B/zh active Active
- 2008-10-22 WO PCT/JP2008/069085 patent/WO2009093364A1/ja active Application Filing
- 2008-10-29 TW TW097141550A patent/TWI382036B/zh active
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10669458B2 (en) | 2016-06-15 | 2020-06-02 | Dexerials Corporation | Thermosetting epoxy resin composition and production method for same |
| US11773208B2 (en) | 2018-06-13 | 2023-10-03 | Dexerials Corporation | Cationically curable composition and cured product production method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101925628A (zh) | 2010-12-22 |
| WO2009093364A1 (ja) | 2009-07-30 |
| TWI382036B (zh) | 2013-01-11 |
| JP2009197206A (ja) | 2009-09-03 |
| US20100249338A1 (en) | 2010-09-30 |
| HK1152324A1 (zh) | 2012-02-24 |
| US8349973B2 (en) | 2013-01-08 |
| CN101925628B (zh) | 2013-11-13 |
| TW200936633A (en) | 2009-09-01 |
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