JP5212597B2 - 潜在性硬化剤 - Google Patents
潜在性硬化剤 Download PDFInfo
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- JP5212597B2 JP5212597B2 JP2007203384A JP2007203384A JP5212597B2 JP 5212597 B2 JP5212597 B2 JP 5212597B2 JP 2007203384 A JP2007203384 A JP 2007203384A JP 2007203384 A JP2007203384 A JP 2007203384A JP 5212597 B2 JP5212597 B2 JP 5212597B2
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- 239000003795 chemical substances by application Substances 0.000 claims description 81
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 55
- 229910052782 aluminium Inorganic materials 0.000 claims description 55
- 229920001187 thermosetting polymer Polymers 0.000 claims description 53
- -1 isocyanate compound Chemical class 0.000 claims description 45
- 239000002738 chelating agent Substances 0.000 claims description 40
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 239000012948 isocyanate Substances 0.000 claims description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 33
- 238000012695 Interfacial polymerization Methods 0.000 claims description 29
- 239000008119 colloidal silica Substances 0.000 claims description 29
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 25
- 239000003431 cross linking reagent Substances 0.000 claims description 25
- 239000011342 resin composition Substances 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 19
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- 238000004519 manufacturing process Methods 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 12
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- 229940093858 ethyl acetoacetate Drugs 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
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- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 claims 1
- 229930006000 Sucrose Natural products 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 239000003446 ligand Substances 0.000 claims 1
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- 238000001723 curing Methods 0.000 description 105
- 230000000052 comparative effect Effects 0.000 description 17
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 17
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
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- 125000002091 cationic group Chemical group 0.000 description 2
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- 150000002513 isocyanates Chemical class 0.000 description 2
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- 239000011148 porous material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000012669 compression test Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004849 latent hardener Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Polyurethanes Or Polyureas (AREA)
Description
蒸留水800質量部と、界面活性剤(ニューレックスR−T、日本油脂(株)社)0.05質量部と、分散剤としてポリビニルアルコール(PVA−205、(株)クラレ社)4質量部とを温度計を備えた3リットルの界面重合容器に入れ、均一に混合した。この混合液に、更に、アルミニウムモノアセチルアセトネートビス(エチルアセトアセテート)の24%イソプロパノール溶液(アルミキレートD、川研ファインケミカル(株)社)35質量部と、ジビニルベンゼン20質量部と、コロイダルシリカ(EAC−ST、日産化学社)15質量と、メチレンジフェニル−4,4’−ジイソシアネート(3モル)のトリメチロールプロパン(1モル)付加物(D−109、三井武田ケミカル(株)社)50質量部、重合開始剤(パーロイルL、日本油脂社)0.2質量部とを、酢酸エチル70質量部に混合した油相を投入し、ホモジナイザー(11000rpm/10分)で乳化混合後、80℃で6時間界面重合させた。
コロイダルシリカを30質量部使用すること以外は、実施例1の操作を繰り返すことにより、粒径10μm程度の球状の潜在性硬化剤80質量部を得、更に実施例2の熱硬化型エポキシ樹脂組成物を調製した。
コロイダルシリカを使用しないこと以外は、実施例1の操作を繰り返すことにより、粒径10μm程度の球状の潜在性硬化剤80質量部を得、更に比較例1の熱硬化型エポキシ樹脂組成物を調製した。
実施例1、2及び比較例1で得られた熱硬化型エポキシ樹脂組成物を、示差走査熱分析装置(DSC)(DSC6200、セイコーインスツル(株)社)を用いて熱分析した。得られた結果を表1及び図3に示す。ここで、潜在性硬化剤の硬化特性に関し、発熱開始温度は硬化開始温度を意味しており、発熱ピーク温度は最も硬化が活性となる温度を意味しており、発熱ピーク強度は発熱ピーク温度におけるピーク強度を意味しており、そしてピーク面積は発熱量を意味している。
実施例2の潜在性硬化剤2質量部に、脂環式エポキシ樹脂(CEL−2021P、ダイセル化学工業(株)社)90質量部及びシランカップリング剤(KBM−5103、信越化学工業社)2質量部を均一に混合することにより実施例3の熱硬化型エポキシ樹脂組成物を調製した。
実施例3で得られた熱硬化型エポキシ樹脂組成物を、示差走査熱分析装置(DSC)(DSC6200、セイコーインスツル(株)社)を用いて熱分析した。得られた結果を表2及び図4に示す。なお、表2及び図4には、実施例2で得られた熱硬化型エポキシ樹脂組成物のデータを参考のために併せて記載する。
蒸留水800質量部と、界面活性剤(ニューレックスR−T、日本油脂(株)社)0.05質量部と、分散剤としてポリビニルアルコール(PVA−205、(株)クラレ社)4質量部とを温度計を備えた3リットルの界面重合容器に入れ、均一に混合した。この混合液に、更に、アルミニウムモノアセチルアセトネートビス(エチルアセトアセテート)の24%イソプロパノール溶液(アルミキレートD、川研ファインケミカル(株)社)14質量部と、コロイダルシリカ(EAC−ST、日産化学社)30質量と、メチレンジフェニル−4,4’−ジイソシアネート(3モル)のトリメチロールプロパン(1モル)付加物(D−109、三井武田ケミカル(株)社)11質量部とを、酢酸エチル60質量部に混合した油相を投入し、ホモジナイザー(11000rpm/10分)で乳化混合後、80℃で6時間界面重合させた。
比較例2で製造した異形形状のマイクロカプセル粒子の潜在性硬化剤を使用し、シランカップリング剤の量を2質量部とする以外は、比較例2の操作を繰り返すことにより、比較例3の熱硬化型エポキシ樹脂組成物を調製した。
比較例2及び比較例3で得られた熱硬化型エポキシ樹脂組成物を、示差走査熱分析装置(DSC)(DSC6200、セイコーインスツル(株)社)を用いて熱分析した。得られた結果を表3及び図6に示す。
2…多孔性樹脂マトリックス
3…孔
Claims (9)
- アルミニウムキレート剤とコロイダルシリカとが、多官能イソシアネート化合物を架橋剤の存在下で界面重合させて得た多孔性樹脂に保持されてなることを特徴とする潜在性硬化剤。
- 該架橋剤が、2官能以上のラジカル重合性モノマーである請求項1記載の潜在性硬化剤。
- 該ラジカル重合性モノマーが、ジビニルベンゼンである請求項2記載の潜在性硬化剤。
- アルミニウムキレート剤が、配位子であるβ−ケトエノラート陰イオンがアルミニウムに配位した錯体化合物である請求項1〜3のいずれかに記載の潜在性硬化剤。
- 該錯化合物が、アルミニウムモノアセチルアセトネートビス(エチルアセトアセテート)である請求項4記載の潜在性硬化剤。
- 請求項1記載の潜在性硬化剤の製造方法であって、アルミニウムキレート剤とコロイダルシリカと多官能イソシアネート化合物と架橋剤とを、揮発性有機溶剤に混合し、得られた混合液を、分散剤を含有する水相に投入し、加熱撹拌することにより界面重合させることを特徴とする製造方法。
- 揮発性有機溶剤が、低級アルキル酢酸エステル類である請求項6記載の製造方法。
- 請求項1〜5のいずれかに記載の潜在性硬化剤とシランカップリング剤と熱硬化型樹脂とを含有することを特徴とする熱硬化型樹脂組成物。
- 熱硬化型樹脂が熱硬化型エポキシ樹脂である請求項8記載の熱硬化型樹脂組成物。
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