JP5690125B2 - Semiconductor device - Google Patents

Description

The present invention relates to a semiconductor device using a semiconductor element and a method for manufacturing the semiconductor device.

Note that in this specification, a semiconductor device refers to all devices that can function by utilizing semiconductor characteristics, and semiconductor elements such as transistors, semiconductor circuits using semiconductor elements, electro-optical devices, and electronic devices are all included. It is a semiconductor device.

A technique in which an oxide semiconductor is used for a channel formation region to manufacture a transistor, and the transistor is applied to a semiconductor circuit, an IC, an electro-optical device, an electronic device, or the like has attracted attention.

In particular, an oxide semiconductor with a wide band gap transmits visible light; thus, a light-transmitting transistor is manufactured in combination with a gate electrode, a source electrode, and a drain electrode each using a light-transmitting oxide conductor. Attempts have been made.

For example, as one embodiment of a transistor in which an oxide semiconductor is used for a channel formation region, a semiconductor thin film containing zinc oxide, an In—Ga—Zn—O-based oxide semiconductor, or the like (thickness: Patent Document 1 and Patent Document 2 disclose a technique in which a transistor is formed using a few hundred nanometers) and used as a switching element of an image display device.

In addition, a transistor using an oxide semiconductor for a channel formation region (also referred to as a channel region) has higher field-effect mobility than a transistor using amorphous silicon. In addition, the oxide semiconductor film can be formed by a sputtering method or the like, and the manufacturing process is simpler than a transistor using polycrystalline silicon.

On the other hand, an oxide conductor having translucency with respect to visible light and conductivity is used as a transparent electrode material required for a display device such as a liquid crystal display. Many of the oxide conductors that transmit visible light include a metal oxide having a wide band gap.

As the light-transmitting oxide conductor, for example, indium tin oxide alloy (In ₂ O ₃ —SnO ₂ , abbreviated as ITO), zinc oxide, zinc oxide (AZO) added with aluminum, and gallium are added. Examples thereof include zinc oxide (GZO).

Many of these light-transmitting oxide conductors are oxide semiconductors to which impurities or the like are added. For example, tin is added as an impurity in ITO, aluminum is added in AZO, and gallium is added in GZO as impurities.

It is also known that when the above oxide conductor is formed by a sputtering method, the conductivity changes depending on the film formation conditions. For example, Patent Document 3 and Patent Document 4 disclose a technique for forming an oxide conductive layer having high conductivity in a reducing atmosphere containing hydrogen. It is said that when a film is formed in a reducing atmosphere containing hydrogen, an oxide conductive film containing hydrogen or oxygen vacancies is formed, and the conductivity of the oxide conductive film is improved.

Note that Non-Patent Document 1 suggests that a shallow donor level formed by hydrogen contributes to the reason why zinc oxide, which is an example of an oxide semiconductor having a wide band gap, exhibits conductivity.

Further, the screen resolution of a display device which is one embodiment of a semiconductor device tends to be high definition image quality (HD, 1366 × 768) and full high definition image quality (FHD, 1920 × 1080), and the resolution is 3840 ×. The development of so-called 4K digital cinema display devices such as 2048 or 4096 × 2160 is also urgent.

With such high-definition display devices, pixel miniaturization is remarkable. This is particularly noticeable for small and medium display devices.

In an active matrix semiconductor device in which pixels provided with transistors are arranged in a matrix, the area of the transistors occupying the pixels increases with the miniaturization of the pixels, and so-called reduction in aperture ratio becomes a problem. Thus, a technique for improving the pixel aperture ratio of the semiconductor device using a light-transmitting transistor and applying it to a display device such as a liquid crystal display, an electroluminescent display (also referred to as an EL display), or electronic paper is expected. Has been.

As the number of pixels increases, the writing time per pixel is shortened, and the transistor is required to have high operating characteristics, a large on-state current, and the like. In addition, there has been a problem of energy depletion in recent years, and a display device with reduced power consumption is required. As a result, there is a demand for a transistor that has an off-state normally-off characteristic when the potential of the gate electrode is 0, has a low off-state current, and suppresses unnecessary leakage current.

In addition, a large display device has been developed in consideration of a screen size having a diagonal size of 60 inches or more, and further a diagonal size of 120 inches or more. Therefore, a technique for suppressing an increase in wiring resistance accompanying an increase in screen size is also demanded.

JP 2007-123861 A JP 2007-96055 A JP-A-5-275727 JP-A-9-293893

WALLE. C, “Hydrogen as a Cause of Doping in Zinc Oxide”, PHYS. REV. LETT. (PHYSICAL REVIEW LETTERS), July 31, 2000, Vol. 85, no. 5, pp. 1012-1015

As described above, reduction in power consumption is also required for a transistor having a light-transmitting property. The present invention has been made under such a technical background.

Therefore, an object of the present invention is to provide a transistor having both translucency and so-called normally-off characteristics. Another object is to provide a transistor having light-transmitting properties and characteristics with reduced off-state current. Another object is to provide a transistor having light-transmitting properties and low on-current loss. Another object is to provide a transistor in which a change in characteristics over time is suppressed.

The invention disclosed below aims to solve any one of the above problems.

In order to provide a light-transmitting transistor, a gate electrode, a source electrode, and a drain electrode must be formed using a light-transmitting conductive film. In order to reduce the loss of on-state current of the transistor, it is necessary to increase the conductivity of the source electrode and the drain electrode. Therefore, in the case where a light-transmitting conductive layer is used for a source electrode and a drain electrode of a transistor, an oxide conductive layer is preferable. In particular, an oxide conductive layer containing oxygen deficiency or impurities (for example, hydrogen) that increases conductivity is preferable. This is preferred because the layer has a high conductivity.

In order to provide a transistor having a light-transmitting property, the semiconductor layer including the channel formation region needs to have a light-transmitting property. In order to reduce the power consumption of a transistor, normally-off operation characteristics and transistor characteristics in which off-state current is sufficiently suppressed are required. Therefore, an oxide semiconductor layer with a suppressed carrier concentration and a wide band gap is suitable for a semiconductor layer including a channel formation region.

However, when an oxide conductive layer containing an oxygen deficiency or an impurity (for example, hydrogen) having an effect of increasing conductivity and an oxide semiconductor layer having a wide band gap with a suppressed carrier concentration are directly connected, The following problems arise.

When impurities such as hydrogen contained in the oxide conductive layer diffuse into the oxide semiconductor layer through the interface between the oxide conductive layer and the oxide semiconductor layer, the impurity concentration in the oxide conductive layer decreases, and the oxide semiconductor layer Impurity concentration increases. As a result, a decrease in the impurity concentration of the oxide conductive layer causes a decrease in conductivity, resulting in a large on-current loss of the transistor. In addition, an increase in the impurity concentration of the oxide semiconductor layer causes an increase in carrier concentration, which makes it difficult to realize a transistor having normally-off operation characteristics and characteristics in which off-state current is sufficiently suppressed.

Further, when oxygen diffuses from the oxide semiconductor layer into the oxygen vacancies included in the oxide conductive layer through the interface between the oxide conductive layer and the oxide semiconductor layer, the number of oxygen vacancy portions in the oxide conductive layer is reduced, and the oxide The number of oxygen deficient portions in the semiconductor layer increases. The decrease in oxygen deficient portions included in the oxide conductive layer causes a decrease in conductivity, resulting in a large on-current loss of the transistor. Further, oxygen vacancies generated in the oxide semiconductor layer cause an increase in carrier concentration, which makes it difficult to realize a transistor having normally-off characteristics and characteristics in which off-state current is sufficiently suppressed.

Therefore, in order to achieve the above object, movement of hydrogen and oxygen may be suppressed in a region where an oxide conductive layer which forms a source electrode and a drain electrode is electrically connected to an oxide semiconductor layer.

Specifically, for the oxide semiconductor layer including a channel formation region, an oxide semiconductor in which the carrier concentration is suppressed as much as possible and has a wide band gap is used, and hydrogen is used for the source electrode and the drain electrode. And an oxide conductor containing oxygen vacancies, a barrier layer that inhibits diffusion of hydrogen and oxygen is provided between the oxide conductive layer and the oxide semiconductor layer, and the oxide conductive layer is interposed through the barrier layer. A structure in which the oxide semiconductor layers are electrically connected may be used.

That is, one embodiment of the present invention includes a light-transmitting gate electrode over an insulating surface of a light-transmitting substrate, a first insulating layer over the gate electrode, A semiconductor device includes a purified oxide semiconductor layer, a first electrode overlapping with an end portion of a gate electrode over the oxide semiconductor layer, and a second electrode. The oxide semiconductor layer has a light-transmitting barrier layer between the oxide semiconductor layer and the first electrode and between the oxide semiconductor layer and the second electrode, and a region in which the channel of the oxide semiconductor layer is formed This is a semiconductor device having a second insulating layer in contact with the opposite surface. Note that the carrier concentration of the oxide semiconductor layer is less than 1 × 10 ¹⁴ / cm ³ , the first electrode and the second electrode have a light-transmitting property, and the resistivity is 2000 × 10 ⁻⁶ Ω · The semiconductor device includes an oxide conductor that is equal to or smaller than cm, and the barrier layer includes a nitride.

Another embodiment of the present invention is the above semiconductor device which includes a gate wiring electrically connected to the gate electrode, and the gate wiring includes a metal.

Another embodiment of the present invention includes a first electrode or a signal line that is electrically connected to the second electrode through an opening formed in the second insulating layer, and the signal line is formed using a metal. Including the semiconductor device.

Another embodiment of the present invention is the above semiconductor device in which the third insulating layer is provided over the signal line, and the third insulating layer and the first insulating layer surround and are in contact with each other.

One embodiment of the present invention includes a first capacitor electrode over a substrate, a first insulating layer over the first capacitor electrode, and a second capacitor electrode over the first insulating layer. In the semiconductor device, the first capacitor electrode includes the same material as the gate electrode, and the second capacitor electrode includes the same material as the first electrode and the second electrode.

Another embodiment of the present invention is the above semiconductor device in which the first insulating layer, the second insulating layer, and the oxide semiconductor layer are interposed between intersections of the gate wiring and the signal line.

Another embodiment of the present invention is the above semiconductor device, the second gate electrode, the first insulating layer over the second gate electrode, and the first insulation over the insulating surface of the light-transmitting substrate. The layer includes an oxide semiconductor layer, a channel protective layer overlapping with a channel formation region of the oxide semiconductor layer, a third electrode having an end portion on the channel protective layer, and a fourth electrode. The second gate electrode is made of the same material as the gate wiring, the channel protective layer is made of the same material as the second insulating layer, and the third electrode and the fourth electrode are the same as the signal line. It is a semiconductor device made of a material.

According to one embodiment of the present invention, a gate electrode including a light-transmitting oxide conductor is formed over an insulating surface of a light-transmitting substrate, a first insulating layer is formed over the gate electrode, A light-transmitting oxide semiconductor layer is formed over the first insulating layer, and the temperature of the substrate over which the oxide semiconductor layer is provided in an inert gas atmosphere is 350 ° C. or higher and 700 ° C. or lower. A barrier layer is formed to cover the semiconductor layer, a light-transmitting oxide conductive layer is formed over the barrier layer in a reducing atmosphere, an end portion is overlapped with the gate electrode, and the oxide semiconductor layer is formed over the barrier layer. A first electrode and a second electrode that are electrically connected are formed, and a second insulating layer is formed over the oxide semiconductor layer, the first electrode, and the second electrode. The carrier concentration is 1 × 10 ¹⁴ / cm ³ less than the oxide semiconductor layer and a resistivity of 2000 × ^{10 -6} Ω · cm or less A method for manufacturing a semiconductor device having an oxide conductive layer is.

Note that in this specification, translucency refers to a property of transmitting at least light in the visible wavelength region.

The gate means part or all of the gate electrode and the gate wiring. A gate wiring refers to a wiring for electrically connecting a gate electrode of at least one transistor to another electrode or another wiring. For example, a scanning line in a display device is also included in the gate wiring.

A source refers to a part or the whole of a source region, a source electrode, and a source wiring. A source region refers to a region having a resistivity equal to or lower than a certain value in a semiconductor layer. A source electrode refers to a conductive layer that supplies carriers to a semiconductor layer. A source wiring is a wiring for electrically connecting a source electrode of at least one transistor to another electrode or another wiring. For example, a signal line in a display device is electrically connected to the source electrode. In such a case, a signal line is also included in the source wiring.

The drain means a part or all of the drain region, the drain electrode, and the drain wiring. The drain region refers to a region having a resistivity equal to or lower than a certain value in the semiconductor layer. A drain electrode refers to a conductive layer from which carriers flow out from a semiconductor layer. The drain wiring is a wiring for electrically connecting the drain electrode of at least one transistor to another electrode or another wiring. For example, a signal line in a display device is electrically connected to the drain electrode. In this case, the drain wiring includes a signal line.

In this document (the specification, the claims, the drawings, and the like), the source and the drain of a transistor are interchanged with each other depending on the structure, operating conditions, and the like of the transistor, so that which is the source or the drain is limited. Have difficulty. Therefore, in this document (the description, the claims, the drawings, etc.), one arbitrarily selected from either the source or the drain is represented as one of the source and the drain, and the other terminal is the other of the source and the drain. Is written.

Further, in this specification, silicon nitride oxide has a composition containing more nitrogen than oxygen, and preferably has a composition range of oxygen when measured using RBS and HFS. 5 to 30 atomic%, nitrogen 20 to 55 atomic%, silicon 25 to 35 atomic%, and hydrogen 10 to 30 atomic%. Further, the content ratio of the constituent elements takes a value that the total does not exceed 100 atomic%.

A transistor having light-transmitting properties and normally-off characteristics can be provided. Further, a transistor having characteristics in which light-transmitting properties and off-state current are reduced can be provided. In addition, a transistor having characteristics of translucency and low on-state current loss can be provided. In addition, a transistor having the above-described light-transmitting property, in which change in characteristics over time is suppressed and reliability is excellent can be provided.

6A and 6B illustrate a semiconductor device according to an embodiment. FIG. 10 is a cross-sectional view of a transistor including an oxide semiconductor. The energy band figure (schematic figure) in the A-A 'cross section of FIG. (A) A state in which a positive potential (V _G > 0) is applied to the gate (GE1), and (B) a state in which a negative potential (V _G <0) is applied to the gate (GE1). . The figure which shows the relationship between a vacuum level, a metal work function ((phi) _M ), and the electron affinity ((chi)) of an oxide semiconductor. 6A and 6B illustrate a semiconductor device according to an embodiment. 10A to 10D illustrate a method for manufacturing a semiconductor device according to an embodiment. 8A and 8B illustrate a terminal of a semiconductor device according to an embodiment. 4A and 4B illustrate an inverter circuit according to an embodiment. FIG. 6 illustrates a block diagram of a display device. FIG. 6 illustrates a structure of a signal line driver circuit. FIG. 9 illustrates a structure of a shift register. FIG. 10 is a circuit diagram of a shift register and a timing chart illustrating operation. 6A and 6B illustrate a semiconductor device according to an embodiment. 6A and 6B illustrate a semiconductor device according to an embodiment. 8A and 8B illustrate a pixel equivalent circuit of a semiconductor device according to an embodiment. 6A and 6B illustrate a semiconductor device according to an embodiment. 6A and 6B illustrate a semiconductor device according to an embodiment. 6A and 6B illustrate a semiconductor device according to an embodiment. 8A and 8B illustrate examples of usage forms of electronic paper. An external view showing an example of an electronic book. FIG. 6 is an external view illustrating an example of a television device and a digital photo frame. An external view showing an example of a gaming machine. The external view which shows an example of a mobile telephone.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that in structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated.

(Embodiment 1)
In this embodiment, a bottom-gate transistor that transmits visible light as one embodiment of a semiconductor device is described with reference to FIGS. 1A-1, 1A-2, 1B-1, and FIG. 1 (B-2).

1A-1 and 1A-2 illustrate an example in which a transistor electrode and a wiring connected to the transistor are formed using a light-transmitting conductive film.

1B-1 and 1B-2, a transistor electrode is formed using a light-transmitting conductive film, and a wiring connected to the transistor is formed using a metal-containing conductive film. It is a figure which shows the example to do.

One mode of a structure of a bottom-gate transistor that transmits visible light is illustrated in FIGS. 1A-1 and 1A-2. 1A-1 is a top view illustrating a planar structure of a transistor, and FIG. 1A-2 is a cross-sectional view illustrating a stacked structure of the transistor. Note that a chain line P1-P2 in FIG. 1A-1 corresponds to a cross section P1-P2 in FIG.

A cross section P <b> 1-P <b> 2 shows the stacked structure of the transistor 151. The transistor 151 includes a gate electrode 111a formed using a light-transmitting first conductive layer over a light-transmitting substrate 100, a light-transmitting first insulating layer 102 over the gate electrode 111a, The light-emitting oxide semiconductor layer 123 includes a channel formation region and is in contact with the first insulating layer 102 over the gate electrode 111a.

In addition, the first electrode 115 a and the second electrode 115 b which are formed of a light-transmitting second conductive layer are provided so that end portions overlap with each other over the gate electrode 111 a. Note that the first electrode 115a is electrically connected to the oxide semiconductor layer 123 through the barrier layer 114a, and the second electrode 115b is electrically connected to the oxide semiconductor layer 123 through the barrier layer 114b. Note that the first electrode 115 a and the second electrode 115 b function as a source electrode or a drain electrode of the transistor 151.

In addition, the transistor 151 includes the second insulating layer 107 over the first electrode 115 a, the second electrode 115 b, the first insulating layer 102, and the oxide semiconductor layer 123.

Since all the layers included in the transistor 151 have a light-transmitting property, the transistor 151 has a light-transmitting property.

Another embodiment of the structure of the bottom-gate transistor that transmits visible light is illustrated in FIGS. 1B-1 and 1B-2. FIG. 1B-1 is a top view illustrating a planar structure of a transistor, and FIG. 1B-2 is a cross-sectional view illustrating a stacked structure of the transistor. Note that the chain line Q1-Q2 in FIG. 1B-1 corresponds to the cross section Q1-Q2 in FIG.

A cross section Q1-Q2 illustrates a stacked structure of the transistor 152. The transistor 152 includes a light-transmitting gate electrode 111a over a light-transmitting substrate 100. The gate electrode 111a is connected to a gate wiring layer containing a metal (not shown). The light-transmitting first insulating layer 102 is formed over the gate electrode 111a, and the light-transmitting oxide semiconductor layer 123 including the channel formation region is in contact with the first insulating layer 102 over the gate electrode 111a. .

In addition, the first electrode 115a and the second electrode 115b each having a light-transmitting property are provided so as to overlap an end portion over the gate electrode 111a. Note that the first electrode 115a is electrically connected to the oxide semiconductor layer 123 through the barrier layer 114a, and the second electrode 115b is electrically connected to the oxide semiconductor layer 123 through the barrier layer 114b. Note that the first electrode 115 a and the second electrode 115 b function as a source electrode or a drain electrode of the transistor 152.

In addition, the second insulating layer 107 is provided over the first electrode 115 a, the second electrode 115 b, the oxide semiconductor layer 123, and the first insulating layer 102. The signal line 116a is connected to the first electrode 115a through the opening 127a formed in the second insulating layer 107, and the signal line 116b is connected to the second electrode through the opening 127b formed in the second insulating layer 107. The electrode 115b is connected.

In addition, the transistor 152 includes the third insulating layer 108 over the signal line 116 a, the signal line 116 b, and the second insulating layer 107. Further, the conductive layer 129 may be provided over the third insulating layer 108.

Note that the insulating layer 102a which is part of the first insulating layer and the third insulating layer 108 are in contact with each other through the opening 126a and the opening 126b formed in the second insulating layer 107. When the insulating layer 102a is the same type of insulating layer as the third insulating layer 108, the insulating layer 102a is in close contact with each other and surrounds and surrounds the transistor 152.

Note that since all the layers included in the transistor 152 have a light-transmitting property, the transistor 152 has a light-transmitting property. In addition, since the electrode of the transistor 152 is connected to a wiring formed using a conductive film containing a metal, a semiconductor device in which wiring resistance is suppressed can be formed. In addition, since the transistor 152 is surrounded by the same kind of insulating layer, diffusion of impurities from the outside is suppressed, and the transistor 152 has excellent reliability.

Further, by providing the conductive layer 129 in a position overlapping with the channel formation region of the oxide semiconductor layer 123, the amount of change in the threshold voltage of the transistor 152 in the bias-thermal stress test (hereinafter referred to as the BT test) is reduced. Can do. In addition, as stress conditions used for a BT test, 2 * 10 < ⁶ > V / cm and 12 hours can be mentioned in 85 degreeC environment.

In this embodiment, a highly purified In—Ga—Zn—O-based oxide semiconductor having a wide band gap and a carrier concentration of less than 1 × 10 ¹⁴ / cm ³ is used as the oxide semiconductor layer 123. .

Highly purified, carrier concentration is suppressed to less than 1 × 10 ¹⁴ / cm ^3, preferably 1 × 10 ¹² / cm ³ or less, and wide band gap (specifically 2 eV or more, preferably 2.5 eV or more, more preferably A transistor in which an oxide semiconductor layer having a voltage of 3 eV or more is used for a channel formation region is turned off (so-called normally-off characteristics) when the potential of the gate electrode is 0. A transistor manufactured using such an oxide semiconductor has low off-state current.

Note that an oxide semiconductor having a wide band gap is used as the semiconductor layer in which a channel of the transistor is formed, which is highly purified to have a carrier concentration of less than 1 × 10 ¹⁴ / cm ³ , preferably 1 × 10 ¹² / cm ³ or less. The significance of this will be described in detail at the end of the present embodiment.

Examples of the oxide semiconductor layer include an In—Sn—Ga—Zn—O-based layer that is a quaternary metal oxide, an In—Ga—Zn—O-based layer that is a ternary metal oxide, and In—Sn—. Zn—O based layer, In—Al—Zn—O based layer, Sn—Ga—Zn—O based layer, Al—Ga—Zn—O based layer, Sn—Al—Zn—O based layer, binary system Metal oxide In—Zn—O-based layer, Sn—Zn—O-based layer, Al—Zn—O-based layer, Zn—Mg—O-based layer, Sn—Mg—O-based layer, In—Mg—O An oxide semiconductor layer such as an In—O-based layer, an Sn—O-based layer, or a Zn—O-based layer that is a single-component metal oxide can be used. Further, the oxide semiconductor layer may include SiO ₂ .

There is an oxide semiconductor material represented as InMO ₃ (ZnO) _m (m> 0). Here, M represents one metal element or a plurality of metal elements selected from gallium (Ga), aluminum (Al), iron (Fe), nickel (Ni), manganese (Mn), cobalt (Co), and the like. . For example, as M, Ga, Ga and Al, Ga and Fe, Ga and Ni, Ga and Mn, Ga and Co, and the like can be applied. An oxide semiconductor represented by InGaO ₃ (ZnO) _m (m> 0) in which Ga is used for M is a typical example of the above-described In—Ga—Zn—O-based oxide semiconductor material. It should be noted that the above composition is derived from the crystal structure and is merely an example.

As the oxide semiconductor layer, a layer that has been subjected to dehydration or dehydrogenation treatment at high temperature and short time by an RTA (Rapid Thermal Annealing) method or the like is used. In the oxide semiconductor layer, oxygen vacancies are generated by the dehydration or dehydrogenation step. Therefore, oxygen needs to be supplied to the oxygen deficient part. Through this process, the oxide semiconductor layer is highly purified. The carrier concentration of the highly purified oxide semiconductor layer is suppressed to less than 1 × 10 ¹⁴ / cm ³ , preferably 1 × 10 ¹² / cm ³ or less.

In this embodiment, the first conductive layer including the gate electrode 111a and the second conductive layer including the first electrode 115a and the second electrode 115b are formed using a light-transmitting conductive film.

Note that a light-transmitting conductive film indicates a film thickness with a visible light transmittance of 75 to 100%. Alternatively, a conductive film that is translucent to visible light may be used. Translucent to visible light means that the visible light transmittance is 50 to 75%.

In addition, the electrical resistivity of the light-transmitting conductive film used as the gate electrode, the first electrode, and the second electrode is 200 × 10 ⁻⁶ Ω · cm to 2000 × 10 ⁻⁶ Ω · cm, preferably 250 × 10 ⁻⁶ Ω · cm or more and 2000 × 10 ⁻⁶ Ω · cm or less.

An oxide conductive film is preferable as the light-transmitting conductive film. Specifically, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium tin oxide (hereinafter referred to as ITO). ), Indium zinc oxide, indium tin oxide to which silicon oxide is added, or the like can be used. Note that indium tin oxide to which silicon oxide is added becomes an amorphous film with excellent crystallinity and excellent workability. Alternatively, zinc oxide, zinc oxide to which aluminum is added, zinc oxide to which gallium is added, or the like can be used. In this embodiment, indium tin oxide (ITO) is used.

The conductivity of the light-transmitting oxide conductive layer can be increased depending on the composition, impurities to be added, and film formation conditions. For example, the conductivity of an oxide conductive layer which is formed in a reducing atmosphere and has oxygen vacancies is improved. Further, when an impurity (for example, a compound containing hydrogen or the like) is added, the oxide conductive layer becomes amorphous, and not only the workability but also the conductivity is improved.

In this embodiment, the barrier layer 114a and the barrier layer 114b are formed using titanium nitride. The thickness of the barrier layer is 1 nm to 50 nm, preferably 2 nm to 10 nm, and has a light-transmitting property.

The barrier layer 114a is provided between the highly purified oxide semiconductor layer 123 and the first electrode 115a, and the barrier layer 114b is provided between the highly purified oxide semiconductor layer 123 and the second electrode 115b. Is provided. The barrier layer 114a and the barrier layer 114b are layers that inhibit diffusion of hydrogen and oxygen.

The barrier layer 114a and the barrier layer 114b suppress a phenomenon in which an impurity contained in the oxide conductive layer (eg, an impurity containing a hydrogen atom) diffuses into the oxide semiconductor layer. In addition, the barrier layer 114a and the barrier layer 114b suppress a phenomenon in which oxygen atoms included in the oxide semiconductor layer are diffused into the oxide conductive layer.

Note that as the barrier layer 114a and the barrier layer 114b, in addition to a titanium nitride layer, a conductive nitride layer such as a tantalum nitride layer, a tungsten nitride layer, or a molybdenum nitride layer, an extremely thin silicon nitride layer, an aluminum nitride layer, or the like A nitride layer having a barrier property can be used.

In this embodiment, a stacked body in which silicon oxide is stacked over silicon nitride (SiN _y (y> 0)) as the first insulating layer 102 is used. In addition, a stacked body in which silicon nitride (SiN _y (y> 0)) is stacked over silicon oxide for the second insulating layer 107 is used.

By using the silicon nitride layer, a phenomenon in which impurities reach the oxide semiconductor layer 123 provided in the transistor 151 from the outside can be prevented.

In addition, when silicon oxide is used for the first insulating layer 102 in contact with the oxide semiconductor layer 123 and the second insulating layer 107 in contact with the oxide semiconductor layer 123, the oxide semiconductor layer 123 is generated. Oxygen can be compensated for oxygen deficiency.

Note that silicon oxide and silicon nitride included in the first insulating layer 102 and the second insulating layer 107 have a light-transmitting property.

Note that as the first insulating layer 102, a silicon nitride oxide layer, a silicon oxynitride layer, a silicon nitride layer, or a silicon oxide layer, an oxide of aluminum, tantalum, yttrium, or hafnium, a nitride, an oxynitride, Alternatively, a single layer of a nitrided oxide or a compound layer containing at least two of these compounds may be used as a single layer or stacked layers.

In particular, an insulating layer having a dielectric constant higher than that of silicon oxide is preferably used for the first insulating layer 102 because characteristics as a gate insulating layer are improved.

The substrate 100 is a substrate that transmits visible light and has an insulating surface. For example, in addition to a glass substrate and a ceramic substrate, a plastic substrate having heat resistance enough to withstand a processing temperature in a manufacturing process can be used.

As the glass substrate, for example, an alkali-free glass substrate such as barium borosilicate glass, aluminoborosilicate glass, or aluminosilicate glass may be used. In addition, a quartz substrate, a sapphire substrate, or the like can be used. In this embodiment mode, aluminoborosilicate glass is used for the substrate 100.

The size of the substrate may be appropriately determined in consideration of the purpose of use, the manufacturing apparatus, etc., but the third generation (550 mm × 650 mm), the third generation (600 mm × 720 mm, or 620 mm × 750 mm). , 4th generation (680mm x 880mm, or 730mm x 920mm), 5th generation (1100mm x 1300mm), 6th generation (1500mm x 1850mm), 7th generation (1870mm x 2200mm), 8th generation (2200mm x 2400mm) , Glass substrates of the ninth generation (2400 mm × 2800 mm, 2450 mm × 3050 mm), the tenth generation (2950 mm × 3400 mm) and the like can be used.

Note that a silicon nitride film or a silicon nitride oxide film can be formed as a single layer or stacked over the substrate 100 as a base film. As the base film, a sputtering method, a CVD method, a coating method, a printing method, or the like can be used as appropriate. Note that phosphorus (P) or boron (B) may be doped in the film.

Here, an oxide semiconductor having a wide band gap is formed in a semiconductor layer in which a channel of a transistor is formed with a high carrier concentration of less than 1 × 10 ¹⁴ / cm ³ , preferably 1 × 10 ¹² / cm ³ or less. The significance of application will be explained.

<Intrinsic oxide semiconductors>
Many studies on physical properties of oxide semiconductors such as DOS (Density of State) have been made, but these studies do not include the idea of sufficiently reducing the localized level itself. In one embodiment of the disclosed invention, highly purified and intrinsic (i-type) oxide semiconductor is manufactured by removing water and hydrogen that may cause localized states from an oxide semiconductor. This is based on the idea of sufficiently reducing the localized level itself. This makes it possible to produce extremely excellent industrial products.

When removing hydrogen or water, oxygen may be removed at the same time. For this reason, oxygen is supplied to the dangling bonds of the metal generated by oxygen deficiency, and the localized states due to oxygen defects are reduced, whereby the oxide semiconductor is further purified and made intrinsic (i-type). It is suitable to do. For example, an oxide film containing excess oxygen is formed in close contact with a channel formation region containing an oxide semiconductor, and heat treatment is performed at a temperature of about 200 ° C. to 400 ° C., typically about 250 ° C. Oxygen can be supplied from the oxide semiconductor to the oxide semiconductor to reduce localized levels due to oxygen defects.

A factor that deteriorates the characteristics of an oxide semiconductor is considered to be due to a shallow level of 0.1 eV to 0.2 eV below a conduction band due to excess hydrogen, a deep level due to oxygen deficiency, or the like. In order to eliminate these defects, hydrogen is thoroughly removed and oxygen is sufficiently supplied.

Note that an oxide semiconductor is generally n-type; however, in one embodiment of the disclosed invention, an impurity such as water or hydrogen is removed and oxygen that is a constituent element of the oxide semiconductor is supplied to increase i-type. Realize. In this respect, it can be said that it includes an unprecedented technical idea rather than i-type by adding an impurity element such as silicon.

<Conductive mechanism of transistor using oxide semiconductor>
Here, a conduction mechanism of a transistor including an oxide semiconductor will be described with reference to FIGS. In the following description, an ideal situation is assumed for easy understanding, and not all of them reflect the actual situation. In addition, it is noted that the following description is merely a consideration and does not affect the effectiveness of the invention.

FIG. 2 is a cross-sectional view of a transistor including an oxide semiconductor. An oxide semiconductor layer (OS) is provided over the gate electrode (GE1) through a gate insulating layer (GI), and a source electrode (S) and a drain electrode (D) are provided thereover.

FIG. 3 shows an energy band diagram (schematic diagram) in the AA ′ cross section of FIG. In FIG. 3, black circles (●) indicate electrons, white circles (◯) indicate holes, and each has a charge (−q, + q). When a positive voltage (V _D > 0) is applied to the drain electrode and no voltage is applied to the gate electrode (V _G = 0), a broken line indicates a positive voltage (V _G > 0) to the gate electrode. The case of applying is shown. When no voltage is applied to the gate electrode, carriers (electrons) are not injected from the electrode to the oxide semiconductor side due to a high potential barrier, and an off state in which no current flows is shown. On the other hand, when a positive voltage is applied to the gate, the potential barrier is lowered, indicating an on state in which current flows.

FIG. 4 shows an energy band diagram (schematic diagram) between BB ′ in FIG. FIG. 4A shows a state in which a positive potential (V _G > 0) is applied to the gate electrode (GE1), and shows an on state in which carriers (electrons) flow between the source and the drain. FIG. 4B illustrates a case where a negative potential (V _G <0) is applied to the gate (GE1) and an off state (a state where minority carriers do not flow).

FIG. 5 shows the relationship between the vacuum level, the metal work function (φ _M ), and the electron affinity (χ) of the oxide semiconductor.

At room temperature, the electrons in the metal are degenerated and the Fermi level is located in the conduction band. A conventional oxide semiconductor is n-type, and its Fermi level (E _f ) is located closer to the conduction band, away from the intrinsic Fermi level (E _i ) located in the center of the band gap. Note that it is known that hydrogen in an oxide semiconductor is a factor that becomes a donor and becomes n-type.

In contrast, an oxide semiconductor according to one embodiment of the disclosed invention removes hydrogen which is a factor of n-type conversion from an oxide semiconductor and includes an element (impurity element) other than the main component of the oxide semiconductor as much as possible. It is made intrinsic (i-type) by purifying it so that it does not exist, or it is made genuine. That is, it is characterized in that it is made intrinsic (i-type) or close to it as a result of being highly purified by removing impurities such as hydrogen and water as much as possible instead of adding an impurity element to i-type. Accordingly, the Fermi level (E _f ) can be set to the same level as the intrinsic Fermi level (E _i ).

An oxide semiconductor has a band gap (E _g ) of 3.15 eV and an electron affinity (χ) of 4.3 V. The work function of titanium (Ti) constituting the source electrode and the drain electrode is substantially equal to the electron affinity (χ) of the oxide semiconductor. In this case, no Schottky barrier is formed for electrons at the metal-oxide semiconductor interface.

At this time, as shown in FIG. 4A, electrons move in the vicinity of the interface between the gate insulating layer and the highly purified oxide semiconductor (the lowest energy-stable minimum portion of the oxide semiconductor).

In addition, as shown in FIG. 4B, when a negative potential is applied to the gate electrode (GE1), the number of holes that are minority carriers is substantially zero, and thus the current becomes a value close to zero. .

In this manner, by being highly purified so that an element other than the main component of the oxide semiconductor (impurity element) is not included as much as possible, it becomes intrinsic (i-type) or substantially intrinsic. The interface characteristics of Therefore, a gate insulating layer that can form a favorable interface with an oxide semiconductor is required. Specifically, for example, an insulating layer manufactured by a CVD method using high-density plasma generated at a power supply frequency in the VHF band to a microwave band, an insulating layer manufactured by a sputtering method, or the like is preferably used. .

For example, when the transistor has a channel width W of 1 × 10 ⁴ μm and a channel length L of 3 μm by improving the purity of the oxide semiconductor and improving the interface between the oxide semiconductor and the gate insulating layer. Is an off current of 10 ⁻¹³ A or less at room temperature, 0.1 V / dec. The subthreshold swing value (S value) (gate insulating layer thickness: 100 nm) can be realized.

As described above, the operation of the transistor can be improved by increasing the purity so that an element (impurity element) other than the main component of the oxide semiconductor is not included as much as possible.

As described above, the transistor of this embodiment including a light-transmitting material has a light-transmitting property.

In the transistor of this embodiment, the source electrode and the drain electrode are formed using an oxide conductive layer containing oxygen deficiency and impurities (for example, hydrogen) and having increased conductivity. Less is.

Since an oxide semiconductor having a wide band gap and a carrier concentration suppressed to less than 1 × 10 ¹⁴ / cm ³ , preferably 1 × 10 ¹² / cm ³ or less is used, the transistor in this embodiment is normally off. The off-state current is low. Specifically, the off current at room temperature per channel width of 1 μm can be set to 1 × 10 ⁻¹⁶ A / μm or less, further 1 aA / μm (1 × 10 ⁻¹⁸ A / μm) or less.

Note that the difficulty of off-state current flow in a transistor can be expressed as off-resistance. The off resistivity is the resistivity of the channel formation region when the transistor is off, and the off resistivity can be calculated from the off current.

Specifically, if the values of the off current and the drain voltage are known, the resistance value (off resistance R) when the transistor is off can be calculated from Ohm's law. If the cross-sectional area A of the channel formation region and the length L of the channel formation region (corresponding to the distance between the source and drain electrodes) L are known, the off resistivity ρ can be calculated from the equation ρ = RA / L (R is the off resistance). Can be calculated.

Here, the cross-sectional area A can be calculated from A = dW where d is the thickness of the channel formation region and W is the channel width. The length L of the channel formation region is the channel length L. As described above, the off resistivity can be calculated from the off current.

The off-resistivity of the transistor including the oxide semiconductor layer of this embodiment has an excellent value of 1 × 10 ⁹ Ω · m or more.

In the transistor of this embodiment, since a barrier layer that inhibits diffusion of hydrogen and oxygen is provided between the oxide conductive layer and the highly purified oxide semiconductor layer, impurities contained in the oxide conductive layer (for example, , Impurities including hydrogen atoms) are prevented from diffusing into the oxide semiconductor layer. In addition, the barrier layer suppresses a phenomenon in which oxygen atoms included in the oxide semiconductor layer are diffused into the oxide conductive layer.

The light-transmitting transistor illustrated in this embodiment has normally-off characteristics and reduced off-state current because the highly purified oxide semiconductor layer is protected by a barrier layer. In addition, the characteristics hardly change over time, and the reliability is excellent.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 2)
In this embodiment, a display device using a bottom-gate transistor that transmits visible light as one embodiment of a semiconductor device will be described with reference to FIGS. A method for manufacturing a bottom-gate transistor that transmits visible light is described with reference to FIGS.

Note that a method for manufacturing a channel-protective transistor that can be manufactured with a bottom-gate transistor that transmits visible light is also described with reference to FIGS.

FIG. 6A is a top view of a pixel portion of a display device to which a bottom-gate transistor that transmits visible light is applied. FIG. 6B is a cross-sectional view illustrating a stacked structure of a pixel portion of a display device to which a bottom-gate transistor that transmits visible light is applied. Note that the chain line A1-A2 in FIG. 6A corresponds to the cross section A1-A2 in FIG. 6B, and the chain line B1-B2 in FIG. 6A is the cross section B1 in FIG. 6B corresponds to the cross section C1-C2 in FIG. 6B, and the D1-D2 chain line in FIG. 6A corresponds to FIG. Corresponds to the cross section D1-D2 in FIG.

A cross section A1-A2 illustrates a stacked structure of the transistor 153. A cross section D1-D2 is a diagram illustrating a stacked structure of the transistor 153 from a cross section different from the cross section A1-A2.

The transistor 153 includes a gate electrode 111a over a light-transmitting substrate 100. Note that the gate electrode 111a is electrically connected to the gate wiring 111c. The first insulating layer 102 is provided over the gate electrode 111a, and the oxide semiconductor layer 123 is provided in contact with the first insulating layer 102 over the gate electrode 111a. In addition, the first electrode 115a and the second electrode 115b whose end portions overlap with each other are over the gate electrode 111a. Note that a barrier layer 114 a is provided between the first electrode 115 a and the oxide semiconductor layer 123, and a barrier layer 114 b is provided between the second electrode 115 b and the oxide semiconductor layer 123.

On the gate electrode 111a, between the region where the oxide semiconductor layer 123 and the first electrode 115a overlap and the region where the oxide semiconductor layer 123 and the second electrode 115b overlap, the second insulating layer 107 and the oxide layer are oxidized. The physical semiconductor layer 123 is in contact. An opening 127 is formed in the second insulating layer 107, the signal line 116 a is provided, the third insulating layer 108 is provided over the second insulating layer 107 and the signal line 116 a, and the third insulating layer 108 is provided over the third insulating layer 108. A fourth insulating layer 109 is provided. In addition, the pixel electrode 120 which is electrically connected to the second electrode 115b through the opening 128 formed in the second insulating layer 107, the third insulating layer 108, and the fourth insulating layer 109 is connected to the fourth electrode 115b. Over the insulating layer 109.

Cross-section B1-B2 is a diagram for explaining the laminated structure of the capacitor portion.

The capacitor portion is formed on the first capacitor electrode 111b provided over the substrate 100 by extending the second electrode 115b of the transistor 153 with the first insulating layer 102 and the barrier layer 114b interposed therebetween. The first capacitor electrode 111b can be formed together with the gate electrode 111a of the transistor 153, and the first insulating layer 102, the barrier layer 114b, and the second electrode 115b can be formed together with the transistor 153.

Since the first capacitor electrode 111b and the second electrode 115b have a light-transmitting property, the capacitor portion has a light-transmitting property and the aperture ratio of the pixel does not decrease. Further, since the distance between the first capacitor electrode 111b and the second electrode 115b is narrow, a large capacitance can be obtained.

A cross section C1-C2 is a diagram illustrating a cross-sectional structure of an intersection of the gate wiring 111c and the signal line 116a.

The signal line 116 a intersects with the first insulating layer 102, the oxide semiconductor layer 113 c, and the second insulating layer 107 over the gate wiring 111 c provided over the substrate 100. The gate wiring 111 c is connected to the gate electrode of the transistor 153.

Since the interval between the gate wiring 111c and the signal line 116a is widened, the wiring capacitance is reduced.

Next, a method for manufacturing the bottom-gate transistor 153 that transmits visible light is described with reference to FIGS.

A transistor 153 illustrated in FIG. 7D has the same structure as the bottom-gate transistor which transmits visible light and is applied to the pixel portion of the display device illustrated in FIG.

Note that FIG. 7D also illustrates a transistor 154 that has a structure different from that of the transistor 153 and can be formed over the same substrate in parallel with the transistor 153.

The transistor 154 includes a gate electrode 111d made of the same material as the gate wiring 111c, and includes a third electrode 116c and a fourth electrode 116d formed of the same material as the signal line 116a. The transistor 154 includes the insulating layer 107c over the channel formation region of the oxide semiconductor layer 113c, and the insulating layer 107c functions as a channel protective layer.

In the present embodiment, “B made of the same material as A” means that A and B are made of the same material in the same step.

In this embodiment mode, aluminoborosilicate glass is used for the substrate 100.

First, the gate electrode 111a, the gate electrode 111d, and a gate wiring electrically connected to the gate electrode are formed. In this embodiment mode, a conductive layer to be the gate electrode 111a and a conductive layer including a gate wiring are collectively referred to as a first conductive layer. Note that the gate wiring is not shown in FIG.

In this embodiment, the gate wiring and the gate electrode 111d are formed using a conductive layer having a three-layer structure in which a titanium layer, an aluminum layer, and a titanium layer are stacked, and indium tin oxide is used as the conductive layer that becomes the gate electrode 111a that transmits visible light. (ITO) is used.

A conductive layer having a three-layer structure in which a titanium layer, an aluminum layer, and a titanium layer are stacked is formed over the substrate 100 by a sputtering method. Next, the gate electrode 111d and the gate wiring are formed by selective etching using the resist mask formed in the first photolithography step. Note that the gate electrode 111 d formed using the same material as the gate wiring serves as the gate electrode of the transistor 154.

Next, indium tin oxide (ITO) is formed and selectively etched using the resist mask formed in the second photolithography step, so that the light-transmitting gate electrode 111a is formed. Note that the light-transmitting gate electrode 111 a serves as the gate electrode of the transistor 153.

The conductive film for forming the gate wiring is formed using a metal material such as Al, Cu, Cr, Ta, Ti, Mo, or W, or an alloy material containing the metal material as a component. Alternatively, a configuration may be adopted in which a refractory metal film such as Cr, Ta, Ti, Mo, or W is laminated on one or both of metal films such as Al and Cu. Moreover, heat resistance is improved by using an Al material to which an element for preventing generation of hillocks and whiskers generated in an Al film such as Si, Ti, Ta, W, Mo, Cr, Nd, Sc, and Y is added. Is possible.

In this embodiment, the case where the light-transmitting gate electrode is formed after the gate wiring is formed is described; however, the gate wiring may be formed after the light-transmitting gate electrode is formed.

Next, the first insulating layer 102 is formed. In this embodiment mode, the first insulating layer 102 is formed by stacking silicon oxide over the silicon nitride layer.

The first insulating layer 102 can be a single-layer film or a stacked film such as a silicon oxide layer, a silicon oxynitride layer, a silicon nitride oxide layer, a silicon nitride layer, an aluminum oxide layer, or a tantalum oxide layer. Further, the film thickness is 50 nm or more and 250 nm or less, and the film is formed by a CVD method or a sputtering method. Further, phosphorus (P) or boron (B) may be doped in the film.

Note that the first insulating layer 102 preferably includes an oxide insulating layer on a side in contact with the oxide semiconductor layer. In addition, an oxide semiconductor (i.e., a highly purified oxide semiconductor) that is i-type or substantially i-type by removing impurities, which is used in this embodiment, has an interface state and an interface charge. The interface with the insulating layer is important because it is very sensitive. Therefore, the insulating layer in contact with the highly purified oxide semiconductor is required to have high quality.

Next, an oxide semiconductor layer is formed. In this embodiment, an oxide semiconductor layer is formed from an In—Ga—Zn—O-based non-single-crystal film formed by sputtering an In—Ga—Zn—O-based oxide semiconductor deposition target.

The thickness of the oxide semiconductor layer is 5 nm to 200 nm, preferably 10 nm to 20 nm, for example, 15 nm.

Note that before the oxide semiconductor layer is formed, dust attached to the surface of the first insulating layer 102 is preferably removed by performing reverse sputtering in which argon gas is introduced to generate plasma.

Reverse sputtering is a method for modifying the surface by forming a plasma by applying a voltage to the substrate using an RF power source in an argon atmosphere. Note that nitrogen, helium, or the like may be used instead of the argon atmosphere. Alternatively, an argon atmosphere may be used in which oxygen, N ₂ O, or the like is added. Alternatively, an atmosphere obtained by adding Cl ₂ , CF _4, or the like to an argon atmosphere may be used.

Further, after the reverse sputtering treatment, the oxide semiconductor film is formed without being exposed to the air, whereby dust and moisture can be prevented from attaching to the interface between the first insulating layer 102 and the oxide semiconductor layer.

The oxide semiconductor film can be formed by a sputtering method in a rare gas (typically argon) atmosphere, an oxygen atmosphere, or a rare gas (typically argon) and oxygen mixed atmosphere. Further, in the case of using a sputtering method, film formation is performed using a target containing SiO _{2 in an amount} of 2 wt% to 10 wt%, and SiO x (X> 0) that inhibits crystallization is included in the oxide semiconductor film. good.

Here, a target for forming an oxide semiconductor film containing In, Ga, and Zn (molar ratio is In ₂ O ₃ : Ga ₂ O ₃ : ZnO = 1: 1: 1 [molar ratio], or In ₂ O ₃ : Ga ₂ O ₃ : ZnO = 1: 1: 2 [molar ratio]), the distance between the substrate and the target is 100 mm, the pressure is 0.6 Pa, the direct current (DC) power supply is 0.5 kW, oxygen The film is formed under an atmosphere (oxygen flow rate 100%). Note that a pulse direct current (DC) power source is preferable because dust can be reduced and the film thickness can be uniform.

In this case, it is preferable to form the oxide semiconductor film while removing residual moisture in the treatment chamber. This is for preventing hydrogen, a hydroxyl group, and moisture from being contained in the oxide semiconductor film.

The multi-chamber sputtering apparatus used in this embodiment includes a silicon or silicon oxide (artificial quartz) target and an oxide semiconductor film formation target, and at least the oxide semiconductor film formation target is provided. The film formation chamber has a cryopump as an exhaust means. Instead of the cryopump, a turbo molecular pump may be used, and a cold trap may be provided on the intake port of the turbo molecular pump to adsorb moisture or the like.

A film formation chamber evacuated using a cryopump is formed in the film formation chamber because, for example, hydrogen atoms, compounds containing hydrogen atoms such as H ₂ O, and compounds containing carbon atoms or carbon atoms are exhausted. The concentration of impurities contained in the formed oxide semiconductor film can be reduced.

Note that an oxide semiconductor film is preferably formed continuously over the first insulating layer 102.

As a sputtering gas used for forming the oxide semiconductor film, a high-purity gas from which impurities such as hydrogen, water, a hydroxyl group, or hydride are removed to a concentration of about 1 ppm and a concentration of about 10 ppb is preferably used.

The oxide semiconductor film may be formed while the substrate is heated. At this time, the substrate temperature is set to 100 ° C. or higher and 600 ° C. or lower, preferably 200 ° C. or higher and 400 ° C. or lower. By forming the film while heating the substrate, the concentration of impurities contained in the formed oxide semiconductor film can be reduced.

Next, an island-shaped oxide semiconductor layer 113a formed using an In—Ga—Zn—O-based non-single crystal and an oxide semiconductor layer are selectively etched using the resist mask formed in the third photolithography step. 113c is formed.

For the etching, for example, an organic acid such as citric acid or oxalic acid can be used as an etching solution. By etching the end portion of the island-shaped oxide semiconductor layer in a tapered shape, disconnection of the wiring due to the step shape can be prevented. Note that the etching here is not limited to wet etching, and dry etching may be used.

Next, first heat treatment is performed on the substrate provided with the island-shaped oxide semiconductor layer 113a and the oxide semiconductor layer 113c, so that the island-shaped oxide semiconductor layer is dehydrated or dehydrogenated.

Note that in this specification, heat treatment in an atmosphere of an inert gas such as nitrogen or a rare gas is referred to as heat treatment for dehydration or dehydrogenation. In this specification, the desorption as H ₂ only by this heat treatment is not called dehydrogenation, but dehydration or dehydrogenation including desorption of H, hydroxyl group, etc. It will be called for convenience.

In this embodiment, the substrate temperature of the substrate provided with the island-shaped oxide semiconductor layer is heated to the temperature T as the first heat treatment. The temperature T is 700 ° C. or lower (or a temperature lower than the strain point of the glass substrate), preferably 350 ° C. or higher and 500 ° C. or lower by RTA (Rapid Thermal Annealing) treatment for about 1 to 10 minutes.

The inert gas atmosphere used for the first heat treatment is an atmosphere containing nitrogen or a rare gas (such as helium, neon, or argon) as a main component, and the atmosphere does not contain water, hydrogen, or the like. Is preferred. Alternatively, the purity of the inert gas introduced into the heat treatment apparatus is 6N (99.9999%) or more, preferably 7N (99.99999%) or more (that is, the impurity concentration is 1 ppm or less, preferably 0.1 ppm or less). It is preferable that

Further, when dehydration or dehydrogenation is performed on the oxide semiconductor layer, it is important that the oxide semiconductor layer is not exposed to the air and water or hydrogen is not mixed again.

Note that the heat treatment apparatus that performs the first heat treatment may be an apparatus that heats an object to be processed by heat conduction or heat radiation from a medium such as an electric furnace or a heated gas. For example, a rapid thermal annealing (RTA) device such as a GRTA (Gas Rapid Thermal Anneal) device or an LRTA (Lamp Rapid Thermal Anneal) device can be used. The LRTA apparatus is an apparatus that heats an object to be processed by radiation of light (electromagnetic waves) emitted from a lamp such as a halogen lamp, a metal halide lamp, a xenon arc lamp, a carbon arc lamp, a high pressure sodium lamp, or a high pressure mercury lamp.

When the RTA method is used, dehydration or dehydrogenation can be performed in a short time, so that the treatment can be performed even at a temperature exceeding the strain point of the glass substrate. The GRTA apparatus is an apparatus that performs heat treatment using a high-temperature gas.

The heat treatment is not limited to this timing, and may be performed a plurality of times before and after the photolithography process and the film formation process.

An oxide semiconductor layer that has been sufficiently dehydrated or dehydrogenated under the above conditions has a moisture content in the spectrum when measured by heating to 450 ° C. using a thermal desorption gas analysis (TDS) method. Among the two peaks indicating desorption of, at least one peak appearing in the vicinity of 250 to 300 ° C. is not detected.

Note that the oxide semiconductor layer is amorphous having many dangling bonds at the time of film formation; however, by performing the first heat treatment of the dehydration or dehydrogenation treatment, the oxide semiconductor layer can be formed at a short distance. Certain dangling bonds are bonded to each other, and an ordered amorphous structure can be obtained. Further, when ordering develops, a mixture of amorphous and microcrystals is formed in which microcrystals are scattered in an amorphous region.

Note that the first heat treatment of the oxide semiconductor layer can be performed on the oxide semiconductor film before being processed into the island-shaped oxide semiconductor layer. In that case, after the first heat treatment, a substrate is taken out of the heating apparatus and a photolithography step for processing into an island-shaped oxide semiconductor layer is performed.

Note that FIG. 7A is a cross-sectional view at this stage.

Next, the barrier layer 114a, the barrier layer 114b, the first electrode 115a, and the second electrode 115b are formed.

In this embodiment, titanium nitride is used for the barrier layer 114a and the barrier layer 114b, and indium tin oxide (ITO) is used for the second conductive film to be the first electrode 115a and the second electrode 115b.

A titanium nitride film serving as a barrier layer is formed so as to cover the island-shaped oxide semiconductor layer 113a formed over the first insulating layer 102, and indium tin which is a conductive film that transmits visible light is formed on the titanium nitride film. An oxide (ITO) film is formed. Note that the titanium nitride film and the indium tin oxide (ITO) film can be formed by a sputtering method.

The indium tin oxide (ITO) film is formed in a reducing atmosphere. For example, indium oxide (In ₂ O ₃ ) and tin oxide (SnO ₂ ) are mixed at a weight ratio of 85:15 (= In ₂ O ₃ : SnO ₂ ), and a sintered target having a diameter of 302 mm is used. The film can be formed by a DC sputtering method with a pressure of 0.4 Pa and a power of 1 Kw. As a deposition gas, a mixed gas of argon, oxygen, and hydrogen, or a mixed gas of argon, oxygen, and water vapor can be used. Specifically, a gas in which argon, oxygen, and hydrogen are mixed at a volume ratio of 50: 1: 10 (= Ar: O ₂ : H ₂ ) in a standard state can be used. Alternatively, a gas in which argon, oxygen, and water vapor are mixed at a volume ratio of 50: 1: 1 (= Ar: O ₂ : H ₂ O) in a standard state can be used.

By using a gas to which hydrogen or water vapor is added, the indium tin oxide (ITO) film becomes amorphous and the workability is improved. In addition, conductivity is improved by oxygen vacancies generated by film formation in a reducing atmosphere and added impurities (for example, hydrogen, a compound containing hydrogen, or the like).

Note that the dehydrated or dehydrogenated oxide semiconductor layer 113a is covered with a titanium nitride film serving as a barrier layer, and thus is exposed to a reducing atmosphere for increasing the conductivity of the light-transmitting conductive film. There is nothing.

Next, selective etching is performed using the resist mask formed in the fourth photolithography step, so that the barrier layer 114a, the barrier layer 114b, the first electrode 115a, and the second electrode 115b are formed.

Note that FIG. 7B is a cross-sectional view at this stage.

Further, before the barrier layer 114a, the barrier layer 114b, the first electrode 115a, and the second electrode 115b are formed, the first insulating layer 102 is selectively etched to reach a gate wiring or a gate electrode. Contact holes may be formed. When a contact hole reaching the gate wiring or the gate electrode is formed and a titanium nitride film serving as a barrier layer and a light-transmitting conductive film are formed, the gate wiring or the gate electrode and the nitride are formed without passing through another conductive layer. The titanium film and the light-transmitting conductive film can be directly connected. With such a configuration, the number of contact holes required for connection can be reduced. If the number of contact holes required for connection is reduced, not only the electrical resistance can be reduced, but also the area occupied by the contact holes can be reduced.

Next, the second insulating layer 107 is formed over the first insulating layer 102, the oxide semiconductor layer 113a, the oxide semiconductor layer 113c, the first electrode 115a, and the second electrode 115b. The second insulating layer 107 includes an inorganic insulating layer, and a silicon oxide film, a silicon nitride oxide film, an aluminum oxide film, an aluminum oxynitride film, or the like is used. The second insulating layer 107 can have a thickness of at least 1 nm and can be formed as appropriate by a method such as sputtering, in which impurities such as water and hydrogen are not mixed into the oxide insulating layer. At this stage, a region where the oxide semiconductor layer and the second insulating layer 107 are in contact with each other is formed.

A region of the oxide semiconductor layer which overlaps with the gate electrode and is in contact with and between the second insulating layer 107 and the first insulating layer 102 serves as a channel formation region. The second insulating layer 107 is provided in contact with the channel formation region of the oxide semiconductor layer and functions as a channel protective layer.

The second insulating layer 107 is in contact with a compound containing a hydrogen atom typified by H ₂ O, a compound containing a carbon atom, or an oxide semiconductor layer with a low content of impurities such as a hydrogen atom and a carbon atom. Provided. The second insulating layer 107 does not contain impurities such as moisture, hydrogen ions, and hydroxyl groups, and blocks these from entering from the outside.

In this embodiment, silicon oxide is used for the second insulating layer 107.

The silicon oxide film to be the second insulating layer 107 is formed by a sputtering method. The substrate temperature in film formation may be room temperature to 600 ° C., preferably 200 ° C. to 400 ° C., and is 100 ° C. in this embodiment. The silicon oxide film can be formed by a sputtering method in a rare gas (typically argon) atmosphere, an oxygen atmosphere, or a rare gas (typically argon) and oxygen mixed atmosphere. Note that an oxide insulating layer formed by a sputtering method is particularly dense and can be used as a protective film for suppressing a phenomenon in which impurities are diffused into a layer in contact with the oxide insulating layer. Alternatively, phosphorus (P) or boron (B) can be added to the oxide insulating layer using a target doped with phosphorus (P) or boron (B).

Moreover, a silicon oxide target or a silicon target can be used as a target, and a silicon target is particularly preferable. A silicon oxide film formed by a sputtering method using a silicon target in a mixed atmosphere of oxygen and a rare gas contains a large amount of silicon atoms or dangling bonds of oxygen atoms.

Since the second insulating layer 107 using silicon oxide exemplified in this embodiment includes many dangling bonds, impurities remaining in the oxide semiconductor layer 113a and the oxide semiconductor layer 113c are different from those in the oxide semiconductor layer and the oxide semiconductor layer 113c. It becomes easy to diffuse into the second insulating layer 107 through the interface where the two insulating layers 107 are in contact. Specifically, a hydrogen atom contained in the oxide semiconductor layer or a compound containing a hydrogen atom such as H ₂ O easily diffuses and moves to the second insulating layer 107.

In this embodiment, the purity is 6N, a columnar polycrystalline B-doped silicon target (resistance value 0.01 Ωcm) is used, the distance between the substrate and the target (T-S distance) is 89 mm, and the pressure is 0 The film is formed by pulsed DC sputtering in an atmosphere of 4 Pa, direct current (DC) power supply 6 kW, and oxygen (oxygen flow rate 100%). The film thickness is 300 nm.

Next, etching is selectively performed using the resist mask formed in the fifth photolithography step, so that the opening 126a, the opening 126b, and the opening 127a are provided in the second insulating layer.

Next, the signal line 116a, the third electrode 116c, and the fourth electrode 116d are formed. First, a third conductive layer to be the signal line 116a, the third electrode 116c, and the fourth electrode 116d is formed.

The third conductive layer is formed of a metal material such as Al, Cu, Cr, Ta, Ti, Mo, W, or an alloy material containing the metal material as a component. Alternatively, a configuration may be adopted in which a refractory metal film such as Cr, Ta, Ti, Mo, or W is laminated on one or both of metal films such as Al and Cu. Moreover, heat resistance is improved by using an Al material to which an element for preventing generation of hillocks and whiskers generated in an Al film such as Si, Ti, Ta, W, Mo, Cr, Nd, Sc, and Y is added. Is possible.

A conductive film having a three-layer structure in which a titanium layer, an aluminum layer, and a titanium layer are stacked is used as the third conductive layer.

A conductive film having a three-layer structure in which a titanium layer, an aluminum layer, and a titanium layer are stacked is formed by a sputtering method so as to cover the second insulating layer 107, the insulating layer 107c, and the opening. Next, selective etching is performed using the resist mask formed in the sixth photolithography step, so that the signal line 116a, the third electrode 116c, and the fourth electrode 116d are formed. Note that the third electrode 116c and the fourth electrode 116d which are formed using the same material as the signal line 116a serve as a source electrode or a drain electrode of the transistor 154.

Note that FIG. 7C is a cross-sectional view at this stage.

Next, the third insulating layer 108 is formed over the second insulating layer 107. Note that as the third insulating layer 108, a silicon nitride film, a silicon nitride oxide film, an aluminum nitride film, or the like can be used.

In this embodiment, silicon nitride is used for the third insulating layer 108. The third insulating layer 108 can be formed by an RF sputtering method.

After the second insulating layer 107 is formed, second heat treatment (preferably 200 ° C. to 400 ° C., for example, 250 ° C. to 350 ° C.) may be performed in a rare gas atmosphere or a nitrogen gas atmosphere.

For example, the second heat treatment is performed at 250 ° C. for 1 hour in a nitrogen gas atmosphere. When the second heat treatment is performed, the oxide semiconductor layer 113a and part of the oxide semiconductor layer 113c are heated in contact with the second insulating layer 107, and the other part of the oxide semiconductor layer 113a is heated. The portion is in contact with the barrier layers (114a and 114b), and the other part of the oxide semiconductor layer 113c is heated in contact with the signal lines (116a and 116b).

The oxide semiconductor layer that has been dehydrated or dehydrogenated by the first heat treatment has oxygen vacancies at the same time, that is, N-type (N ⁻ conversion, N ⁺ conversion, or the like).

When the second heat treatment is performed in a state where the N-type (N ⁻ , N ⁺ , etc.) oxide semiconductor layer is in contact with the oxide insulating layer, oxygen vacancies are eliminated and high resistance (i-type) is obtained. ).

Through such steps, the oxide semiconductor layer is highly purified. In addition, a transistor manufactured using a highly purified oxide semiconductor layer can realize a switching element in an off state (so-called normally-off characteristics) when the potential of the gate electrode is 0.

Note that the threshold voltage (Vth) is particularly important among the electrical characteristics of the transistor. Even if the field effect mobility is high, if the threshold voltage value is high or the threshold voltage value is negative, it is difficult to control the circuit. In the case of a transistor having a large absolute value of the threshold voltage, the switching function as a transistor cannot be achieved in a state where the drive voltage is low, and there is a risk of becoming a load.

In the case of an n-channel transistor, a transistor in which a channel is formed and drain current flows only after a positive voltage is applied to the gate voltage is desirable. A transistor in which a channel is not formed unless the driving voltage is increased, or a transistor in which a channel is formed and a drain current flows even in a negative voltage state is unsuitable as a transistor used in a circuit. Note that when the threshold voltage value of the transistor is negative, a so-called normally-on characteristic is easily obtained in which a current flows between the source electrode and the drain electrode even when the gate voltage is 0V.

In an active matrix display device, the electrical characteristics of transistors constituting a circuit are important, and the electrical characteristics affect the performance of the display device. When a transistor is used for a display device, it is desirable for the display device to form a channel by applying a positive threshold voltage as close to 0 V as possible to the gate.

In this embodiment, the oxide semiconductor layer 113a and the channel formation region of the oxide semiconductor layer 113c are heated in contact with the second insulating layer 107, so that resistance is increased (i-type). As a result, the transistor 153 including the oxide semiconductor layer 113a and the transistor 154 including the oxide semiconductor layer 113c exhibit normally-off characteristics.

In addition, in the case where a metal conductive layer having a strong oxygen affinity is in contact with the oxide semiconductor layer, oxygen is easily transferred to the metal conductive layer side when the second heat treatment is performed, so that the metal conductive layer of the oxide semiconductor layer is The contact area becomes N-type.

In this embodiment, the region where the third electrode 116c is in contact with the region where the fourth electrode 116d is in contact with the oxide semiconductor layer 113c is N-type by heating.

Note that the timing of performing the second heat treatment is not particularly limited as long as it is a step after the fifth photolithography step, and is not particularly limited immediately after the sixth photolithography step.

Through the above steps, the transistor 153 and the transistor 154 can be manufactured.

According to the method for manufacturing a semiconductor element of this embodiment, a barrier layer that inhibits diffusion of hydrogen and oxygen is provided between the oxide conductive layer and the highly purified oxide semiconductor layer, and the oxide conductive layer is A phenomenon in which an impurity (for example, an impurity including a hydrogen atom) is diffused into the oxide semiconductor layer is suppressed. A semiconductor element can be manufactured. In addition, a semiconductor element in which a phenomenon in which oxygen atoms contained in the oxide semiconductor layer are diffused into the oxide conductive layer is suppressed by the barrier layer can be manufactured.

In addition, according to the method for manufacturing the semiconductor element illustrated in this embodiment, the highly purified oxide semiconductor layer is protected by the barrier layer, and has normally-off characteristics and reduced off-current characteristics. In addition, it is possible to manufacture a semiconductor element having a light-transmitting property that is less likely to change over time and has excellent reliability.

Note that this embodiment can be combined with any of the other embodiments described in this specification as appropriate.

(Embodiment 3)
In this embodiment, an example of a structure of a terminal portion provided over the same substrate as the semiconductor device is illustrated in FIG. In FIG. 8, the same reference numerals are used for the same portions as in FIG.

8A-1 and 8A-2 are a top view and a cross-sectional view of the gate wiring terminal portion, respectively. FIG. 8A-1 corresponds to a cross-sectional view taken along the line j-k in FIG.

In FIG. 8A-1, a first terminal 411 is a connection terminal that functions as an input terminal. In the first terminal 411, a conductive layer 111e formed of the same material as the gate wiring and a conductive layer 115e formed of the same material as the second conductive layer are stacked with a barrier layer 114e interposed therebetween. . Note that although not shown, the conductive layer 111e is electrically connected to the gate wiring.

8B-1 and 8B-2 are a top view and a cross-sectional view of the gate wiring terminal portion, respectively. FIG. 8B-1 corresponds to a cross-sectional view taken along the line j-k in FIG.

In FIG. 8B-1, a second terminal 412 is a connection terminal which functions as an input terminal. In the second terminal 412, a conductive layer 111f formed of the same material as the gate wiring and a conductive layer 115f formed of the same material as the second conductive layer are stacked with a barrier layer 114f interposed therebetween. . The conductive layer 111f is electrically connected to the conductive layer 116 formed of the same material as the third conductive layer. Although not shown, the conductive layer 116 is electrically connected to the signal line.

A plurality of gate wirings, signal lines, common potential lines, and power supply lines are provided depending on the pixel density. In the terminal portion, a first terminal having the same potential as the gate wiring, a second terminal having the same potential as the signal line, a third terminal having the same potential as the power supply line, and a fourth terminal having the same potential as the common potential line. A plurality of terminals are arranged side by side. Any number of terminals may be provided, and the practitioner may determine the number appropriately.

This embodiment can be freely combined with any of the other embodiments.

(Embodiment 4)
In this embodiment, an example in which an inverter circuit is formed using two transistors having a four-terminal structure in which a pair of electrode layers are arranged above and below a channel formation region of an oxide semiconductor layer with an insulating layer is illustrated in FIG. This will be described below. The transistor illustrated in FIG. 9A can be formed using a method similar to that of the transistor 152 illustrated in FIG. Note that the inverter circuit of this embodiment can be used for a driver circuit for driving a pixel portion.

A driving circuit for driving the pixel portion is disposed, for example, around the pixel portion, and is configured using an inverter circuit, a capacitor, a resistor, and the like. One embodiment of the inverter circuit is formed by combining two transistors having n-channel characteristics. For example, there are a transistor formed by combining an enhancement transistor and a depletion transistor (hereinafter referred to as an EDMOS circuit) and a transistor formed by enhancement transistors (hereinafter referred to as an EEMOS circuit).

A cross-sectional structure of the inverter circuit of the driver circuit is shown in FIG.

The first transistor 440A includes a gate electrode 421a formed using a first conductive layer over the substrate 400, and an oxide semiconductor layer including a channel formation region in contact with the first insulating layer 402 over the gate electrode 421a. 404a. In addition, the first conductive layer 455a includes a first electrode 455a and a second electrode 455b which are formed of a second conductive layer, overlap with an end portion over the gate electrode 421a and are in contact with the oxide semiconductor layer 404a through a barrier layer. Note that the first electrode 455a and the second electrode 455b function as a source electrode or a drain electrode of the first transistor 440A. In addition, the second insulating layer 428 is provided over the first electrode 455a, the second electrode 455b, the first insulating layer 402, and the oxide semiconductor layer 404a, and the third insulating layer 428 is provided with a third insulating layer 428. Electrode 422a made of a conductive layer.

The second transistor 440B includes a gate electrode 421b formed using a first conductive layer over the substrate 400, and an oxide semiconductor layer including a channel formation region in contact with the first insulating layer 402 over the gate electrode 421b. 404b. The third electrode 455c and the fourth electrode 455d are formed of the second conductive layer, have end portions overlapping with the gate electrode 421b and are in contact with the oxide semiconductor layer 404b with a barrier layer interposed therebetween. Note that the third electrode 455c and the fourth electrode 455d function as a source electrode or a drain electrode of the second transistor 440B. In addition, the second insulating layer 428 is provided over the third electrode 455c, the fourth electrode 455d, the first insulating layer 402, and the oxide semiconductor layer 404b, and the third insulating layer 428 includes a third insulating layer 428. The electrode 422b made of a conductive layer is provided.

Note that the first transistor 440A and the second transistor 440B are electrically connected by a second electrode 455b and a third electrode 455c which are formed using the same conductive film. The third electrode 455c is connected to the gate electrode 421b of the second transistor 440B through the contact hole 408.

The first transistor 440A and the second transistor 440B can be manufactured using the method described in Embodiment 2, and thus detailed description thereof is omitted. Note that after the contact hole 408 is formed in the first insulating layer 402, the second conductive layer is provided, and the second wiring 410b and the second electrode connected to the third electrode 455c through the contact hole 408 are provided. A configuration in which 455b is directly connected is preferable. Since the number of contact holes required for connection is small, not only the electrical resistance can be reduced, but also the area occupied by the contact holes can be reduced.

The first wiring 410a connected to the first electrode 455a included in the first transistor 440A is a power supply line (negative power supply line) to which a negative voltage VDL is applied. This power line may be a ground potential power line (ground power line).

The third wiring 410c connected to the fourth electrode 455d included in the second transistor 440B is a power supply line (positive power supply line) to which a positive voltage VDH is applied.

A top view of the inverter circuit of the driver circuit is shown in FIG. In FIG. 9C, a cross section taken along the chain line Z1-Z2 corresponds to FIG.

An equivalent circuit of the EDMOS circuit is shown in FIG. The circuit connection illustrated in FIG. 9A corresponds to FIG. 9B, in which the first transistor 440A is an enhancement-type n-channel transistor and the second transistor 440B is a depletion-type n-channel transistor. It is an example.

In this embodiment, in order to control thresholds of the first transistor 440A and the second transistor 440B, a third transistor provided over the channel formation region of the highly purified oxide semiconductor layer with an insulating layer interposed therebetween. An electrode made of a conductive layer is used. Specifically, voltage may be applied to each of the electrodes 422a and 422b so that the first transistor 440A is an enhancement type and the second transistor 440B is a depletion type.

Note that FIGS. 9A and 9C illustrate an example in which the second wiring 410b is directly connected to the gate electrode 421b through the contact hole 408 formed in the first insulating layer 402. There is no particular limitation, and a second connection electrode may be provided to electrically connect the second wiring 410b and the gate electrode 421b.

As described above, an inverter layer can be formed by disposing an electrode layer over a channel formation region of an oxide semiconductor layer with an insulating layer interposed therebetween to control a threshold value of a transistor. By controlling the threshold value of the transistor with a dual gate structure, an enhancement type transistor and a depletion type transistor can be formed over the same substrate without forming an oxide semiconductor film, so that a manufacturing process is simple.

In addition, an inverter circuit with excellent dynamic characteristics can be provided using a transistor having high field-effect mobility with a highly purified oxide semiconductor.

Further, this embodiment can be freely combined with any of the other embodiments.

(Embodiment 5)
In this embodiment, an example of a driver circuit including a transistor that can be manufactured in parallel in the same process over the same substrate as a transistor having a light-transmitting property in a pixel portion and a method for driving a display device using the driver circuit is described below. Explained.

The transistor provided in the pixel portion is formed in accordance with Embodiment 1 or 2. In addition, since the transistor described in Embodiment 1 or 2 is an n-channel transistor, part of the driver circuit that can be formed using an n-channel transistor in the driver circuit is the same as the transistor in the pixel portion. Form on the substrate.

An example of a block diagram of an active matrix display device is illustrated in FIG. A pixel portion 5301, a first scan line driver circuit 5302, a second scan line driver circuit 5303, and a signal line driver circuit 5304 are provided over the substrate 5300 of the display device. In the pixel portion 5301, a plurality of signal lines are extended from the signal line driver circuit 5304, and a plurality of scan lines are extended from the first scan line driver circuit 5302 and the second scan line driver circuit 5303. Has been placed. Note that pixels each having a display element are arranged in a matrix in the intersection region between the scanning line and the signal line. Further, the substrate 5300 of the display device is connected to a timing control circuit 5305 (also referred to as a controller or a control IC) through a connection portion such as an FPC (Flexible Printed Circuit).

In FIG. 10A, the first scan line driver circuit 5302, the second scan line driver circuit 5303, and the signal line driver circuit 5304 are formed over the same substrate 5300 as the pixel portion 5301. For this reason, the number of components such as a drive circuit provided outside is reduced, so that cost can be reduced. Further, in the case where a drive circuit is provided outside the substrate 5300, it is necessary to extend the wiring, and the number of connections between the wirings increases. In the case where a driver circuit is provided over the same substrate 5300, the number of connections between the wirings can be reduced, so that reliability or yield can be improved.

Note that the timing control circuit 5305 is, for example, a first scan line driver circuit start signal (GSP1) (the start signal is also referred to as a start pulse) and the scan line driver circuit for the first scan line driver circuit 5302. A clock signal (GCK1) is supplied. For example, the timing control circuit 5305 supplies the second scan line driver circuit start signal (GSP2) and the scan line driver circuit clock signal (GCK2) to the second scan line driver circuit 5303. The signal line driver circuit 5304 receives a signal line driver circuit start signal (SSP), a signal line driver circuit clock signal (SCK), video signal data (DATA) (also simply referred to as a video signal), and a latch signal (LAT). Shall be supplied. Each clock signal may be a plurality of clock signals with shifted periods, or may be supplied together with a signal (CKB) obtained by inverting the clock signal. Note that one of the first scan line driver circuit 5302 and the second scan line driver circuit 5303 can be omitted.

In FIG. 10B, circuits with low driving frequencies (for example, the first scan line driver circuit 5302 and the second scan line driver circuit 5303) are formed over the same substrate 5300 as the pixel portion 5301, and the signal line driver circuit 5304 is formed. Is formed on a different substrate from the pixel portion 5301. With this structure, a driver circuit formed over the substrate 5300 can be formed using a transistor with lower field-effect mobility than a transistor including a single crystal semiconductor. Therefore, it is possible to increase the size of the display device, reduce the number of steps, reduce cost, improve yield, and the like.

Further, the transistor described in Embodiment 1 or 2 is an n-channel transistor. 11A and 11B illustrate an example of a structure and operation of a signal line driver circuit including n-channel transistors.

The signal line driver circuit includes a shift register 5601 and a switching circuit 5602. The switching circuit 5602 includes a plurality of circuits called switching circuits 5602_1 to 5602_N (N is a natural number). The switching circuits 5602_1 to 5602_N each include a plurality of transistors 5603_1 to 5603_k (k is a natural number). An example in which the transistors 5603_1 to 5603_k are N-channel transistors is described.

A connection relation of the signal line driver circuit is described by using the switching circuit 5602 1 as an example. First terminals of the transistors 5603_1 to 5603_k are connected to wirings 5604_1 to 5604_k, respectively. Second terminals of the transistors 5603_1 to 5603_k are connected to signal lines S1 to Sk, respectively. Gates of the transistors 5603_1 to 5603_k are connected to the wiring 5605_1.

The shift register 5601 has a function of sequentially outputting H-level signals (also referred to as an H signal and a high power supply potential level) to the wirings 5605_1 to 5605_N and sequentially selecting the switching circuits 5602_1 to 5602_N.

The switching circuit 5602_1 has a function of controlling conduction between the wirings 5604_1 to 5604_k and the signal lines S1 to Sk (conduction between the first terminal and the second terminal), that is, the potential of the wirings 5604_1 to 5604_k is changed to the signal lines S1 to S604. It has a function of controlling whether or not to supply to Sk. As described above, the switching circuit 5602 1 has a function as a selector. The transistors 5603_1 to 5603_k each have a function of controlling electrical continuity between the wirings 5604_1 to 5604_k and the signal lines S1 to Sk, that is, a function of supplying the potentials of the wirings 5604_1 to 5604_k to the signal lines S1 to Sk. In this manner, the transistors 5603_1 to 5603_k each function as a switch.

Note that video signal data (DATA) is input to each of the wirings 5604_1 to 5604_k. The video signal data (DATA) is often an image signal or an analog signal corresponding to the image signal.

Next, operation of the signal line driver circuit in FIG. 11A is described with reference to a timing chart in FIG. FIG. 11B illustrates an example of the signals Sout_1 to Sout_N and the signals Vdata_1 to Vdata_k. The signals Sout_1 to Sout_N are examples of output signals of the shift register 5601, and the signals Vdata_1 to Vdata_k are examples of signals input to the wirings 5604_1 to 5604_k, respectively. Note that one operation period of the signal line driver circuit corresponds to one gate selection period in the display device. As an example, one gate selection period is divided into a period T1 to a period TN. The periods T1 to TN are periods for writing video signal data (DATA) to the pixels belonging to the selected row.

In the periods T1 to TN, the shift register 5601 sequentially outputs H-level signals to the wirings 5605_1 to 5605_N. For example, in the period T1, the shift register 5601 outputs a high-level signal to the wiring 5605_1. Then, the transistors 5603_1 to 5603_k are turned on, so that the wirings 5604_1 to 5604_k and the signal lines S1 to Sk are turned on. At this time, Data (S1) to Data (Sk) are input to the wirings 5604_1 to 5604_k. Data (S1) to Data (Sk) are written to the pixels in the first to kth columns among the pixels belonging to the selected row through the transistors 5603_1 to 5603_k, respectively. Thus, in the periods T1 to TN, video signal data (DATA) is sequentially written to the pixels belonging to the selected row by k columns.

As described above, the number of video signal data (DATA) or the number of wirings can be reduced by writing video signal data (DATA) to pixels by a plurality of columns. Therefore, the number of connections with external circuits can be reduced. In addition, since the video signal is written to the pixels in a plurality of columns, the writing time can be extended and insufficient writing of the video signal can be prevented.

Note that as the shift register 5601 and the switching circuit 5602, a circuit including the transistor described in Embodiment 1 or 2 can be used. In this case, the polarity of all the transistors included in the shift register 5601 can be configured using only an N-channel or P-channel polarity.

Note that the structure of the scan line driver circuit is described. The scan line driver circuit includes a shift register. In some cases, a level shifter, a buffer, or the like may be provided. In the scan line driver circuit, when a clock signal (CLK) and a start pulse signal (SP) are input to the shift register, a selection signal is generated. The generated selection signal is buffered and amplified in the buffer and supplied to the corresponding scanning line. A gate electrode of a transistor of a pixel for one line is connected to the scanning line. Since the transistors of pixels for one line must be turned on all at once, a buffer that can flow a large current is used.

A shift register of the scan line driver circuit and the signal line driver circuit is described with reference to FIGS. The shift register includes the first pulse output circuit 10_1 to the Nth pulse output circuit 10_N (N is a natural number of 3 or more) (see FIG. 12A). In the first pulse output circuit 10_1 to the Nth pulse output circuit 10_N of the shift register illustrated in FIG. 12A, the first clock signal CK1 from the first wiring 11 and the second pulse output circuit 10_N from the second wiring 12 are connected. The third clock signal CK3 is supplied from the clock signal CK2, the third wiring 13, and the fourth clock signal CK4 is supplied from the fourth wiring 14. In the first pulse output circuit 10_1, the start pulse SP1 (first start pulse) from the fifth wiring 15 is input. In the second and subsequent nth pulse output circuits 10_n (n is a natural number of 2 or more and N or less), a signal (referred to as the previous stage signal OUT (n-1)) from the previous stage pulse output circuit (n is 2). The above natural number) is input. In the first pulse output circuit 10_1, a signal is input from the third pulse output circuit 10_3 at the second stage. Similarly, in the n-th pulse output circuit 10_n in the second and subsequent stages, a signal (referred to as a subsequent-stage signal OUT (n + 2)) from the (n + 2) -th pulse output circuit 10_ (n + 2) in the second stage is input. Therefore, the first output signal (OUT (1) (SR) to OUT (N) (SR)) to be input from the pulse output circuit at each stage to the pulse output circuit at the subsequent stage and / or two previous stages, A second output signal (OUT (1) to OUT (N)) input to another circuit or the like is output. Note that, as shown in FIG. 12A, the rear stage signal OUT (n + 2) is not input to the last two stages of the shift register, but as an example, a second start is separately made from the sixth wiring 16. The third start pulse SP3 may be input from the pulse SP2 and the seventh wiring 17 respectively. Alternatively, it may be a signal separately generated inside the shift register. For example, an (N + 1) th pulse output circuit 10_ (N + 1) and an (N + 2) th pulse output circuit 10_ (N + 2) that do not contribute to the pulse output to the pixel portion are provided (also referred to as a dummy stage), and It is also possible to generate signals corresponding to the second start pulse (SP2) and the third start pulse (SP3).

Note that the clock signal (CK) is a signal that repeats an H level and an L level (also referred to as an L signal or a low power supply potential level) at regular intervals. Here, the first clock signal (CK1) to the fourth clock signal (CK4) are sequentially delayed by ¼ period. In this embodiment, driving of the pulse output circuit is controlled by using the first clock signal (CK1) to the fourth clock signal (CK4). Note that the clock signal is sometimes referred to as GCK or SCK depending on the input driving circuit, but here it will be described as CK.

The first input terminal 21, the second input terminal 22, and the third input terminal 23 are electrically connected to any one of the first wiring 11 to the fourth wiring 14. For example, in FIG. 12A, in the first pulse output circuit 10_1, the first input terminal 21 is electrically connected to the first wiring 11, and the second input terminal 22 is connected to the second wiring 12. The third input terminal 23 is electrically connected to the third wiring 13. In the second pulse output circuit 10_2, the first input terminal 21 is electrically connected to the second wiring 12, the second input terminal 22 is electrically connected to the third wiring 13, and the second pulse output circuit 10_2 is electrically connected to the third wiring 13. 3 input terminals 23 are electrically connected to the fourth wiring 14.

Each of the first pulse output circuit 10_1 to the Nth pulse output circuit 10_N includes a first input terminal 21, a second input terminal 22, a third input terminal 23, a fourth input terminal 24, and a fifth input terminal. An input terminal 25, a first output terminal 26, and a second output terminal 27 are provided (see FIG. 12B). In the first pulse output circuit 10_1, the first clock signal CK1 is input to the first input terminal 21, the second clock signal CK2 is input to the second input terminal 22, and the third input terminal 23 is input. The third clock signal CK3 is input, the start pulse is input to the fourth input terminal 24, the post-stage signal OUT (3) is input to the fifth input terminal 25, and the first output terminal 26 The output signal OUT (1) (SR) is output, and the second output signal OUT (1) is output from the second output terminal 27. Although not shown, the pulse output circuit is connected to the power supply line 51, the power supply line 52, and the power supply line 53.

Next, an example of a specific circuit configuration of the pulse output circuit will be described with reference to FIG.

The first pulse output circuit 10_1 includes a first transistor 31 to an eleventh transistor 41 (see FIG. 12C). In addition to the first input terminal 21 to the fifth input terminal 25, the first output terminal 26, and the second output terminal 27 described above, the power supply line 51 to which the first high power supply potential VDD is supplied, A signal or a power supply potential is supplied to the first transistor 31 to the eleventh transistor 41 from the power supply line 52 supplied with the second high power supply potential VCC and the power supply line 53 supplied with the low power supply potential VSS. Here, the magnitude relationship between the power supply potentials of the power supply lines in FIG. 12C is as follows: first high power supply potential VDD> second high power supply potential VCC> low power supply potential VSS (VCC is a potential lower than VDD, VSS Is lower than VCC). Note that the first clock signal (CK1) to the fourth clock signal (CK4) are signals that repeat the H level and the L level at regular intervals, and are VDD when the level is H and VSS when the level is the L level. And Note that by making the potential VCC of the power supply line 52 lower than the potential VDD of the power supply line 51, the potential applied to the gate electrode of the transistor can be kept low without affecting the operation. Shift can be reduced and deterioration can be suppressed.

12C, the first transistor 31 has a first terminal electrically connected to the power supply line 51, a second terminal electrically connected to the first terminal of the ninth transistor 39, and a gate electrode The fourth input terminal 24 is electrically connected. The second transistor 32 has a first terminal electrically connected to the power supply line 53, a second terminal electrically connected to the first terminal of the ninth transistor 39, and a gate electrode connected to the fourth transistor 34. It is electrically connected to the gate electrode. The third transistor 33 has a first terminal electrically connected to the first input terminal 21 and a second terminal electrically connected to the first output terminal 26. The fourth transistor 34 has a first terminal electrically connected to the power supply line 53 and a second terminal electrically connected to the first output terminal 26. The fifth transistor 35 has a first terminal electrically connected to the power supply line 53, a second terminal electrically connected to the gate electrode of the second transistor 32 and the gate electrode of the fourth transistor 34, and a gate The electrode is electrically connected to the fourth input terminal 24. The sixth transistor 36 has a first terminal electrically connected to the power supply line 52, a second terminal electrically connected to the gate electrode of the second transistor 32 and the gate electrode of the fourth transistor 34, and a gate The electrode is electrically connected to the fifth input terminal 25. The seventh transistor 37 has a first terminal electrically connected to the power supply line 52, a second terminal electrically connected to the second terminal of the eighth transistor 38, and a gate electrode connected to the third input terminal 23. Is electrically connected. The eighth transistor 38 has a first terminal electrically connected to the gate electrode of the second transistor 32 and the gate electrode of the fourth transistor 34, and a gate electrode electrically connected to the second input terminal 22. ing. The ninth transistor 39 has a first terminal electrically connected to the second terminal of the first transistor 31 and the second terminal of the second transistor 32, and a second terminal connected to the gate electrode of the third transistor 33 and The tenth transistor 40 is electrically connected to the gate electrode, and the gate electrode is electrically connected to the power supply line 52. The tenth transistor 40 has a first terminal electrically connected to the first input terminal 21, a second terminal electrically connected to the second output terminal 27, and a gate electrode connected to the ninth transistor 39. It is electrically connected to the second terminal. The eleventh transistor 41 has a first terminal electrically connected to the power supply line 53, a second terminal electrically connected to the second output terminal 27, and a gate electrode connected to the gate electrode of the second transistor 32 and The fourth transistor 34 is electrically connected to the gate electrode.

In FIG. 12C, a connection point between the gate electrode of the third transistor 33, the gate electrode of the tenth transistor 40, and the second terminal of the ninth transistor 39 is a node A. In addition, the gate electrode of the second transistor 32, the gate electrode of the fourth transistor 34, the second terminal of the fifth transistor 35, the second terminal of the sixth transistor 36, the first terminal of the eighth transistor 38, A connection point of the gate electrode of the eleventh transistor 41 is a node B (see FIG. 13A).

Note that a transistor is an element having at least three terminals including a gate, a drain, and a source. The transistor has a channel region between the drain region and the source region, and the drain region, the channel region, and the source region. A current can be passed through. Here, since the source and the drain vary depending on the structure and operating conditions of the transistor, it is difficult to limit which is the source or the drain. Thus, a region functioning as a source and a drain may not be referred to as a source or a drain. In that case, as an example, there are cases where they are referred to as a first terminal and a second terminal, respectively.

Here, FIG. 13B shows a timing chart of a shift register including a plurality of pulse output circuits shown in FIG. Note that in the case where the shift register is a scan line driver circuit, a period 61 in FIG. 13B corresponds to a vertical blanking period, and a period 62 corresponds to a gate selection period.

As shown in FIG. 13A, by providing the ninth transistor 39 to which the second high power supply potential VCC is applied to the gate electrode, the following advantages are obtained before and after the bootstrap operation. There is.

In the case where there is no ninth transistor 39 to which the second high power supply potential VCC is applied to the gate electrode, when the potential of the node A is increased by the bootstrap operation, the potential of the source that is the second terminal of the first transistor 31 is It rises and becomes higher than the first high power supply potential VDD. Then, the source of the first transistor 31 is switched to the first terminal side, that is, the power supply line 51 side. Therefore, in the first transistor 31, a large bias voltage is applied between the gate and the source and between the gate and the drain, so that a large stress is applied, which can cause deterioration of the transistor. Therefore, by providing the ninth transistor 39 to which the second high power supply potential VCC is applied to the gate electrode, the potential of the node A is increased by the bootstrap operation, but the second terminal of the first transistor 31 is increased. It is possible to prevent an increase in the potential. That is, by providing the ninth transistor 39, the value of the negative bias voltage applied between the gate and the source of the first transistor 31 can be reduced. Therefore, with the circuit configuration of this embodiment, the negative bias voltage applied between the gate and the source of the first transistor 31 can be reduced, so that deterioration of the first transistor 31 due to stress is suppressed. be able to.

Note that the ninth transistor 39 is provided so as to be connected between the second terminal of the first transistor 31 and the gate of the third transistor 33 via the first terminal and the second terminal. Any configuration may be used. Note that in the case of a shift register including a plurality of pulse output circuits in this embodiment, the ninth transistor 39 may be omitted in a signal line driver circuit having more stages than a scanning line driver circuit, and the number of transistors is reduced. There are advantages.

Note that by using an oxide semiconductor for the semiconductor layers of the first transistor 31 to the eleventh transistor 41, off-state current of the transistor can be reduced and on-state current and field-effect mobility can be increased. Further, since the degree of deterioration can be reduced, malfunctions in the circuit can be reduced. In addition, a transistor using an oxide semiconductor is less deteriorated when a high potential is applied to a gate electrode than a transistor using amorphous silicon. For this reason, even if the first high power supply potential VDD is supplied to the power supply line that supplies the second high power supply potential VCC, the same operation can be obtained, and the number of power supply lines routed between the circuits can be reduced. Therefore, the circuit can be reduced in size.

Note that the clock signal supplied to the gate electrode of the seventh transistor 37 by the third input terminal 23 and the clock signal supplied to the gate electrode of the eighth transistor 38 by the second input terminal 22 are Even if the wiring relationship is changed so that the clock signal supplied from the second input terminal 22 to the gate electrode of the transistor becomes the clock signal supplied from the third input terminal 23 to the eighth gate electrode, the same effect is obtained. Play. Note that in the shift register illustrated in FIG. 13A, when the seventh transistor 37 and the eighth transistor 38 are both on, the seventh transistor 37 is off and the eighth transistor 38 is on. When the seventh transistor 37 is turned off and the eighth transistor 38 is turned off, the potential of the node B is lowered by the potential of the second input terminal 22 and the third input terminal 23 being lowered. Occurs twice due to a decrease in the potential of the gate electrode of the seventh transistor 37 and a decrease in the potential of the gate electrode of the eighth transistor 38. On the other hand, in the shift register illustrated in FIG. 13A, the seventh transistor 37 and the eighth transistor 38 are both turned on, the seventh transistor 37 is turned on, and the eighth transistor 38 is turned off. When the seventh transistor 37 is turned off and the eighth transistor 38 is turned off, the potential of the node B is lowered by the potential of the second input terminal 22 and the third input terminal 23 being lowered. Can be reduced at a time by reducing the potential of the gate electrode of the eighth transistor 38. For this reason, the clock signal CK3 is supplied from the third input terminal 23 to the gate electrode of the seventh transistor 37, and the clock signal CK2 is supplied from the second input terminal 22 to the gate electrode of the eighth transistor 38. Is preferable. This is because the number of fluctuations in the potential of the node B is reduced and noise can be reduced.

As described above, by setting the signal to be periodically supplied to the node B during the period in which the potentials of the first output terminal 26 and the second output terminal 27 are held at the L level, the pulse output is performed. A malfunction of the circuit can be suppressed.

(Embodiment 6)
In this embodiment, as an example of the semiconductor device of the present invention, a transistor formed in the same manner as in Embodiment 1 or 2 is used for a pixel portion and further in a driver circuit (display device). Also known as). In addition, a part or the whole of a driver circuit including a transistor formed in a manner similar to that in Embodiment 1 or 2 can be formed over the same substrate as the pixel portion, so that a system-on-panel can be formed.

The display device includes a display element. As the display element, a liquid crystal element (also referred to as a liquid crystal display element) or a light-emitting element (also referred to as a light-emitting display element) can be used. The light emitting element includes, in its category, an element whose luminance is controlled by current or voltage, and specifically includes an inorganic EL (Electro Luminescence) element, an organic EL element, and the like. In addition, a display medium whose contrast is changed by an electric effect, such as electronic ink, can be used.

The display device includes a panel in which the display element is sealed, and a module in which an IC including a controller is mounted on the panel. Further, one embodiment of the present invention relates to an element substrate corresponding to one embodiment before the display element is completed in the process of manufacturing the display device, and the element substrate includes a plurality of means for supplying current to the display element. For each pixel. Specifically, the element substrate may be in a state in which only the pixel electrode layer of the display element is formed, or after the conductive film to be the pixel electrode layer is formed and etched to form the pixel electrode layer It may be in the state before forming the film, and all forms are applicable.

Note that a display device in this specification means an image display device, a display device, or a light source (including a lighting device). Also, a connector, for example, a module with a FPC (Flexible printed circuit) or TAB (Tape Automated Bonding) tape or TCP (Tape Carrier Package), a module with a printed wiring board at the end of a TAB tape or TCP, or a display It is assumed that the display device includes all modules in which an IC (integrated circuit) is directly mounted on the element by a COG (Chip On Glass) method.

In this embodiment, the appearance and a cross section of a liquid crystal display panel, which is one embodiment of the semiconductor device of the present invention, will be described with reference to FIGS. 14 illustrates a structure in which transistors 4010 and 4011 and a liquid crystal element 4013 which are formed over the first substrate 4001 in the same manner as in Embodiment 2 are provided between the first substrate 4001 and the second substrate 4006 with a sealant 4005. FIG. 14B is a top view of the sealed panel, and FIG. 14B corresponds to a cross-sectional view taken along line MN in FIGS. 14A1 and 14A2.

A sealant 4005 is provided so as to surround the pixel portion 4002 provided over the first substrate 4001 and the scan line driver circuit 4004. A second substrate 4006 is provided over the pixel portion 4002 and the scan line driver circuit 4004. Therefore, the pixel portion 4002 and the scan line driver circuit 4004 are sealed together with the liquid crystal layer 4008 by the first substrate 4001, the sealant 4005, and the second substrate 4006. A signal line driver circuit 4003 formed of a single crystal semiconductor film or a polycrystalline semiconductor film is mounted over a separately prepared substrate in a region different from the region surrounded by the sealant 4005 over the first substrate 4001. Has been.

Note that a connection method of a driver circuit which is separately formed is not particularly limited, and a COG method, a wire bonding method, a TAB method, or the like can be used. 14A1 illustrates an example in which the signal line driver circuit 4003 is mounted by a COG method, and FIG. 14A2 illustrates an example in which the signal line driver circuit 4003 is mounted by a TAB method.

In addition, the pixel portion 4002 and the scan line driver circuit 4004 provided over the first substrate 4001 include a plurality of transistors. In FIG. 14B, the transistor 4010 included in the pixel portion 4002 and the scan line The transistor 4011 included in the driver circuit 4004 is illustrated. Insulating layers 4020 and 4021 are provided over the transistors 4010 and 4011.

As the transistors 4010 and 4011, for example, the transistor described in Embodiment 1 or 2 can be used. In this embodiment, the transistors 4010 and 4011 are n-channel transistors.

In addition, the pixel electrode layer 4030 included in the liquid crystal element 4013 is electrically connected to the transistor 4010. A counter electrode layer 4031 of the liquid crystal element 4013 is formed over the second substrate 4006. A portion where the pixel electrode layer 4030, the counter electrode layer 4031, and the liquid crystal layer 4008 overlap corresponds to the liquid crystal element 4013. Note that the pixel electrode layer 4030 and the counter electrode layer 4031 are provided with insulating layers 4032 and 4033 each functioning as an alignment film, and the liquid crystal layer 4008 is interposed between the insulating layers 4032 and 4033.

Note that as the first substrate 4001 and the second substrate 4006, glass, metal (typically stainless steel), ceramics, or plastic can be used. As the plastic, an FRP (Fiberglass-Reinforced Plastics) plate, a PVF (polyvinyl fluoride) film, a polyester film, or an acrylic resin film can be used. A sheet having a structure in which an aluminum foil is sandwiched between PVF films or polyester films can also be used.

The spacer 4035 is a columnar spacer obtained by selectively etching the insulating film, and is provided to control the distance (cell gap) between the pixel electrode layer 4030 and the counter electrode layer 4031. A spherical spacer may be used. The counter electrode layer 4031 is electrically connected to a common potential line provided over the same substrate as the transistor 4010 through conductive particles. Note that the conductive particles are included in the sealant 4005.

Alternatively, a liquid crystal exhibiting a blue phase for which an alignment film is unnecessary may be used. The blue phase is one of the liquid crystal phases. When the temperature of the cholesteric liquid crystal is increased, the blue phase appears immediately before the transition from the cholesteric phase to the isotropic phase. Since the blue phase appears only in a narrow temperature range, the liquid crystal layer 4008 is formed using a liquid crystal composition in which 5% by weight or more of a chiral agent is mixed in order to improve the temperature range. A liquid crystal composition including a liquid crystal exhibiting a blue phase and a chiral agent has a response speed as short as 10 μs to 100 μs and is optically isotropic, so that alignment treatment is unnecessary and viewing angle dependency is small.

Note that this embodiment is an example of a transmissive liquid crystal display device; however, one embodiment of the present invention can be applied to a reflective liquid crystal display device or a transflective liquid crystal display device.

In the liquid crystal display device of this embodiment, a polarizing plate is provided on the outer side (viewing side) of the substrate, a colored layer is provided on the inner side, and an electrode layer used for the display element is provided in this order. May be provided. In addition, the stacked structure of the polarizing plate and the colored layer is not limited to this embodiment mode, and may be set as appropriate depending on the material and manufacturing process conditions of the polarizing plate and the colored layer. Further, a light shielding film functioning as a black matrix may be provided.

Further, in this embodiment, in order to reduce surface unevenness due to the transistor and to improve the reliability of the transistor, the transistor obtained in Embodiment 1 or 2 is used as a protective film or a planarization insulating film. And an insulating layer (insulating layer 4020, insulating layer 4021) functioning as Note that the protective film is for preventing entry of contaminant impurities such as organic substances, metal substances, and water vapor floating in the atmosphere, and a dense film is preferable. The protective film is formed by sputtering, using a silicon oxide film, a silicon nitride film, a silicon oxynitride film, a silicon nitride oxide film, an aluminum oxide film, an aluminum nitride film, an aluminum oxynitride film, or an aluminum nitride oxide film, Alternatively, a stacked layer may be formed. Although an example in which the protective film is formed by a sputtering method is described in this embodiment mode, the method is not particularly limited and may be formed by various methods.

Further, after the protective film is formed, the oxide semiconductor layer containing indium, gallium, and zinc may be annealed (300 ° C. to 400 ° C.).

In addition, the insulating layer 4021 is formed as the planarization insulating film. As the insulating layer 4021, an organic material having heat resistance such as polyimide, acrylic resin, benzocyclobutene-based resin, polyamide, or epoxy resin can be used. In addition to the organic material, a low dielectric constant material (low-k material), a siloxane resin, PSG (phosphorus glass), BPSG (phosphorus boron glass), or the like can be used. In the siloxane-based resin, an organic group (for example, an alkyl group or an aryl group) or a fluoro group may be used as a substituent. The organic group may have a fluoro group. Note that the insulating layer 4021 may be formed by stacking a plurality of insulating films formed using these materials.

Note that the siloxane-based resin corresponds to a resin including a Si—O—Si bond formed using a siloxane-based material as a starting material.

The formation method of the insulating layer 4021 is not particularly limited, and depending on the material, sputtering, SOG, spin coating, dip, spray coating, droplet discharge (inkjet method, screen printing, offset printing, etc.), doctor A knife, roll coater, curtain coater, knife coater or the like can be used. In the case where the insulating layer 4021 is formed using a material solution, annealing (300 ° C. to 400 ° C.) of the oxide semiconductor layer containing indium, gallium, and zinc may be performed at the same time as the baking step. By combining the baking process of the insulating layer 4021 and annealing of the oxide semiconductor layer containing indium, gallium, and zinc, a semiconductor device can be efficiently manufactured.

The pixel electrode layer 4030 and the counter electrode layer 4031 include indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, and indium tin oxide ( Hereinafter, it is referred to as ITO), and a light-transmitting conductive material such as indium zinc oxide or indium tin oxide to which silicon oxide is added can be used.

The pixel electrode layer 4030 and the counter electrode layer 4031 can be formed using a conductive composition including a conductive high molecule (also referred to as a conductive polymer). The pixel electrode layer formed using the conductive composition preferably has a sheet resistance of 10,000 Ω / □ or less and a light transmittance of 70% or more at a wavelength of 550 nm. Moreover, it is preferable that the resistivity of the conductive polymer contained in the conductive composition is 0.1 Ω · cm or less.

As the conductive polymer, a so-called π-electron conjugated conductive polymer can be used. For example, polyaniline or a derivative thereof, polypyrrole or a derivative thereof, polythiophene or a derivative thereof, or a copolymer of two or more kinds thereof can be given.

In addition, a variety of signals and potentials are supplied to the signal line driver circuit 4003, the scan line driver circuit 4004, and the pixel portion 4002 which are separately formed from an FPC 4018.

In this embodiment, the connection terminal electrode 4015 is formed using the same conductive film as the pixel electrode layer 4030 included in the liquid crystal element 4013, and the terminal electrode 4016 is formed using the same conductive film as the source electrode layer and the drain electrode layer of the transistor 4011. Has been.

The connection terminal electrode 4015 is electrically connected to a terminal included in the FPC 4018 through an anisotropic conductive film 4019.

FIG. 14 illustrates an example in which the signal line driver circuit 4003 is formed separately and mounted on the first substrate 4001; however, this embodiment is not limited to this structure. The scan line driver circuit may be separately formed and then mounted, or only part of the signal line driver circuit or part of the scan line driver circuit may be separately formed and then mounted.

FIG. 15 illustrates an example in which a liquid crystal display module is formed as a semiconductor device using a transistor substrate 2600 manufactured according to one embodiment of the present invention.

FIG. 15 illustrates an example of a liquid crystal display module. A transistor substrate 2600 and a counter substrate 2601 are fixed to each other with a sealant 2602, and a pixel portion 2603 including a transistor, a display element 2604 including a liquid crystal layer, and a coloring layer 2605 are provided therebetween. A display area is formed. The colored layer 2605 is necessary for color display. In the case of the RGB method, a colored layer corresponding to each color of red, green, and blue is provided corresponding to each pixel. A polarizing plate 2606, a polarizing plate 2607, and a diffusion plate 2613 are provided outside the transistor substrate 2600 and the counter substrate 2601. The light source is composed of a cold cathode tube 2610 and a reflector 2611. The circuit board 2612 is connected to the wiring circuit portion 2608 of the transistor substrate 2600 by a flexible wiring board 2609, and an external circuit such as a control circuit or a power circuit is incorporated. Yes. Moreover, you may laminate | stack in the state which had the phase difference plate between the polarizing plate and the liquid-crystal layer.

The liquid crystal display modules include TN (Twisted Nematic) mode, IPS (In-Plane-Switching) mode, FFS (Fringe Field Switching) mode, MVA (Multi-domain Vertical Alignment) mode, PVA (Pattern Attached Pattern) (Axial Symmetrically Aligned Micro-cell) mode, OCB (Optically Compensated Birefringence) mode, FLC (Ferroelectric Liquid Crystal) mode, AFLC (Anti-Ferroelectric Liquid mode) It can be used.

Through the above process, a display device including a transistor with excellent operation stability can be manufactured. The liquid crystal display device of this embodiment has high reliability because it includes a transistor having excellent operation stability.

The display device of this embodiment includes a light-transmitting transistor in a pixel portion and has a high aperture ratio. In addition, since the source electrode and the drain electrode are formed using an oxide conductive layer that includes oxygen deficiency and impurities (eg, hydrogen) and has increased conductivity, loss of on-state current is small.

In addition, the transistor provided in the pixel portion and the driver circuit of the display device in this embodiment has a wide band gap and a carrier concentration of less than 1 × 10 ¹⁴ / cm ³ , preferably 1 × 10 ¹² / cm ³ or less. Therefore, normally-off behavior is exhibited and the off-state current is low. Specifically, the off current at room temperature per channel width of 1 μm can be set to 1 × 10 ⁻¹⁶ A / μm or less, further 1 aA / μm (1 × 10 ⁻¹⁸ A / μm) or less.

As a result, a display device in which leakage current is suppressed and power saving can be provided. In addition, a display device with a large ratio of on-state current to off-state current can be provided. In addition, a display device with excellent contrast and high display quality can be provided.

In addition, since the display device in this embodiment includes a transistor with high field-effect mobility using a highly purified oxide semiconductor layer, the display device operates at high speed and has high-definition video display characteristics and high definition. Display is possible.

This embodiment can be implemented in appropriate combination with the structures described in the other embodiments.

(Embodiment 7)
In this embodiment mode, a light-emitting display device is shown as an example of the semiconductor device of the present invention. As a display element included in the display device, a light-emitting element utilizing electroluminescence is described in this embodiment. A light-emitting element using electroluminescence is distinguished depending on whether the light-emitting material is an organic compound or an inorganic compound. Generally, the former is called an organic EL element and the latter is called an inorganic EL element.

In the organic EL element, by applying a voltage to the light emitting element, electrons and holes are respectively injected from the pair of electrodes into the layer containing a light emitting organic compound, and a current flows. Then, these carriers (electrons and holes) recombine, whereby the light-emitting organic compound forms an excited state, and emits light when the excited state returns to the ground state. Due to such a mechanism, such a light-emitting element is referred to as a current-excitation light-emitting element.

Inorganic EL elements are classified into a dispersion-type inorganic EL element and a thin-film inorganic EL element depending on the element structure. The dispersion-type inorganic EL element has a light-emitting layer in which particles of a light-emitting material are dispersed in a binder, and the light emission mechanism is donor-acceptor recombination light emission using a donor level and an acceptor level. The thin-film inorganic EL element has a structure in which a light emitting layer is sandwiched between dielectric layers and further sandwiched between electrodes, and the light emission mechanism is localized light emission utilizing inner-shell electron transition of metal ions. Note that in this embodiment, an organic EL element is used as a light-emitting element.

FIG. 16 illustrates an example of a pixel structure to which digital time grayscale driving can be applied as an example of a semiconductor device to which one embodiment of the present invention is applied. Note that OS in the drawing represents a transistor including an oxide semiconductor.

A structure and operation of a pixel to which digital time gray scale driving can be applied will be described. In this embodiment, two n-channel transistors each using one of the oxide semiconductor layers (In—Ga—Zn—O-based film) described in Embodiment 1 or 2 for a channel formation region are used in one pixel. An example of use will be shown.

The pixel 6400 includes a switching transistor 6401, a driving transistor 6402, a light-emitting element 6404, and a capacitor 6403. The switching transistor 6401 has a gate connected to the scanning line 6406, a first electrode (one of the source electrode and the drain electrode) connected to the signal line 6405, and a second electrode (the other of the source electrode and the drain electrode) connected to the driving transistor. 6402 is connected to the gate. The driving transistor 6402 has a gate connected to the power supply line 6407 through the capacitor 6403, a first electrode connected to the power supply line 6407, and a second electrode connected to the first electrode (pixel electrode layer) of the light emitting element 6404. Has been. The second electrode of the light emitting element 6404 corresponds to the common electrode 6408. The common electrode 6408 is electrically connected to a common potential line formed over the same substrate.

Note that a low power supply potential is set for the second electrode (the common electrode 6408) of the light-emitting element 6404. Note that the low power supply potential is a potential that satisfies the low power supply potential <the high power supply potential with reference to the high power supply potential set in the power supply line 6407. For example, GND, 0V, or the like is set as the low power supply potential. Also good. The potential difference between the high power supply potential and the low power supply potential is applied to the light emitting element 6404 and a current is caused to flow through the light emitting element 6404 so that the light emitting element 6404 emits light. Each potential is set to be equal to or higher than the forward threshold voltage.

Note that the capacitor 6403 can be omitted by using the gate capacitance of the driving transistor 6402 instead. As for the gate capacitance of the driving transistor 6402, a capacitance may be formed between the channel region and the gate electrode layer. Note that since the off-state current of the transistors described in Embodiments 1 and 2 is extremely low, the capacity of the capacitor 6403 can be reduced or the capacitor can be omitted.

Here, in the case of the voltage input voltage driving method, a video signal is input to the gate of the driving transistor 6402 so that the driving transistor 6402 is sufficiently turned on or off. That is, the driving transistor 6402 is operated in a linear region. Since the driving transistor 6402 operates in a linear region, a voltage higher than the voltage of the power supply line 6407 is applied to the gate of the driving transistor 6402. Note that a voltage equal to or higher than (power supply line voltage + Vth of the driving transistor 6402) is applied to the signal line 6405.

In addition, when analog grayscale driving is performed instead of digital time grayscale driving, the same pixel configuration as that in FIG. 16 can be used by changing signal input.

In the case of performing analog gradation driving, a voltage equal to or higher than the forward voltage of the light emitting element 6404 + Vth of the driving transistor 6402 is applied to the gate of the driving transistor 6402. The forward voltage of the light-emitting element 6404 refers to a voltage for obtaining desired luminance, and includes at least a forward threshold voltage. Note that when a video signal that causes the driving transistor 6402 to operate in a saturation region is input, a current can flow through the light-emitting element 6404. In order to operate the driving transistor 6402 in the saturation region, the potential of the power supply line 6407 is set higher than the gate potential of the driving transistor 6402. By making the video signal analog, current corresponding to the video signal can be supplied to the light-emitting element 6404 to perform analog gradation driving.

Note that the pixel structure illustrated in FIG. 16 is not limited thereto. For example, a switch, a resistor, a capacitor, a transistor, a logic circuit, or the like may be newly added to the pixel illustrated in FIG.

Next, the structure of the light-emitting element will be described with reference to FIG. In this embodiment mode, a cross-sectional structure of a pixel will be described using an example in which a driving transistor is an n-type transistor. The driving transistors 7001, 7011, and 7021 used in the semiconductor devices in FIGS. 17A to 17C can be manufactured in a manner similar to that of the transistor described in Embodiment 1 or 2.

In order to extract light emitted from the light-emitting element, at least one of the anode and the cathode may be transparent. Then, a transistor and a light emitting element are formed on the substrate, and the top emission that extracts light from the surface opposite to the substrate, the bottom emission that extracts light from the surface on the substrate, and the side opposite to the surface on the substrate and the substrate The pixel structure of one embodiment of the present invention can be applied to any light-emitting element having any emission structure.

A light-emitting element having a bottom emission structure will be described with reference to FIG.

A cross-sectional view of a pixel in the case where the driving transistor 7011 is n-type and light emitted from the light-emitting element 7012 is emitted to the first electrode 7013 side is shown. In FIG. 17A, a first electrode 7013 of a light-emitting element 7012 is formed over a light-transmitting conductive film 7017 electrically connected to a source electrode or a drain electrode of a driving transistor 7011. An EL layer 7014 and a second electrode 7015 are sequentially stacked over the first electrode 7013.

As the light-transmitting conductive film 7017, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium tin oxide, A light-transmitting conductive film such as indium zinc oxide or indium tin oxide to which silicon oxide is added can be used.

In addition, various materials can be used for the first electrode 7013 of the light-emitting element. For example, in the case where the first electrode 7013 is used as a cathode, a material having a low work function, specifically, an alkali metal such as Li or Cs, and an alkaline earth metal such as Mg, Ca, or Sr, and In addition to alloys containing these (Mg: Ag, Al: Li, etc.), rare earth metals such as Yb and Er are preferred. In FIG. 17A, the thickness of the first electrode 7013 is set so as to transmit visible light (preferably, approximately 5 nm to 30 nm). For example, an aluminum film having a thickness of 20 nm is used as the first electrode 7013.

Note that after the light-transmitting conductive film and the aluminum film are stacked, the light-transmitting conductive film 7017 and the first electrode 7013 may be formed by selective etching. Since it can etch using a mask, it is preferable.

A partition 7019 is formed over the contact hole that is formed in the protective insulating layer 7035, the overcoat layer 7034, and the insulating layer 7032 and reaches the drain electrode layer with a light-transmitting conductive film 7017 interposed therebetween. Note that the peripheral edge portion of the first electrode 7013 may be covered with a partition wall. A partition wall 7019 is formed using an organic resin film such as polyimide, acrylic resin, polyamide, or epoxy resin, an inorganic insulating film, or organic polysiloxane. The partition wall 7019 is formed using an especially photosensitive resin material so that an opening is formed over the first electrode 7013 and the side wall of the opening has an inclined surface formed with a continuous curvature. Is preferred. In the case where a photosensitive resin material is used for the partition 7019, a step of forming a resist mask can be omitted.

In addition, the EL layer 7014 formed over the first electrode 7013 and the partition wall 7019 may include at least a light-emitting layer, and may be formed using a single layer or a plurality of layers. Can be either. In the case where the EL layer 7014 includes a plurality of layers and the first electrode 7013 is used as a cathode, an electron injection layer, an electron transport layer, a light-emitting layer, a hole transport layer, and a hole injection layer are formed over the first electrode 7013 in this order. Laminate. Of these, it is not necessary to provide all layers other than the light emitting layer.

Further, the order of stacking is not limited, and when the first electrode 7013 is used as an anode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are stacked in this order on the first electrode 7013. May be. However, when comparing power consumption, the first electrode 7013 functions as a cathode, and the electron injection layer, the electron transport layer, the light-emitting layer, the hole transport layer, and the hole injection layer are stacked in this order on the first electrode 7013. This is preferable because it is possible to suppress a voltage rise in the drive circuit portion and reduce power consumption.

For the second electrode 7015 formed over the EL layer 7014, various materials can be used. For example, when the second electrode 7015 is used as an anode, a material having a high work function, such as ZrN, Ti, W, Ni, Pt, or Cr, or a transparent conductive material such as ITO, IZO, or ZnO is preferable. Further, a shielding film 7016 such as a metal that blocks light, a metal that reflects light, or the like is used over the second electrode 7015. In this embodiment, an ITO film is used as the second electrode 7015 and a Ti film is used as the shielding film 7016.

A region where the EL layer 7014 including the light-emitting layer is sandwiched between the first electrode 7013 and the second electrode 7015 corresponds to the light-emitting element 7012. In the case of the element structure illustrated in FIG. 17A, light emitted from the light-emitting element 7012 is emitted to the first electrode 7013 side as indicated by an arrow.

Note that in FIG. 17A, light emitted from the light-emitting element 7012 passes through the color filter layer 7033 and is emitted through the insulating layer 7032, the gate insulating layer 7030, and the substrate 7010.

The color filter layer 7033 is formed by a droplet discharge method such as an inkjet method, a printing method, an etching method using a photolithography technique, or the like.

The color filter layer 7033 is covered with an overcoat layer 7034 and further covered with a protective insulating layer 7035. Note that although the overcoat layer 7034 is illustrated as being thin in FIG. 17A, the overcoat layer 7034 has a function of flattening unevenness caused by the color filter layer 7033 by using a resin material such as an acrylic resin. Have.

Next, a light-emitting element having a dual emission structure will be described with reference to FIG.

In FIG. 17B, the first electrode 7023 of the light-emitting element 7022 is formed over the light-transmitting conductive film 7027 which is electrically connected to the source electrode or the drain electrode of the driving transistor 7021. An EL layer 7024 and a second electrode 7025 are stacked over the first electrode 7023 in this order.

As the light-transmitting conductive film 7027, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, indium tin oxide containing titanium oxide, indium tin oxide, A light-transmitting conductive film such as indium zinc oxide or indium tin oxide to which silicon oxide is added can be used.

The first electrode 7023 can be formed using various materials. For example, when the first electrode 7023 is used as a cathode, a material having a small work function, specifically, an alkali metal such as Li or Cs, an alkaline earth metal such as Mg, Ca, or Sr, and these are used. In addition to alloys (Mg: Ag, Al: Li, etc.), rare earth metals such as Yb and Er are preferred. In the case where a metal film is used for the first electrode 7023, the thickness thereof is set so as to transmit light (preferably, about 5 nm to 30 nm). For example, in the case where the first electrode 7023 is used as a cathode, an aluminum film having a thickness of 20 nm can be used.

Note that after the light-transmitting conductive film and the light-transmitting metal film are stacked, the light-transmitting conductive film 7027 and the first electrode 7023 may be formed by selective etching. In this case, etching can be performed using the same mask, which is preferable.

A partition 7029 is formed over the contact hole formed in the protective insulating layer 7045, the overcoat layer 7044, and the insulating layer 7042 and reaching the drain electrode layer with a light-transmitting conductive film 7027 interposed therebetween. Note that the periphery of the first electrode 7023 may be covered with a partition wall. The partition wall 7029 is formed using an organic resin film such as polyimide, acrylic resin, polyamide, or epoxy resin, an inorganic insulating film, or organic polysiloxane. The partition wall 7029 is formed using an especially photosensitive resin material so that an opening is formed over the first electrode 7023 and the side wall of the opening has an inclined surface formed with a continuous curvature. Is preferred. In the case where a photosensitive resin material is used for the partition wall 7029, a step of forming a resist mask can be omitted.

In addition, the EL layer 7024 formed over the first electrode 7023 and the partition wall 7029 may include a light-emitting layer, and may be a single layer or a stack of a plurality of layers. both are fine. In the case where the EL layer 7024 includes a plurality of layers and the first electrode 7023 is used as a cathode, the electron injection layer, the electron transport layer, the light-emitting layer, the hole transport layer, and the hole injection layer are stacked in this order. Note that it is not necessary to provide all of these layers.

In addition, the order of stacking is not limited, and when the first electrode 7023 is used as an anode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer are stacked over the first electrode 7023 in this order. May be. However, when comparing power consumption, the first electrode 7023 is used as a cathode, and the electron injection layer, the electron transport layer, the light emitting layer, the hole transport layer, and the hole injection layer are stacked in this order on the first electrode 7023. A voltage rise in the circuit portion can be suppressed, and power consumption is low, which is preferable.

For the second electrode 7025 formed over the EL layer 7024, various materials can be used. For example, when the second electrode 7025 is used as an anode, a material having a high work function, for example, a transparent conductive material such as ITO, IZO, or ZnO can be preferably used. In this embodiment, an ITO film containing silicon oxide is formed using the second electrode 7025 as an anode.

A region where the EL layer 7024 including the light-emitting layer is sandwiched between the first electrode 7023 and the second electrode 7025 corresponds to the light-emitting element 7022. In the case of the element structure illustrated in FIG. 17B, light emitted from the light-emitting element 7022 is emitted to both the second electrode 7025 side and the first electrode 7023 side as indicated by arrows.

Note that in FIG. 17B, one light emitted from the light-emitting element 7022 to the first electrode 7023 side passes through the color filter layer 7043 and passes through the insulating layer 7042, the gate insulating layer 7040, and the substrate 7020. And inject.

The color filter layer 7043 is formed by a droplet discharge method such as an inkjet method, a printing method, an etching method using a photolithography technique, or the like.

The color filter layer 7043 is covered with an overcoat layer 7044 and further covered with a protective insulating layer 7045.

However, in the case where a light emitting element having a dual emission structure is used and both display surfaces are displayed in full color, light from the second electrode 7025 side does not pass through the color filter layer 7043; A substrate is preferably provided above the second electrode 7025.

Next, a light-emitting element having a top emission structure will be described with reference to FIG.

FIG. 17C is a cross-sectional view of a pixel in the case where the driving transistor 7001 is n-type and light emitted from the light-emitting element 7002 is emitted to the second electrode 7005 side. In FIG. 17C, a first electrode 7003 of a light-emitting element 7002 which is electrically connected to a source electrode or a drain electrode of a driving transistor 7001 is formed. An EL layer 7004 is formed over the first electrode 7003. A second electrode 7005 is sequentially stacked.

The first electrode 7003 can be formed using various materials. For example, when the first electrode 7003 is used as a cathode, a material having a low work function, specifically, an alkali metal such as Li or Cs, an alkaline earth metal such as Mg, Ca, or Sr, and these are used. In addition to alloys (Mg: Ag, Al: Li, etc.), rare earth metals such as Yb and Er are preferred.

A partition 7009 is formed in the protective insulating layer 7052 and the insulating layer 7055 and is disposed over the contact hole reaching the drain electrode layer with the first electrode 7003 interposed therebetween. Note that the periphery of the first electrode 7003 may be covered with a partition wall. A partition 7009 is formed using an organic resin film such as polyimide, acrylic resin, polyamide, or epoxy resin, an inorganic insulating film, or organic polysiloxane. The partition wall 7009 is formed using an especially photosensitive resin material so that an opening is formed over the first electrode 7003 and the side wall of the opening has an inclined surface formed with a continuous curvature. Is preferred. In the case where a photosensitive resin material is used for the partition 7009, a step of forming a resist mask can be omitted.

In addition, the EL layer 7004 formed over the first electrode 7003 and the partition wall 7009 only needs to include at least a light-emitting layer, and even though it is formed of a single layer, a plurality of layers are stacked. Can be either. In the case where the EL layer 7004 includes a plurality of layers and the first electrode 7003 is used as a cathode, the electron injection layer, the electron transport layer, the light-emitting layer, the hole transport layer, and the hole injection layer are stacked in this order. Note that it is not necessary to provide all of these layers.

Further, the order of stacking is not limited, and when the first electrode 7003 is used as an anode, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are stacked in that order on the first electrode 7003. You may laminate.

For example, the first electrode 7003 in which a Ti film, an aluminum film, and a Ti film are stacked is used as an anode, and a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer are formed on the first electrode 7003 in this order. Laminate, and a laminate of Mg: Ag alloy thin film and ITO is formed thereon.

Note that in the case where the driving transistor 7001 is an n-type, an increase in voltage in the driver circuit is suppressed by sequentially stacking an electron injection layer, an electron transport layer, a light-emitting layer, a hole transport layer, and a hole injection layer over the first electrode 7003. This is preferable because power consumption can be reduced.

The second electrode 7005 is formed using a light-transmitting conductive material that transmits visible light, for example, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, or indium oxide containing titanium oxide. Alternatively, a light-transmitting conductive film such as indium tin oxide containing titanium oxide, indium tin oxide, indium zinc oxide, or indium tin oxide added with silicon oxide may be used.

A region where the EL layer 7004 including the light-emitting layer is sandwiched between the first electrode 7003 and the second electrode 7005 corresponds to the light-emitting element 7002. In the case of the pixel shown in FIG. 17C, light emitted from the light-emitting element 7002 is emitted to the second electrode 7005 side as shown by an arrow.

The planarization insulating layer 7053 can be formed using a resin material such as polyimide, acrylic resin, benzocyclobutene resin, polyamide, or epoxy resin. In addition to the resin material, a low dielectric constant material (low-k material), a siloxane resin, PSG (phosphorus glass), BPSG (phosphorus boron glass), or the like can be used. Note that the planarization insulating layer 7053 may be formed by stacking a plurality of insulating films formed using these materials. There is no particular limitation on the formation method of the planarization insulating layer 7053, and a sputtering method, an SOG method, spin coating, dip coating, spray coating, a droplet discharge method (inkjet method, screen printing, offset printing, or the like) is used depending on the material. A doctor knife, a roll coater, a curtain coater, a knife coater, or the like can be used.

In the structure of FIG. 17C, when full-color display is performed, for example, the light-emitting element 7002 is a green light-emitting element, one adjacent light-emitting element is a red light-emitting element, and the other light-emitting element is a blue light-emitting element. To do. Alternatively, a light-emitting display device capable of full color display may be manufactured using not only three types of light-emitting elements but also four types of light-emitting elements including white elements.

In the structure of FIG. 17C, a light-emitting display capable of full-color display has a structure in which a plurality of light-emitting elements to be arranged are all white light-emitting elements and a sealing substrate having a color filter or the like is disposed above the light-emitting elements 7002. A device may be made. A full-color display can be performed by forming a material that emits monochromatic light such as white and combining a color filter and a color conversion layer.

Of course, monochromatic light emission may be displayed. For example, a lighting device may be formed using white light emission, or an area color type light emitting device may be formed using monochromatic light emission.

If necessary, an optical film such as a polarizing film such as a circularly polarizing plate may be provided.

Note that although an organic EL element is described here as a light-emitting element, an inorganic EL element can also be provided as a light-emitting element.

Although an example in which a light emitting element is electrically connected to a transistor that controls driving of the light emitting element (driving transistor), a current control transistor is connected between the driving transistor and the light emitting element. It may be a configuration.

Note that the semiconductor device described in this embodiment is not limited to the structure illustrated in FIG. 17 and can be variously modified based on the technical idea of the present invention.

Next, the appearance and a cross section of a light-emitting display panel (also referred to as a light-emitting panel) which corresponds to one mode of a semiconductor device to which the transistor described in Embodiment 1 or 2 is applied will be described with reference to FIGS. 18 is a top view of a panel in which a transistor and a light-emitting element formed over the first substrate are sealed with a sealant between the second substrate and FIG. 18B. This corresponds to a cross-sectional view taken along line HI in FIG.

A sealant 4505 is provided so as to surround the pixel portion 4502, the signal line driver circuits 4503a and 4503b, and the scan line driver circuits 4504a and 4504b which are provided over the first substrate 4501. A second substrate 4506 is provided over the pixel portion 4502, the signal line driver circuits 4503a and 4503b, and the scan line driver circuits 4504a and 4504b. Therefore, the pixel portion 4502, the signal line driver circuits 4503a and 4503b, and the scan line driver circuits 4504a and 4504b are sealed together with the filler 4507 by the first substrate 4501, the sealant 4505, and the second substrate 4506. Thus, it is preferable to package (enclose) with a protective film (bonded film, ultraviolet curable resin film, etc.) or a cover material that has high air tightness and little degassing so as not to be exposed to the outside air.

The pixel portion 4502, the signal line driver circuits 4503a and 4503b, and the scan line driver circuits 4504a and 4504b provided over the first substrate 4501 each include a plurality of transistors. In FIG. A transistor 4510 included in 4502 and a transistor 4509 included in the signal line driver circuit 4503a are illustrated.

As the transistors 4509 and 4510, the highly reliable transistor described in Embodiment 1 or 2 including an oxide semiconductor layer (In—Ga—Zn—O-based film) can be used. In this embodiment, the transistors 4509 and 4510 are n-channel transistors.

A conductive layer 4540 is provided over the insulating layer 4544 so as to overlap with a channel formation region of the oxide semiconductor layer of the transistor 4509 for the driver circuit. By providing the conductive layer 4540 so as to overlap with the channel formation region of the oxide semiconductor layer, the amount of change in the threshold voltage of the transistor 4509 before and after the BT test can be reduced. The conductive layer 4540 may have the same potential as or different from the gate electrode layer of the transistor 4509 and can function as a second gate electrode layer. Further, the potential of the conductive layer 4540 may be GND, 0 V, or a floating state.

4511 corresponds to a light-emitting element, and a first electrode layer 4517 which is a pixel electrode included in the light-emitting element 4511 is electrically connected to a source electrode layer or a drain electrode layer of the transistor 4510. Note that the structure of the light-emitting element 4511 is a stacked structure of the first electrode layer 4517, the electroluminescent layer 4512, and the second electrode layer 4513; however, the structure is not limited to the structure described in this embodiment. The structure of the light-emitting element 4511 can be changed as appropriate depending on the direction of light extracted from the light-emitting element 4511 or the like.

A partition 4520 is formed using an organic resin film, an inorganic insulating film, or organic polysiloxane. In particular, a photosensitive material is preferably used so that an opening is formed over the first electrode layer 4517 and the side wall of the opening has an inclined surface formed with a continuous curvature.

The electroluminescent layer 4512 may be composed of a single layer or a plurality of layers stacked.

A protective film may be formed over the second electrode layer 4513 and the partition 4520 so that oxygen, hydrogen, moisture, carbon dioxide, or the like does not enter the light-emitting element 4511. As the protective film, a silicon nitride film, a silicon nitride oxide film, a DLC film, or the like can be formed.

In addition, a variety of signals and potentials are supplied to the signal line driver circuits 4503a and 4503b, the scan line driver circuits 4504a and 4504b, or the pixel portion 4502 from FPCs 4518a and 4518b.

In this embodiment, the connection terminal electrode 4515 is formed using the same conductive film as the first electrode layer 4517 included in the light-emitting element 4511, and the terminal electrode 4516 has the same conductivity as the source electrode layer and the drain electrode layer included in the transistor 4509. It is formed from a film.

The connection terminal electrode 4515 is electrically connected to a terminal included in the FPC 4518a through an anisotropic conductive film 4519.

The second substrate located in the direction in which light is extracted from the light-emitting element 4511 must be light-transmitting. In that case, a light-transmitting material such as a glass plate, a plastic plate, a polyester film, or an acrylic resin film is used.

In addition to the inert gas such as nitrogen and argon, the filler 4507 can be an ultraviolet curable resin or a thermosetting resin, such as PVC (polyvinyl chloride), acrylic resin, polyimide, epoxy resin, silicone resin, PVB (polyvinyl butyral) or EVA (ethylene vinyl acetate) can be used. In this embodiment, nitrogen is used as a filler.

If necessary, an optical film such as a polarizing plate, a circular polarizing plate (including an elliptical polarizing plate), a retardation plate (λ / 4 plate, λ / 2 plate), a color filter, or the like is provided on the light emitting element exit surface. You may provide suitably. Further, an antireflection film may be provided on the polarizing plate or the circularly polarizing plate. For example, anti-glare treatment can be performed that diffuses reflected light due to surface irregularities and reduces reflection.

The signal line driver circuits 4503a and 4503b and the scan line driver circuits 4504a and 4504b may be mounted with a driver circuit formed using a single crystal semiconductor film or a polycrystalline semiconductor film over a separately prepared substrate. Further, only the signal line driver circuit, or a part thereof, or only the scanning line driver circuit or only part thereof may be separately formed and mounted, and this embodiment mode is not limited to the structure in FIG.

Through the above process, a display device including a transistor with excellent operation stability can be manufactured. The light-emitting display device of this embodiment has high reliability because it includes a transistor with excellent operation stability.

In addition, the transistor provided in the pixel portion and the driver circuit of the display device in this embodiment has a wide band gap and a carrier concentration of less than 1 × 10 ¹⁴ / cm ³ , preferably 1 × 10 ¹² / cm ³ or less. Therefore, normally-off behavior is exhibited and the off-state current is low. Specifically, the off current at room temperature per channel width of 1 μm can be set to 1 × 10 ⁻¹⁶ A / μm or less, further 1 aA / μm (1 × 10 ⁻¹⁸ A / μm) or less.

As a result, a display device in which leakage current is suppressed and power saving can be provided. In addition, a display device with a large ratio of on-state current to off-state current can be provided. In addition, a display device with excellent contrast and high display quality can be provided.

In addition, since the display device in this embodiment includes a transistor with high field-effect mobility using a highly purified oxide semiconductor layer, the display device operates at high speed and has high-definition video display characteristics and high definition. Display is possible.

Note that the structure described in this embodiment can be combined with any of the structures described in the other embodiments as appropriate.

(Embodiment 8)
In this embodiment, an example of electronic paper is described as a display device which is an example of a semiconductor device of the present invention.

FIG. 19 illustrates active matrix electronic paper as an example of a display device to which one embodiment of the present invention is applied. The transistor 581 used for the display device can be manufactured in a manner similar to that of Embodiment 1 or 2.

The electronic paper in FIG. 19 is an example of a display device using a twisting ball display system. The twist ball display method is a method in which spherical particles separately painted in white and black are arranged between a first electrode layer and a second electrode layer which are electrode layers used for a display element, and the first electrode layer and the second electrode layer are arranged. In this method, display is performed by controlling the orientation of spherical particles by generating a potential difference between the two electrode layers.

A source electrode layer or a drain electrode layer of the transistor 581 is in contact with and electrically connected to the first electrode layer 587 through an opening formed in the insulating layer 585. Between the first electrode layer 587 and the second electrode layer 588, there are a black region 590a and a white region 590b, and a cavity 594 provided around the black region 590a and the white region 590b and filled with a liquid. The spherical particles 589 are provided, and the periphery of the spherical particles 589 is filled with a filler 595 such as a resin (see FIG. 19). In FIG. 19, 580 is a substrate, 583 is an interlayer insulating film, 584 is a protective film, and 596 is a substrate.

Further, instead of the twisting ball, an electrophoretic element can be used. A microcapsule having a diameter of about 10 μm to 200 μm in which transparent liquid, positively charged white microparticles, and negatively charged black microparticles are enclosed is used. In the microcapsule provided between the first electrode layer and the second electrode layer, when an electric field is applied by the first electrode layer and the second electrode layer, the white particles and the black particles are in opposite directions. And can display white or black. A display element to which this principle is applied is an electrophoretic display element, and a device using the electrophoretic display element is generally called electronic paper. Since the electrophoretic display element has higher reflectance than the liquid crystal display element, an auxiliary light is unnecessary, power consumption is small, and the display portion can be recognized even in a dim place. Further, even when power is not supplied to the display portion, an image once displayed can be held. Therefore, for example, even when a semiconductor device with a display function (also simply referred to as a display device or a semiconductor device including a display device) is moved away from a radio wave source serving as a power supply source, the displayed image is stored. It becomes possible to leave.

Through the above process, an electronic paper including a transistor with excellent operation stability can be manufactured. The electronic paper of this embodiment has high reliability because it is equipped with a transistor having excellent operational stability.

In addition, the transistor provided in the pixel portion and the driver circuit of the display device in this embodiment has a wide band gap and a carrier concentration of less than 1 × 10 ¹⁴ / cm ³ , preferably 1 × 10 ¹² / cm ³ or less. Therefore, normally-off behavior is exhibited and the off-state current is low. Specifically, the off current at room temperature per channel width of 1 μm can be set to 1 × 10 ⁻¹⁶ A / μm or less, further 1 aA / μm (1 × 10 ⁻¹⁸ A / μm) or less.

As a result, a display device in which leakage current is suppressed and power saving can be provided. In addition, a display device with a large ratio of on-state current to off-state current can be provided. In addition, a display device with excellent contrast and high display quality can be provided.

In addition, since the display device in this embodiment includes a transistor with high field-effect mobility using a highly purified oxide semiconductor layer, the display device operates at high speed and has high-definition video display characteristics and high definition. Display is possible.

This embodiment can be implemented in appropriate combination with the structures described in Embodiment 1 or Embodiment 2.

(Embodiment 9)
The display device of one embodiment of the present invention can be applied as electronic paper. Electronic paper can be used for electronic devices in various fields as long as they display information. For example, the electronic paper can be applied to an electronic book (electronic book), a poster, an advertisement in a vehicle such as a train, and a display on various cards such as a credit card. Examples of electronic devices are illustrated in FIGS.

FIG. 20A illustrates a poster 2631 made of electronic paper. In the case where the advertisement medium is a printed matter of paper, the advertisement is exchanged manually. However, the display of the advertisement can be changed in a short time by using electronic paper to which one embodiment of the present invention is applied. In addition, a stable image can be obtained without losing the display. Note that the poster may be configured to transmit and receive information wirelessly.

FIG. 20B illustrates an advertisement 2632 in a vehicle such as a train. When the advertising medium is printed paper, the advertisement is exchanged manually, but if the electronic paper to which one embodiment of the present invention is applied is used, the advertisement display can be changed in a short time without much labor. Can do. In addition, a stable image can be obtained without distorting the display. The in-vehicle advertisement may be configured to transmit and receive information wirelessly.

FIG. 21 illustrates an electronic book 2700. For example, the electronic book 2700 includes two housings, a housing 2701 and a housing 2703. The housing 2701 and the housing 2703 are integrated with a shaft portion 2711 and can be opened / closed using the shaft portion 2711 as an axis. With such a configuration, an operation like a paper book can be performed.

A display portion 2705 and a display portion 2707 are incorporated in the housing 2701 and the housing 2703, respectively. The display unit 2705 and the display unit 2707 may be configured to display a continuous screen or may be configured to display different screens. By adopting a configuration in which different screens are displayed, for example, a sentence can be displayed on the right display unit (display unit 2705 in FIG. 21) and an image can be displayed on the left display unit (display unit 2707 in FIG. 21). .

FIG. 21 illustrates an example in which the housing 2701 is provided with an operation unit and the like. For example, the housing 2701 is provided with a power supply 2721, operation keys 2723, a speaker 2725, and the like. Pages can be turned with the operation keys 2723. Note that a keyboard, a pointing device, or the like may be provided on the same surface as the display portion of the housing. Further, an external connection terminal (such as an earphone terminal, a USB terminal, or a terminal that can be connected to various types of cables such as an AC adapter and a USB cable), a recording medium insertion unit, and the like may be provided on the back and side surfaces of the housing. . Further, the e-book reader 2700 may have a structure having a function as an electronic dictionary.

Further, the e-book reader 2700 may have a configuration capable of transmitting and receiving information wirelessly. It is also possible to adopt a configuration in which desired book data or the like is purchased and downloaded from an electronic book server wirelessly.

A display device including a transistor with excellent operation stability can be manufactured using the transistor described in the above embodiment. A display device including a transistor with excellent operational stability has high reliability.

(Embodiment 10)
The semiconductor device according to one embodiment of the present invention can be applied to a variety of electronic devices (including game machines). Examples of the electronic device include a television device (also referred to as a television or a television receiver), a monitor for a computer, a digital camera, a digital video camera, a digital photo frame, a mobile phone (also referred to as a mobile phone or a mobile phone device). ), Large game machines such as portable game machines, portable information terminals, sound reproducing devices, and pachinko machines.

FIG. 22A illustrates a television device 9600. In the television device 9600, a display portion 9603 is incorporated in a housing 9601. Images can be displayed on the display portion 9603. In this embodiment, a structure in which the housing 9601 is supported by a stand 9605 is illustrated.

The television device 9600 can be operated with an operation switch provided in the housing 9601 or a separate remote controller 9610. Channels and volume can be operated with operation keys 9609 provided in the remote controller 9610, and an image displayed on the display portion 9603 can be operated. The remote controller 9610 may be provided with a display portion 9607 for displaying information output from the remote controller 9610.

Note that the television set 9600 is provided with a receiver, a modem, and the like. General TV broadcasts can be received by a receiver, and connected to a wired or wireless communication network via a modem, so that it can be unidirectional (sender to receiver) or bidirectional (sender and receiver). It is also possible to perform information communication between each other or between recipients).

FIG. 22B illustrates a digital photo frame 9700. For example, a digital photo frame 9700 has a display portion 9703 incorporated in a housing 9701. The display portion 9703 can display various images. For example, by displaying image data captured by a digital camera or the like, the display portion 9703 can function in the same manner as a normal photo frame.

Note that the digital photo frame 9700 includes an operation portion, an external connection terminal (a terminal that can be connected to various types of cables such as a USB terminal and a USB cable), a recording medium insertion portion, and the like. These configurations may be incorporated on the same surface as the display portion, but it is preferable to provide them on the side surface or the back surface because the design is improved. For example, a memory that stores image data captured by a digital camera can be inserted into the recording medium insertion unit of the digital photo frame to capture the image data, and the captured image data can be displayed on the display unit 9703.

Further, the digital photo frame 9700 may be configured to transmit and receive information wirelessly. A configuration may be employed in which desired image data is captured and displayed wirelessly.

FIG. 23A illustrates a portable game machine including two housings, a housing 9881 and a housing 9891, which are connected with a joint portion 9893 so that the portable game machine can be opened or folded. A display portion 9882 is incorporated in the housing 9881, and a display portion 9883 is incorporated in the housing 9891. In addition, the portable game machine shown in FIG. 23A includes a speaker portion 9884, a recording medium insertion portion 9886, an LED lamp 9890, input means (operation keys 9885, a connection terminal 9887, a sensor 9888 (force, displacement, position). , Speed, acceleration, angular velocity, number of revolutions, distance, light, liquid, magnetism, temperature, chemical, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, smell or infrared A microphone 9889) and the like. Needless to say, the structure of the portable game machine is not limited to that described above, and may be any structure as long as it includes at least the semiconductor device according to one embodiment of the present invention, and can be provided with any other appropriate facilities. . The portable game machine shown in FIG. 23A reads out a program or data recorded in a recording medium and displays the program or data on a display unit, or performs wireless communication with another portable game machine to share information. It has a function. Note that the function of the portable game machine illustrated in FIG. 23A is not limited to this, and the portable game machine can have a variety of functions.

FIG. 23B illustrates a slot machine 9900 which is a large-sized game machine. In the slot machine 9900, a display portion 9903 is incorporated in a housing 9901. In addition, the slot machine 9900 includes operation means such as a start lever and a stop switch, a coin slot, a speaker, and the like. Needless to say, the structure of the slot machine 9900 is not limited to the above structure, and may be any structure as long as it includes at least the semiconductor device according to one embodiment of the present invention, and can have other attached facilities as appropriate.

FIG. 24 shows a mobile phone 1000. A cellular phone 1000 includes a display portion 1002 incorporated in a housing 1001, operation buttons 1003, an external connection port 1004, a speaker 1005, a microphone 1006, and the like.

A cellular phone 1000 illustrated in FIG. 24 can input information by touching the display portion 1002 with a finger or the like. In addition, operations such as making a call or typing an e-mail can be performed by touching the display portion 1002 with a finger or the like.

There are mainly three screen modes of the display portion 1002. The first mode is a display mode mainly for displaying images. The first is a display mode mainly for displaying images, and the second is an input mode mainly for inputting information such as characters. The third is a display + input mode in which the display mode and the input mode are mixed.

For example, when making a phone call or creating an e-mail, the display unit 1002 may be set to a character input mode mainly for inputting characters and an operation for inputting characters displayed on the screen may be performed. In this case, it is preferable to display a keyboard or number buttons on most of the screen of the display portion 1002.

Further, by providing a detection device having a sensor for detecting the inclination, such as a gyroscope or an acceleration sensor, in the mobile phone 1000, the orientation (vertical or horizontal) of the mobile phone 1000 is determined, and the screen display of the display unit 1002 Can be switched automatically.

The screen mode is switched by touching the display portion 1002 or operating the operation button 1003 of the housing 1001. Further, switching can be performed depending on the type of image displayed on the display portion 1002. For example, if the image signal to be displayed on the display unit is moving image data, the mode is switched to the display mode, and if it is text data, the mode is switched to the input mode.

Further, in the input mode, when a signal detected by the optical sensor of the display unit 1002 is detected and there is no input by a touch operation on the display unit 1002, the screen mode is switched from the input mode to the display mode. You may control.

The display portion 1002 can also function as an image sensor. For example, personal authentication can be performed by touching the display unit 1002 with a palm or a finger to capture an image of a palm print, a fingerprint, or the like. In addition, if a backlight that emits near-infrared light or a sensing light source that emits near-infrared light is used for the display portion, finger veins, palm veins, and the like can be imaged.

A display device including a transistor with excellent operation stability can be manufactured using the transistor described in the above embodiment. Since the above electronic devices are equipped with transistors having excellent operational stability, the reliability is high.

10 pulse output circuit 11 wiring 12 wiring 13 wiring 14 wiring 15 wiring 16 wiring 17 wiring 21 input terminal 22 input terminal 23 input terminal 24 input terminal 25 input terminal 26 output terminal 27 output terminal 31 transistor 32 transistor 33 transistor 34 transistor 35 transistor 36 Transistor 37 Transistor 38 Transistor 39 Transistor 40 Transistor 41 Transistor 51 Power supply line 52 Power supply line 53 Power supply line 61 Period 62 Period 100 Substrate 102 Insulating layer 102a Insulating layer 107 Insulating layer 107c Insulating layer 108 Insulating layer 109 Insulating layer 111a Gate electrode 111b Capacitance electrode 111c Gate wiring 111d Gate electrode 111e Conductive layer 111f Conductive layer 113a Oxide semiconductor layer 113c Oxide semiconductor layer 114a Barrier layer 114b Bar Layer 114e barrier layer 114f barrier layer 115a electrode 115b electrode 115e conductive layer 115f conductive layer 116 conductive layer 116a signal line 116b signal line 116c electrode 116d electrode 120 pixel electrode 123 oxide semiconductor layer 126a opening 126b opening 127 opening 127a opening Portion 127b Opening 128 Opening 129 Conductive layer 151 Transistor 152 Transistor 153 Transistor 154 Transistor 400 Substrate 402 Insulating layer 404a Oxide semiconductor layer 404b Oxide semiconductor layer 408 Contact hole 410a Wiring 410b Wiring 410c Wiring 411 Terminal 412 Terminal 421a Gate electrode 421b Gate electrode 422a Electrode 422b Electrode 428 Insulating layer 440A Transistor 440B Transistor 455a Electrode 455b Electrode 455 Electrode 455d Electrode 580 Substrate 581 Transistor 583 Interlayer insulating film 584 Protective film 585 Insulating layer 587 Electrode layer 588 Electrode layer 589 Spherical particle 590a Black region 590b White region 594 Cavity 595 Filler 596 Substrate 1000 Mobile phone 1001 Case 1002 Display unit 1003 Operation Button 1004 External connection port 1005 Speaker 1006 Microphone 2600 Transistor substrate 2601 Counter substrate 2602 Sealing material 2603 Pixel portion 2604 Display element 2605 Colored layer 2606 Polarizing plate 2607 Polarizing plate 2608 Wiring circuit portion 2609 Flexible wiring substrate 2610 Cold cathode tube 2611 Reflecting plate 2612 Circuit Substrate 2613 Diffusion plate 2631 Poster 2632 In-car advertisement 2700 Electronic book 2701 Case 2703 Case 2705 Display portion 2707 Table Part 2711 shank 2721 power 2723 operation keys 2725 speaker 4001 substrate 4002 pixel portion 4003 signal line driver circuit 4004 scanning line driver circuit 4005 sealant 4006 substrate 4008 liquid crystal layer 4010 4011 transistors 4013 liquid crystal element 4015 connection terminal electrode 4016 terminal electrodes 4018 FPC
4019 Anisotropic conductive film 4020 Insulating layer 4021 Insulating layer 4030 Pixel electrode layer 4031 Counter electrode layer 4032 Insulating layer 4033 Insulating layer 4035 Spacer 4501 Substrate 4502 Pixel portion 4503a Signal line driver circuit 4503b Signal line driver circuit 4504a Scan line driver circuit 4504b Scanning Line driver circuit 4505 Seal material 4506 Substrate 4507 Filler 4509 Transistor 4510 Transistor 4511 Light emitting element 4512 Electroluminescent layer 4513 Electrode layer 4515 Connection terminal electrode 4516 Terminal electrode 4517 Electrode layer 4518a FPC
4519 Anisotropic conductive film 4520 Partition wall 4540 Conductive layer 4544 Insulating layer 5300 Substrate 5301 Pixel portion 5302 Scan line driver circuit 5303 Scan line driver circuit 5304 Signal line driver circuit 5305 Timing control circuit 5601 Shift register 5602 Switching circuit 5603 Transistor 5604 Wiring 5605 Wiring 6400 pixel 6401 switching transistor 6402 driving transistor 6403 capacitive element 6404 light emitting element 6405 signal line 6406 scanning line 6407 power source line 6408 common electrode 7001 driving transistor 7002 light emitting element 7003 electrode 7004 EL layer 7005 electrode 7009 partition 7010 substrate 7011 driving transistor 7012 Light-Emitting Element 7013 Electrode 7014 EL Layer 7015 Electrode 7016 Shielding Film 7017 Conductivity 7019 Partition 7020 Substrate 7021 Driving transistor 7022 Light emitting element 7023 Electrode 7024 EL layer 7025 Electrode 7027 Conductive film 7029 Partition 7030 Gate insulating layer 7032 Insulating layer 7033 Color filter layer 7034 Overcoat layer 7035 Protective insulating layer 7040 Gate insulating layer 7042 Insulating layer 7043 Color filter layer 7044 Overcoat layer 7045 Protective insulating layer 7052 Protective insulating layer 7053 Flattened insulating layer 7055 Insulating layer 9600 Television device 9601 Housing 9603 Display portion 9605 Stand 9607 Display portion 9609 Operation key 9610 Remote control device 9700 Digital photo frame 9701 Housing 9703 Display unit 9881 Housing 9882 Display unit 9883 Display unit 9984 Speaker unit 9985 Operation key 9886 Medium insertion portion 9887 connecting terminal 9888 sensor 9889 microphone 9890 LED lamp 9891 housing 9893 connecting portion 9900 slot machine 9901 housing 9903 display unit

Claims (3)

A light-transmitting gate electrode on an insulating surface of the light-transmitting substrate;
A first insulating layer on the gate electrode;
An oxide semiconductor layer on the first insulating layer;
A first electrode and a second electrode on the oxide semiconductor layer;
A light-transmitting barrier layer between the oxide semiconductor layer and the first electrode, and between the oxide semiconductor layer and the second electrode;
A second insulating layer in contact with the oxide semiconductor layer;
Have
The carrier concentration of the oxide semiconductor layer is less than 1 × 10 ¹⁴ / cm ³ ;
The first electrode and the second electrode include a light-transmitting oxide conductive layer having a resistivity of 2000 × 10 ⁻⁶ Ω · cm or less,
The barrier layer is observed containing a nitride,
The second through the opening provided in the insulating layer, have a first electrode or said first wiring connected second electrode and electrically,
A third insulating layer on the first wiring;
The third dielectric layer, have a region in contact with said first insulating layer,
The first insulating layer has a first material;
The semiconductor device, wherein the third insulating layer has the same material as the first material . A light-transmitting gate electrode on an insulating surface of the light-transmitting substrate;
A first insulating layer on the gate electrode;
An oxide semiconductor layer on the first insulating layer;
A first electrode and a second electrode on the oxide semiconductor layer;
A light-transmitting barrier layer between the oxide semiconductor layer and the first electrode, and between the oxide semiconductor layer and the second electrode;
A second insulating layer in contact with the oxide semiconductor layer;
Have
The carrier concentration of the oxide semiconductor layer is less than 1 × 10 ¹⁴ / cm ³ ;
The first electrode and the second electrode include a light-transmitting oxide conductive layer having a resistivity of 2000 × 10 ⁻⁶ Ω · cm or less,
The barrier layer is observed containing a nitride,
The second through the opening provided in the insulating layer, have a first electrode or said first wiring connected second electrode and electrically,
A third insulating layer on the first wiring;
The first insulating layer has a first layer and a second layer on the first layer;
The third insulating layer has a region in contact with a side surface of the second layer;
The third dielectric layer, have a region in contact with the upper surface of the first layer,
The first layer comprises a first material;
The semiconductor device, wherein the third insulating layer has the same material as the first material . In claim 2,
The second layer has a second material different from the first material,
The semiconductor device, wherein the second insulating layer has the same material as the second material.

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