JP5660199B2 - 鉛フリーはんだ合金 - Google Patents
鉛フリーはんだ合金 Download PDFInfo
- Publication number
- JP5660199B2 JP5660199B2 JP2013506040A JP2013506040A JP5660199B2 JP 5660199 B2 JP5660199 B2 JP 5660199B2 JP 2013506040 A JP2013506040 A JP 2013506040A JP 2013506040 A JP2013506040 A JP 2013506040A JP 5660199 B2 JP5660199 B2 JP 5660199B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- mass
- lead
- solder alloy
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 167
- 229910045601 alloy Inorganic materials 0.000 title claims description 67
- 239000000956 alloy Substances 0.000 title claims description 67
- 230000004907 flux Effects 0.000 claims description 18
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 12
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 12
- 150000007524 organic acids Chemical class 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 7
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000001361 adipic acid Substances 0.000 claims description 6
- 235000011037 adipic acid Nutrition 0.000 claims description 6
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 6
- 235000005985 organic acids Nutrition 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 22
- 239000000203 mixture Substances 0.000 description 15
- 239000006104 solid solution Substances 0.000 description 13
- 229910017944 Ag—Cu Inorganic materials 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 229910052787 antimony Inorganic materials 0.000 description 10
- 229910052797 bismuth Inorganic materials 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 230000008859 change Effects 0.000 description 9
- 229910000765 intermetallic Inorganic materials 0.000 description 8
- 239000012190 activator Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000009863 impact test Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910017692 Ag3Sn Inorganic materials 0.000 description 2
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910020220 Pb—Sn Inorganic materials 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12222—Shaped configuration for melting [e.g., package, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
リフロー法は、はんだ粉とフラックスからなるソルダペーストをプリント基板の必要箇所だけに印刷法や吐出法で塗布し、該塗布部に電子部品を搭載してからリフロー炉のような加熱装置でソルダペーストを溶融させて電子部品をプリント基板にはんだ付けする方法である。このリフロー法は、一度の作業で多数箇所のはんだ付けができるばかりでなく、狭いピッチの電子部品をはんだ付けしてもブリッジの発生がなく、しかも不要箇所にははんだが付着しないという生産性と信頼性に優れたはんだ付けが行えるものである。
現在多く使用されている鉛フリーはんだは、特開平5−050286号公報に開示されているようなAgを3〜5質量%、Cuを0.5〜3質量%含有したSn-Ag-Cu組成の鉛フリーはんだである。この鉛フリーはんだは、従来のSn-Pbはんだよりも温度サイクル特性に優れ、またクリープ特性に優れているので普及している。特に温度サイクル特性は、電子機器の寿命を評価したり、製品保証をする上で、重要な要素である。
より好ましくは、Biの含有量がInより原子%で3倍以上のときである。
また、Sbの含有量が1.0質量%より多いとはんだのぬれ性が悪くなり、ボイドが増加する。そのために、Sbの添加量は1.0質量%以下とする。本発明のはんだ合金におけるSbの添加量は0.02〜1.0質量%であり、好ましい本発明のはんだ合金におけるSbの添加量は0.15〜0.5質量%である。
ここで、比較例2は特許文献1のはんだ合金組成であり、比較例3、4は特許文献2のはんだ合金組成、比較例5は特許文献3のはんだ合金組成である。
1.はんだバンプを形成したCSPとプリント基板間に、落下による衝撃を加え、はんだ付け部に亀裂が発生するまでの落下回数を測定する。基板は、はんだ付け後に室温で5日間放置したものを用いた。亀裂進展についての判断は、電気抵抗値が、初期値から50%上昇した点を落下回数として記録する。
1.)外形12×12(mm)、電極196個のバンプを有する電解Ni/AuめっきのCSPに、フラックスを印刷し、表1の組成をもった直径0.3mmのはんだボールを載置する。
3.)はんだバンプが形成されたCSPを30×120(mm)のソルダペーストが塗布されたガラスエポキシプリント基板中央に搭載し、リフロー炉で加熱してCSPをプリント基板にはんだ付けする。
5.)落下治具に加速度1500Gが負荷する高さから落下させてプリント基板に衝撃を与える。このとき両端を治具に固定されたプリント基板は、中央部が振動し、プリント基板とCSPのはんだ付け部は、この振動による衝撃を受ける。この落下試験でCSPのはんだ付け部にき裂が生じるまでの落下回数を測定する。試験記録は、6点試験を行い、最低値を記録する。
1.JIS C0025に規定された試験方法であり、はんだ付け部が高温、低温の温度変化の繰り返しによって、与えられる影響について調べるもので、電子機器の寿命の指数として、用いられている。
1.)外形3.2×1.6(mm)のSnめっき抵抗をソルダペーストが塗布されたガラスエポキシプリント基板に搭載し、リフロー炉で加熱してはんだ付けする。
次に、表1の実施例4のはんだ組成ではんだ粉末を作製し、表2のフラックス組成(質量%)のフラックスと混和して、ソルダペーストを作製し、はんだボール試験とソルダペーストの粘度経時変化を確認した。
Claims (6)
- Agが0.2〜1.2質量%、Cuが0.6〜0.9質量%、Biが1.2〜3.0質量%、Sbが0.02〜1.0質量%、Inを0.01〜2.0質量%含有し、残部Snで構成されることを特徴とする鉛フリーはんだ合金。
- Agが0.2〜1.0質量%、Cuが0.6〜0.9質量%、Biが1.2〜2.0質量%、Sbが0.1〜0.5質量%、Inを0.01〜0.3質量%含有し、残部Snで構成されることを特徴とする請求項1に記載の鉛フリーはんだ合金。
- 請求項1に記載の鉛フリーはんだ合金のはんだ粉末とフラックスを混和した鉛フリーソルダペーストにおいて、該フラックスに用いられる有機酸としてコハク酸、アジピン酸、アゼライン酸から選択された1種以上の有機酸を合計で0.5質量%以上、5質量%未満を用いた鉛フリーソルダペースト。
- 請求項1に記載の鉛フリーはんだ合金からなるはんだ線の中心部にフラックスを充填した脂入りはんだにおいて、該フラックスに用いられる有機酸としてコハク酸、アジピン酸、アゼライン酸から選択された1種以上の有機酸を用いた鉛フリー脂入りはんだ。
- 請求項1に記載の鉛フリーはんだ合金からなるはんだボール。
- 請求項1に記載の鉛フリーはんだ合金からなるソルダプリフォーム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013506040A JP5660199B2 (ja) | 2011-03-23 | 2012-03-23 | 鉛フリーはんだ合金 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPPCT/JP2011/056903 | 2011-03-23 | ||
PCT/JP2011/056903 WO2012127642A1 (ja) | 2011-03-23 | 2011-03-23 | 鉛フリーはんだ合金 |
PCT/JP2012/057540 WO2012128356A1 (ja) | 2011-03-23 | 2012-03-23 | 鉛フリーはんだ合金 |
JP2013506040A JP5660199B2 (ja) | 2011-03-23 | 2012-03-23 | 鉛フリーはんだ合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012128356A1 JPWO2012128356A1 (ja) | 2014-07-24 |
JP5660199B2 true JP5660199B2 (ja) | 2015-01-28 |
Family
ID=46878835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013506040A Active JP5660199B2 (ja) | 2011-03-23 | 2012-03-23 | 鉛フリーはんだ合金 |
Country Status (12)
Country | Link |
---|---|
US (1) | US9844837B2 (ja) |
EP (1) | EP2689885B1 (ja) |
JP (1) | JP5660199B2 (ja) |
KR (1) | KR101551050B1 (ja) |
CN (1) | CN103561903B (ja) |
BR (1) | BR112013024398B1 (ja) |
DK (1) | DK2689885T3 (ja) |
ES (1) | ES2624621T3 (ja) |
HU (1) | HUE033232T2 (ja) |
MY (1) | MY162706A (ja) |
TW (1) | TW201706068A (ja) |
WO (2) | WO2012127642A1 (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015077601A (ja) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
US10076808B2 (en) * | 2013-08-05 | 2018-09-18 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
WO2015152387A1 (ja) * | 2014-04-02 | 2015-10-08 | 千住金属工業株式会社 | Led用はんだ合金およびledモジュール |
MY162879A (en) | 2014-06-24 | 2017-07-20 | Harima Chemicals Inc | Solder alloy, solder paste, and electronic circuit board |
EP3172349A2 (en) * | 2014-07-21 | 2017-05-31 | Alpha Assembly Solutions Inc. | Low temperature high reliability tin alloy for soldering |
JP6060199B2 (ja) | 2015-03-24 | 2017-01-11 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
US11229979B2 (en) * | 2015-05-05 | 2022-01-25 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
CN105047247B (zh) * | 2015-07-13 | 2018-01-23 | 东莞市同亚电子科技有限公司 | 一种电线镀锡用锡组合物及其制备方法和用途 |
US10195698B2 (en) * | 2015-09-03 | 2019-02-05 | AIM Metals & Alloys Inc. | Lead-free high reliability solder alloys |
HUE052698T2 (hu) * | 2016-03-22 | 2021-05-28 | Tamura Seisakusho Kk | Ólommentes forrasztó ötvözet, folyasztószer készítmény, forrasztó paszta készítmény, elektronikus áramköri kártya és elektronikus vezérlõ eszköz |
JP6745453B2 (ja) * | 2016-05-18 | 2020-08-26 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
JP6230737B1 (ja) * | 2017-03-10 | 2017-11-15 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、ソルダペースト及び電子回路基板 |
TWI602929B (zh) * | 2017-05-17 | 2017-10-21 | Solder composition | |
KR102286739B1 (ko) * | 2017-08-17 | 2021-08-05 | 현대자동차 주식회사 | 무연 솔더 조성물 |
US10456872B2 (en) | 2017-09-08 | 2019-10-29 | Tamura Corporation | Lead-free solder alloy, electronic circuit substrate, and electronic device |
JP6292342B1 (ja) * | 2017-09-20 | 2018-03-14 | 千住金属工業株式会社 | Cu管及び/又はFe管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手 |
US11123823B2 (en) * | 2017-11-08 | 2021-09-21 | Alpha Assembly Solutions Inc. | Cost-effective lead-free solder alloy for electronic applications |
US11732330B2 (en) | 2017-11-09 | 2023-08-22 | Alpha Assembly Solutions, Inc. | High reliability lead-free solder alloy for electronic applications in extreme environments |
US11577343B2 (en) * | 2017-11-09 | 2023-02-14 | Alpha Assembly Solutions Inc. | Low-silver alternative to standard SAC alloys for high reliability applications |
CN108788512A (zh) * | 2018-08-24 | 2018-11-13 | 东莞市仁信电子有限公司 | 一种低熔点低空洞率无铅环保焊锡膏 |
MX2021004334A (es) * | 2018-10-24 | 2021-06-23 | Alpha Assembly Solutions Inc | Soluciones de soldadura de baja temperatura para sustratos de polimeros, placas de circuito impreso y otras aplicaciones de union. |
CN113441866B (zh) * | 2019-03-20 | 2022-12-13 | 中山翰华锡业有限公司 | 一种抗枕头效应的无铅锡膏及其制备方法 |
JP6649597B1 (ja) * | 2019-05-27 | 2020-02-19 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、およびはんだ継手 |
WO2020241436A1 (ja) * | 2019-05-27 | 2020-12-03 | 千住金属工業株式会社 | はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、およびはんだ継手 |
CN110064864B (zh) * | 2019-05-29 | 2020-07-31 | 南京达迈科技实业有限公司 | 一种用于多晶硅与金属连接的钎料、采用该钎料制备的焊膏与制法及用其焊接的方法 |
CN110744220B (zh) * | 2019-11-15 | 2021-10-22 | 北京康普锡威科技有限公司 | 低飞溅焊丝及其制备方法 |
CN115768591A (zh) * | 2020-04-10 | 2023-03-07 | 千住金属工业株式会社 | 软钎料合金、软钎料粉末、焊膏、焊料球、预成型软钎料和钎焊接头 |
TWI728842B (zh) * | 2020-06-12 | 2021-05-21 | 大陸商重慶群崴電子材料有限公司 | 無鉛焊料及其製造方法 |
CN113458650B (zh) * | 2021-07-05 | 2022-10-14 | 云南锡业锡材有限公司 | 一种Sn-Ag-Cu-Ce高可靠性无铅焊料 |
CN114227057B (zh) * | 2021-12-10 | 2023-05-26 | 北京康普锡威科技有限公司 | 无铅焊料合金及其制备方法、用途 |
CN115815870A (zh) * | 2022-11-07 | 2023-03-21 | 江苏科技大学 | Sn基高温高热稳定焊料合金及其应用 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1043882A (ja) * | 1996-08-05 | 1998-02-17 | Hitachi Ltd | はんだペースト |
JP2002018590A (ja) * | 2000-07-06 | 2002-01-22 | Nippon Steel Corp | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
JP2005254298A (ja) * | 2004-03-12 | 2005-09-22 | Nippon Steel Corp | 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材 |
JP2007237251A (ja) * | 2006-03-09 | 2007-09-20 | Nippon Steel Materials Co Ltd | 鉛フリーハンダ合金、ハンダボール及び電子部材 |
JP2008290150A (ja) * | 2007-05-25 | 2008-12-04 | Korea Inst Of Industrial Technology | 錫・銀・銅・インジウムの4元系鉛フリー半田組成物 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2898255A (en) * | 1958-06-30 | 1959-08-04 | Ibm | Soldering flux composition |
US3235414A (en) * | 1962-01-11 | 1966-02-15 | Continental Can Co | Organic flux for soldering |
US4561913A (en) * | 1984-03-12 | 1985-12-31 | At&T Technologies, Inc. | Soldering flux additive |
JP3027441B2 (ja) | 1991-07-08 | 2000-04-04 | 千住金属工業株式会社 | 高温はんだ |
JP3673021B2 (ja) | 1996-06-12 | 2005-07-20 | 内橋エステック株式会社 | 電子部品実装用無鉛はんだ |
JP4106504B2 (ja) * | 1999-03-11 | 2008-06-25 | 荒川化学工業株式会社 | クリームはんだ及びクリームはんだ用フラックス |
JP2001334385A (ja) * | 2000-05-22 | 2001-12-04 | Hitachi Ltd | 電子機器用Sn−Ag−Cu−Bi−In系はんだ |
ES2541439T3 (es) | 2001-03-01 | 2015-07-20 | Senju Metal Industry Co., Ltd | Pasta de soldadura sin plomo |
GB2380964B (en) * | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
JP2004188453A (ja) * | 2002-12-11 | 2004-07-08 | Harima Chem Inc | Sn系はんだ合金 |
GB2419137A (en) * | 2004-10-15 | 2006-04-19 | Alpha Fry Ltd | Solder alloy |
GB2421030B (en) * | 2004-12-01 | 2008-03-19 | Alpha Fry Ltd | Solder alloy |
WO2006129713A1 (ja) | 2005-06-03 | 2006-12-07 | Senju Metal Industry Co., Ltd. | 鉛フリーはんだ合金 |
CN100336626C (zh) * | 2005-08-12 | 2007-09-12 | 北京工业大学 | 无铅焊膏用松香型无卤素助焊剂 |
US8641964B2 (en) * | 2005-08-24 | 2014-02-04 | Fry's Metals, Inc. | Solder alloy |
ES2614238T3 (es) * | 2006-12-12 | 2017-05-30 | Senju Metal Industry Co., Ltd. | Fundente para soldadura exenta de plomo |
KR101265449B1 (ko) | 2007-07-13 | 2013-05-16 | 센주긴조쿠고교 가부시키가이샤 | 차재 실장용 무납 땜납과 차재 전자 회로 |
WO2012131861A1 (ja) * | 2011-03-28 | 2012-10-04 | 千住金属工業株式会社 | 鉛フリーはんだボール |
-
2011
- 2011-03-23 WO PCT/JP2011/056903 patent/WO2012127642A1/ja active Application Filing
-
2012
- 2012-03-23 EP EP12761518.5A patent/EP2689885B1/en active Active
- 2012-03-23 ES ES12761518.5T patent/ES2624621T3/es active Active
- 2012-03-23 WO PCT/JP2012/057540 patent/WO2012128356A1/ja active Application Filing
- 2012-03-23 HU HUE12761518A patent/HUE033232T2/hu unknown
- 2012-03-23 KR KR1020137027507A patent/KR101551050B1/ko active IP Right Grant
- 2012-03-23 JP JP2013506040A patent/JP5660199B2/ja active Active
- 2012-03-23 MY MYPI2013701708A patent/MY162706A/en unknown
- 2012-03-23 US US14/006,538 patent/US9844837B2/en active Active
- 2012-03-23 DK DK12761518.5T patent/DK2689885T3/en active
- 2012-03-23 CN CN201280024986.5A patent/CN103561903B/zh active Active
- 2012-03-23 BR BR112013024398-8A patent/BR112013024398B1/pt active IP Right Grant
-
2013
- 2013-03-15 TW TW105133059A patent/TW201706068A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1043882A (ja) * | 1996-08-05 | 1998-02-17 | Hitachi Ltd | はんだペースト |
JP2002018590A (ja) * | 2000-07-06 | 2002-01-22 | Nippon Steel Corp | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
JP2005254298A (ja) * | 2004-03-12 | 2005-09-22 | Nippon Steel Corp | 半導体実装用半田合金とその製造方法、及び半田ボール、電子部材 |
JP2007237251A (ja) * | 2006-03-09 | 2007-09-20 | Nippon Steel Materials Co Ltd | 鉛フリーハンダ合金、ハンダボール及び電子部材 |
JP2008290150A (ja) * | 2007-05-25 | 2008-12-04 | Korea Inst Of Industrial Technology | 錫・銀・銅・インジウムの4元系鉛フリー半田組成物 |
Also Published As
Publication number | Publication date |
---|---|
ES2624621T3 (es) | 2017-07-17 |
US9844837B2 (en) | 2017-12-19 |
JPWO2012128356A1 (ja) | 2014-07-24 |
CN103561903A (zh) | 2014-02-05 |
BR112013024398B1 (pt) | 2018-11-06 |
MY162706A (en) | 2017-07-14 |
WO2012127642A1 (ja) | 2012-09-27 |
EP2689885A1 (en) | 2014-01-29 |
KR20140044801A (ko) | 2014-04-15 |
BR112013024398A2 (pt) | 2016-12-13 |
TW201706068A (zh) | 2017-02-16 |
US20140141273A1 (en) | 2014-05-22 |
HUE033232T2 (hu) | 2017-11-28 |
DK2689885T3 (en) | 2017-05-01 |
WO2012128356A1 (ja) | 2012-09-27 |
EP2689885A4 (en) | 2015-04-01 |
CN103561903B (zh) | 2017-03-22 |
KR101551050B1 (ko) | 2015-09-07 |
EP2689885B1 (en) | 2017-02-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5660199B2 (ja) | 鉛フリーはんだ合金 | |
JP5664664B2 (ja) | 接合方法、電子装置の製造方法、および電子部品 | |
JP4787384B1 (ja) | 低銀はんだ合金およびはんだペースト組成物 | |
JP4613823B2 (ja) | ソルダペーストおよびプリント基板 | |
TW201615854A (zh) | 用於焊料層次的低溫高可靠度合金 | |
JP2014223678A5 (ja) | ||
CN111230355B (zh) | 无铅焊料合金 | |
KR102342394B1 (ko) | 땜납 합금, 땜납 페이스트, 프리폼 땜납, 땜납 볼, 선 땜납, 수지 플럭스 코어드 땜납, 땜납 이음매, 전자 회로 기판 및 다층 전자 회로 기판 | |
JP4453473B2 (ja) | 鉛フリーはんだ合金と、それを用いたはんだ材料及びはんだ接合部 | |
EP2747933B1 (en) | A mn doped sn-base solder alloy and solder joints thereof with superior drop shock reliability | |
EP3707285A1 (en) | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications | |
JP5051633B2 (ja) | はんだ合金 | |
JP2008221330A (ja) | はんだ合金 | |
JP2004122223A (ja) | 電子部品および電子部品の製造方法 | |
TWI603803B (zh) | Lead-free solder alloy | |
JP2006000925A (ja) | 無鉛はんだ合金およびその製造方法 | |
JP2022140163A (ja) | はんだ接合法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140819 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20140819 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20140909 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140916 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20141104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141117 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5660199 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |