JP5649417B2 - 固定砥粒を有する研磨テープを用いた基板の研磨方法 - Google Patents

固定砥粒を有する研磨テープを用いた基板の研磨方法 Download PDF

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JP5649417B2
JP5649417B2 JP2010263215A JP2010263215A JP5649417B2 JP 5649417 B2 JP5649417 B2 JP 5649417B2 JP 2010263215 A JP2010263215 A JP 2010263215A JP 2010263215 A JP2010263215 A JP 2010263215A JP 5649417 B2 JP5649417 B2 JP 5649417B2
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Prior art keywords
polishing
tape
substrate
liquid
polishing liquid
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Japanese (ja)
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JP2012111012A (ja
JP2012111012A5 (enExample
Inventor
正行 中西
正行 中西
関　正也
正也 関
健治 小寺
健治 小寺
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Ebara Corp
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Ebara Corp
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Priority to JP2010263215A priority Critical patent/JP5649417B2/ja
Priority to US13/303,485 priority patent/US8926402B2/en
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Publication of JP2012111012A5 publication Critical patent/JP2012111012A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/02—Lapping machines or devices; Accessories designed for working surfaces of revolution

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2010263215A 2010-11-26 2010-11-26 固定砥粒を有する研磨テープを用いた基板の研磨方法 Active JP5649417B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010263215A JP5649417B2 (ja) 2010-11-26 2010-11-26 固定砥粒を有する研磨テープを用いた基板の研磨方法
US13/303,485 US8926402B2 (en) 2010-11-26 2011-11-23 Method of polishing a substrate using a polishing tape having fixed abrasive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010263215A JP5649417B2 (ja) 2010-11-26 2010-11-26 固定砥粒を有する研磨テープを用いた基板の研磨方法

Publications (3)

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JP2012111012A JP2012111012A (ja) 2012-06-14
JP2012111012A5 JP2012111012A5 (enExample) 2013-11-14
JP5649417B2 true JP5649417B2 (ja) 2015-01-07

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JP2010263215A Active JP5649417B2 (ja) 2010-11-26 2010-11-26 固定砥粒を有する研磨テープを用いた基板の研磨方法

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US (1) US8926402B2 (enExample)
JP (1) JP5649417B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011224680A (ja) * 2010-04-16 2011-11-10 Ebara Corp 研磨方法及び研磨装置
US9457447B2 (en) * 2011-03-28 2016-10-04 Ebara Corporation Polishing apparatus and polishing method
CN102950522B (zh) * 2012-11-20 2016-01-27 上海奉贤钢管厂有限公司 一种冷拔模具修磨装置及方法
US9718164B2 (en) 2012-12-06 2017-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing system and polishing method
JP6100002B2 (ja) * 2013-02-01 2017-03-22 株式会社荏原製作所 基板裏面の研磨方法および基板処理装置
JP6223873B2 (ja) * 2014-03-14 2017-11-01 株式会社荏原製作所 研磨装置及び研磨方法
JP6587135B2 (ja) * 2015-03-31 2019-10-09 日本電気硝子株式会社 板ガラスの研磨加工方法及び研磨加工装置
JP6851068B2 (ja) * 2016-01-12 2021-03-31 中村留精密工業株式会社 研削・研磨複合加工装置及び研磨装置
JP6418174B2 (ja) * 2016-02-03 2018-11-07 株式会社Sumco シリコンウェーハの片面研磨方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
CN109048581A (zh) * 2018-08-31 2018-12-21 苏州康克莱自动化科技有限公司 一种轮毂用打磨装置
JP2023137069A (ja) * 2022-03-17 2023-09-29 キオクシア株式会社 研磨装置および研磨方法
JP7759014B1 (ja) * 2025-07-29 2025-10-23 ダイトロン株式会社 加工装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3524284A (en) * 1967-08-22 1970-08-18 Corning Glass Works Abrasive milling head for numerically controlled apparatus
US4109422A (en) * 1976-04-05 1978-08-29 Parsons Enterprises, Inc. Sander cleaning process
JP2832142B2 (ja) * 1993-10-29 1998-12-02 信越半導体株式会社 ウェーハのノッチ部研磨装置
JP3331790B2 (ja) * 1994-11-30 2002-10-07 ソニー株式会社 化学的機械研磨装置及び化学的機械研磨法
US5868857A (en) * 1996-12-30 1999-02-09 Intel Corporation Rotating belt wafer edge cleaning apparatus
JPH1133890A (ja) * 1997-07-16 1999-02-09 Noritake Kiyuutou:Kk カップ状陶磁器の上渕部研磨装置
JP3728950B2 (ja) 1998-12-04 2005-12-21 株式会社日立製作所 半導体装置の製造方法及び平坦化加工装置
US6447374B1 (en) * 1999-12-17 2002-09-10 Applied Materials, Inc. Chemical mechanical planarization system
JP2001205549A (ja) * 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
JP2001345294A (ja) 2000-05-31 2001-12-14 Toshiba Corp 半導体装置の製造方法
JP4156200B2 (ja) * 2001-01-09 2008-09-24 株式会社荏原製作所 研磨装置及び研磨方法
US6485355B1 (en) 2001-06-22 2002-11-26 International Business Machines Corporation Method to increase removal rate of oxide using fixed-abrasive
JP3949941B2 (ja) 2001-11-26 2007-07-25 株式会社東芝 半導体装置の製造方法および研磨装置
JP4090247B2 (ja) 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
JP2004103825A (ja) * 2002-09-10 2004-04-02 Nihon Micro Coating Co Ltd 半導体ウエハエッジ研磨装置及び方法
US7682225B2 (en) * 2004-02-25 2010-03-23 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP5026957B2 (ja) * 2004-10-15 2012-09-19 株式会社東芝 研磨装置及び研磨方法
JP4077439B2 (ja) * 2004-10-15 2008-04-16 株式会社東芝 基板処理方法及び基板処理装置
JP2008036784A (ja) * 2006-08-08 2008-02-21 Sony Corp 研磨方法および研磨装置
JP2008068327A (ja) 2006-09-12 2008-03-27 Yuha Go ウェーハエッジの研磨装置、及びウェーハエッジの研磨方法
WO2008106221A1 (en) 2007-02-28 2008-09-04 Applied Materials, Inc. Methods and apparatus for cleaning a substrate edge using chemical and mechanical polishing
JP2008288398A (ja) 2007-05-18 2008-11-27 Nippon Chem Ind Co Ltd 半導体ウェハーの研磨用組成物、その製造方法、及び研磨加工方法
US7976361B2 (en) * 2007-06-29 2011-07-12 Ebara Corporation Polishing apparatus and polishing method
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP5274993B2 (ja) 2007-12-03 2013-08-28 株式会社荏原製作所 研磨装置
WO2009104614A1 (ja) * 2008-02-22 2009-08-27 日本ミクロコーティング株式会社 半導体ウェーハ外周端部の研削方法及び研削装置
JP2009238818A (ja) * 2008-03-26 2009-10-15 Sony Corp 研磨方法および研磨用組成物
JP2010162624A (ja) 2009-01-13 2010-07-29 Ebara Corp 研磨装置および研磨方法

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Publication number Publication date
JP2012111012A (ja) 2012-06-14
US8926402B2 (en) 2015-01-06
US20120135668A1 (en) 2012-05-31

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