JP5639431B2 - 成膜装置 - Google Patents

成膜装置 Download PDF

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Publication number
JP5639431B2
JP5639431B2 JP2010220263A JP2010220263A JP5639431B2 JP 5639431 B2 JP5639431 B2 JP 5639431B2 JP 2010220263 A JP2010220263 A JP 2010220263A JP 2010220263 A JP2010220263 A JP 2010220263A JP 5639431 B2 JP5639431 B2 JP 5639431B2
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JP
Japan
Prior art keywords
base portion
vacuum chamber
mask
alignment
fixed base
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Active
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JP2010220263A
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English (en)
Japanese (ja)
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JP2012072478A (ja
JP2012072478A5 (https=
Inventor
三之 田島
三之 田島
内田　敬自
敬自 内田
孝史 澁谷
孝史 澁谷
悌二 ▲たか▼橋
悌二 ▲たか▼橋
正直 藤塚
正直 藤塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Tokki Corp
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Canon Tokki Corp
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Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Priority to JP2010220263A priority Critical patent/JP5639431B2/ja
Priority to KR1020137006250A priority patent/KR101846982B1/ko
Priority to PCT/JP2011/070119 priority patent/WO2012043150A1/ja
Priority to CN201180046526.8A priority patent/CN103154304B/zh
Priority to TW100134788A priority patent/TWI585222B/zh
Publication of JP2012072478A publication Critical patent/JP2012072478A/ja
Publication of JP2012072478A5 publication Critical patent/JP2012072478A5/ja
Application granted granted Critical
Publication of JP5639431B2 publication Critical patent/JP5639431B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2010220263A 2010-09-30 2010-09-30 成膜装置 Active JP5639431B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010220263A JP5639431B2 (ja) 2010-09-30 2010-09-30 成膜装置
KR1020137006250A KR101846982B1 (ko) 2010-09-30 2011-09-05 성막 장치
PCT/JP2011/070119 WO2012043150A1 (ja) 2010-09-30 2011-09-05 成膜装置
CN201180046526.8A CN103154304B (zh) 2010-09-30 2011-09-05 成膜装置
TW100134788A TWI585222B (zh) 2010-09-30 2011-09-27 Film forming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010220263A JP5639431B2 (ja) 2010-09-30 2010-09-30 成膜装置

Publications (3)

Publication Number Publication Date
JP2012072478A JP2012072478A (ja) 2012-04-12
JP2012072478A5 JP2012072478A5 (https=) 2013-11-14
JP5639431B2 true JP5639431B2 (ja) 2014-12-10

Family

ID=45892623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010220263A Active JP5639431B2 (ja) 2010-09-30 2010-09-30 成膜装置

Country Status (5)

Country Link
JP (1) JP5639431B2 (https=)
KR (1) KR101846982B1 (https=)
CN (1) CN103154304B (https=)
TW (1) TWI585222B (https=)
WO (1) WO2012043150A1 (https=)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014015633A (ja) * 2012-07-05 2014-01-30 Sumitomo Heavy Ind Ltd 成膜装置、及び成膜装置用搬送トレイ
JP2014077170A (ja) * 2012-10-10 2014-05-01 Sumitomo Heavy Ind Ltd 成膜装置
CN103132016B (zh) * 2013-02-22 2015-05-13 京东方科技集团股份有限公司 一种膜边调整器
CN104018117A (zh) * 2013-03-01 2014-09-03 昆山允升吉光电科技有限公司 一种掩模框架及其对应的掩模组件
JP2014177683A (ja) * 2013-03-15 2014-09-25 Sumitomo Heavy Ind Ltd 基板搬送トレイ、及び成膜装置
JP6250999B2 (ja) * 2013-09-27 2017-12-20 キヤノントッキ株式会社 アライメント方法並びにアライメント装置
CN107002219B (zh) * 2014-12-10 2021-09-03 应用材料公司 掩模布置、在基板上沉积层的设备和对准掩模布置的方法
CN104404466A (zh) * 2014-12-26 2015-03-11 合肥京东方光电科技有限公司 磁控溅射镀膜方法及系统
KR102123335B1 (ko) * 2015-01-12 2020-06-17 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 챔버에서 층 증착 동안에 기판 캐리어 및 마스크 캐리어를 지지하기 위한 홀딩 어레인지먼트, 기판 상에 층을 증착하기 위한 장치, 및 기판을 지지하는 기판 캐리어와 마스크 캐리어를 정렬시키기 위한 방법
TWI576302B (zh) * 2015-05-28 2017-04-01 友達光電股份有限公司 板體分離設備及板體分離方法
JP6585191B2 (ja) * 2016-05-18 2019-10-02 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ キャリア又は基板を搬送するための装置及び方法
KR20180056990A (ko) * 2016-11-21 2018-05-30 한국알박(주) 막 증착 장치 및 방법
KR102359244B1 (ko) * 2016-11-21 2022-02-08 한국알박(주) 막 증착 방법
KR20180056989A (ko) * 2016-11-21 2018-05-30 한국알박(주) 막 증착 장치 및 방법
CN109563608A (zh) * 2017-02-24 2019-04-02 应用材料公司 用于基板载体和掩模载体的定位配置、用于基板载体和掩模载体的传送系统及其方法
CN108966676B (zh) * 2017-03-17 2023-08-04 应用材料公司 在真空系统处理掩模装置的方法、掩模处理组件和用于在基板上沉积材料的真空系统
US20200251691A1 (en) * 2017-03-17 2020-08-06 Applied Materials, Inc. Apparatus for vacuum processing of a substrate, system for vacuum processing of a substrate, and method for transportation of a substrate carrier and a mask carrier in a vacuum chamber
CN106987798B (zh) * 2017-04-17 2020-02-11 京东方科技集团股份有限公司 一种镀膜装置
JP7134095B2 (ja) * 2017-05-17 2022-09-09 イマジン・コーポレイション 高精度シャドーマスク堆積システム及びその方法
KR102156038B1 (ko) * 2017-06-29 2020-09-15 가부시키가이샤 아루박 성막 장치
JP6722298B2 (ja) * 2017-06-30 2020-07-15 株式会社アルバック 成膜装置、マスクフレーム、アライメント方法
KR102223849B1 (ko) * 2017-10-05 2021-03-05 가부시키가이샤 아루박 스퍼터링 장치
JP6662840B2 (ja) * 2017-12-11 2020-03-11 株式会社アルバック 蒸着装置
JP6662841B2 (ja) * 2017-12-21 2020-03-11 株式会社アルバック 蒸着装置
WO2019192676A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Arrangement for clamping a carrier to a device
WO2019192678A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Apparatus and vacuum system for carrier alignment in a vacuum chamber, and method of aligning a carrier
JP2020518122A (ja) * 2018-04-03 2020-06-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャンバ内でキャリアを操作するための装置、真空堆積システム、および真空チャンバ内でキャリアを操作する方法
CN112534564A (zh) * 2018-08-07 2021-03-19 应用材料公司 材料沉积设备、真空沉积系统及用以处理大面积基板的方法
JP7222073B2 (ja) * 2018-08-29 2023-02-14 アプライド マテリアルズ インコーポレイテッド 第１のキャリア及び第２のキャリアを搬送するための装置、基板を垂直に処理するための処理システム、及びそれらの方法
JP2019206761A (ja) * 2019-07-09 2019-12-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理チャンバにおいて基板をマスキングするためのマスク構成
KR20230155654A (ko) * 2022-05-03 2023-11-13 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR20230155655A (ko) * 2022-05-03 2023-11-13 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR102676831B1 (ko) * 2023-11-14 2024-06-20 파인원 주식회사 블랭크-존 코팅이 가능한 마스크용 트레이 시스템

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3789857B2 (ja) * 2002-06-25 2006-06-28 トッキ株式会社 蒸着装置
JP4463492B2 (ja) * 2003-04-10 2010-05-19 株式会社半導体エネルギー研究所 製造装置
JP4596794B2 (ja) * 2004-02-27 2010-12-15 日立造船株式会社 真空蒸着用アライメント装置
JP4609756B2 (ja) 2005-02-23 2011-01-12 三井造船株式会社 成膜装置のマスク位置合わせ機構および成膜装置
WO2007023552A1 (ja) * 2005-08-25 2007-03-01 Hitachi Zosen Corporation 真空蒸着用アライメント装置
JP5074368B2 (ja) * 2008-12-15 2012-11-14 株式会社日立ハイテクノロジーズ 成膜装置
TW201336140A (zh) * 2008-12-15 2013-09-01 Hitachi High Tech Corp 有機電激發光製造裝置及成膜裝置
JP2011096393A (ja) * 2009-10-27 2011-05-12 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及びその製造方法並びに成膜装置及び成膜方法

Also Published As

Publication number Publication date
TWI585222B (zh) 2017-06-01
CN103154304B (zh) 2015-06-03
JP2012072478A (ja) 2012-04-12
WO2012043150A1 (ja) 2012-04-05
TW201229260A (en) 2012-07-16
KR20130139867A (ko) 2013-12-23
CN103154304A (zh) 2013-06-12
KR101846982B1 (ko) 2018-04-10

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