TWI585222B - Film forming device - Google Patents

Film forming device Download PDF

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Publication number
TWI585222B
TWI585222B TW100134788A TW100134788A TWI585222B TW I585222 B TWI585222 B TW I585222B TW 100134788 A TW100134788 A TW 100134788A TW 100134788 A TW100134788 A TW 100134788A TW I585222 B TWI585222 B TW I585222B
Authority
TW
Taiwan
Prior art keywords
base portion
vacuum chamber
mask
calibration
upper side
Prior art date
Application number
TW100134788A
Other languages
English (en)
Chinese (zh)
Other versions
TW201229260A (en
Inventor
田島三之
內田敬自
澀谷孝史
高橋悌二
藤塚正直
Original Assignee
突起股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 突起股份有限公司 filed Critical 突起股份有限公司
Publication of TW201229260A publication Critical patent/TW201229260A/zh
Application granted granted Critical
Publication of TWI585222B publication Critical patent/TWI585222B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW100134788A 2010-09-30 2011-09-27 Film forming device TWI585222B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010220263A JP5639431B2 (ja) 2010-09-30 2010-09-30 成膜装置

Publications (2)

Publication Number Publication Date
TW201229260A TW201229260A (en) 2012-07-16
TWI585222B true TWI585222B (zh) 2017-06-01

Family

ID=45892623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100134788A TWI585222B (zh) 2010-09-30 2011-09-27 Film forming device

Country Status (5)

Country Link
JP (1) JP5639431B2 (https=)
KR (1) KR101846982B1 (https=)
CN (1) CN103154304B (https=)
TW (1) TWI585222B (https=)
WO (1) WO2012043150A1 (https=)

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JP2014015633A (ja) * 2012-07-05 2014-01-30 Sumitomo Heavy Ind Ltd 成膜装置、及び成膜装置用搬送トレイ
JP2014077170A (ja) * 2012-10-10 2014-05-01 Sumitomo Heavy Ind Ltd 成膜装置
CN103132016B (zh) * 2013-02-22 2015-05-13 京东方科技集团股份有限公司 一种膜边调整器
CN104018117A (zh) * 2013-03-01 2014-09-03 昆山允升吉光电科技有限公司 一种掩模框架及其对应的掩模组件
JP2014177683A (ja) * 2013-03-15 2014-09-25 Sumitomo Heavy Ind Ltd 基板搬送トレイ、及び成膜装置
JP6250999B2 (ja) * 2013-09-27 2017-12-20 キヤノントッキ株式会社 アライメント方法並びにアライメント装置
CN107002219B (zh) * 2014-12-10 2021-09-03 应用材料公司 掩模布置、在基板上沉积层的设备和对准掩模布置的方法
CN104404466A (zh) * 2014-12-26 2015-03-11 合肥京东方光电科技有限公司 磁控溅射镀膜方法及系统
KR102123335B1 (ko) * 2015-01-12 2020-06-17 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 챔버에서 층 증착 동안에 기판 캐리어 및 마스크 캐리어를 지지하기 위한 홀딩 어레인지먼트, 기판 상에 층을 증착하기 위한 장치, 및 기판을 지지하는 기판 캐리어와 마스크 캐리어를 정렬시키기 위한 방법
TWI576302B (zh) * 2015-05-28 2017-04-01 友達光電股份有限公司 板體分離設備及板體分離方法
JP6585191B2 (ja) * 2016-05-18 2019-10-02 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ キャリア又は基板を搬送するための装置及び方法
KR20180056990A (ko) * 2016-11-21 2018-05-30 한국알박(주) 막 증착 장치 및 방법
KR102359244B1 (ko) * 2016-11-21 2022-02-08 한국알박(주) 막 증착 방법
KR20180056989A (ko) * 2016-11-21 2018-05-30 한국알박(주) 막 증착 장치 및 방법
CN109563608A (zh) * 2017-02-24 2019-04-02 应用材料公司 用于基板载体和掩模载体的定位配置、用于基板载体和掩模载体的传送系统及其方法
CN108966676B (zh) * 2017-03-17 2023-08-04 应用材料公司 在真空系统处理掩模装置的方法、掩模处理组件和用于在基板上沉积材料的真空系统
US20200251691A1 (en) * 2017-03-17 2020-08-06 Applied Materials, Inc. Apparatus for vacuum processing of a substrate, system for vacuum processing of a substrate, and method for transportation of a substrate carrier and a mask carrier in a vacuum chamber
CN106987798B (zh) * 2017-04-17 2020-02-11 京东方科技集团股份有限公司 一种镀膜装置
JP7134095B2 (ja) * 2017-05-17 2022-09-09 イマジン・コーポレイション 高精度シャドーマスク堆積システム及びその方法
KR102156038B1 (ko) * 2017-06-29 2020-09-15 가부시키가이샤 아루박 성막 장치
JP6722298B2 (ja) * 2017-06-30 2020-07-15 株式会社アルバック 成膜装置、マスクフレーム、アライメント方法
KR102223849B1 (ko) * 2017-10-05 2021-03-05 가부시키가이샤 아루박 스퍼터링 장치
JP6662840B2 (ja) * 2017-12-11 2020-03-11 株式会社アルバック 蒸着装置
JP6662841B2 (ja) * 2017-12-21 2020-03-11 株式会社アルバック 蒸着装置
WO2019192676A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Arrangement for clamping a carrier to a device
WO2019192678A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Apparatus and vacuum system for carrier alignment in a vacuum chamber, and method of aligning a carrier
JP2020518122A (ja) * 2018-04-03 2020-06-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャンバ内でキャリアを操作するための装置、真空堆積システム、および真空チャンバ内でキャリアを操作する方法
CN112534564A (zh) * 2018-08-07 2021-03-19 应用材料公司 材料沉积设备、真空沉积系统及用以处理大面积基板的方法
JP7222073B2 (ja) * 2018-08-29 2023-02-14 アプライド マテリアルズ インコーポレイテッド 第１のキャリア及び第２のキャリアを搬送するための装置、基板を垂直に処理するための処理システム、及びそれらの方法
JP2019206761A (ja) * 2019-07-09 2019-12-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理チャンバにおいて基板をマスキングするためのマスク構成
KR20230155654A (ko) * 2022-05-03 2023-11-13 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR20230155655A (ko) * 2022-05-03 2023-11-13 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR102676831B1 (ko) * 2023-11-14 2024-06-20 파인원 주식회사 블랭크-존 코팅이 가능한 마스크용 트레이 시스템

Citations (1)

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CN101783397A (zh) * 2008-12-15 2010-07-21 株式会社日立高新技术 有机el器件制造装置、成膜装置及其成膜方法、液晶显示基板制造、定位装置及定位方法

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JP3789857B2 (ja) * 2002-06-25 2006-06-28 トッキ株式会社 蒸着装置
JP4463492B2 (ja) * 2003-04-10 2010-05-19 株式会社半導体エネルギー研究所 製造装置
JP4596794B2 (ja) * 2004-02-27 2010-12-15 日立造船株式会社 真空蒸着用アライメント装置
JP4609756B2 (ja) 2005-02-23 2011-01-12 三井造船株式会社 成膜装置のマスク位置合わせ機構および成膜装置
WO2007023552A1 (ja) * 2005-08-25 2007-03-01 Hitachi Zosen Corporation 真空蒸着用アライメント装置
JP5074368B2 (ja) * 2008-12-15 2012-11-14 株式会社日立ハイテクノロジーズ 成膜装置
JP2011096393A (ja) * 2009-10-27 2011-05-12 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及びその製造方法並びに成膜装置及び成膜方法

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
CN101783397A (zh) * 2008-12-15 2010-07-21 株式会社日立高新技术 有机el器件制造装置、成膜装置及其成膜方法、液晶显示基板制造、定位装置及定位方法

Also Published As

Publication number Publication date
JP5639431B2 (ja) 2014-12-10
CN103154304B (zh) 2015-06-03
JP2012072478A (ja) 2012-04-12
WO2012043150A1 (ja) 2012-04-05
TW201229260A (en) 2012-07-16
KR20130139867A (ko) 2013-12-23
CN103154304A (zh) 2013-06-12
KR101846982B1 (ko) 2018-04-10

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