JP5596347B2 - 照明装置及びその照明装置を製作する方法 - Google Patents
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/05—Optical design plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
本願は、引用により本明細書に組み込まれる、2006年9月11日に出願された同時係属中の米国仮出願第60/825,245号の利益を主張するものである。
Claims (3)
- 第1の導体パターンからなる第1の導体層と、
前記第1の導体層上に設けられた第1の絶縁体層であって、前記第1の絶縁体層を貫いて画定された少なくとも1つの第1の孔を有する第1の絶縁体層と、
前記第1の絶縁体層上に設けられた、第2の導体パターンからなる第2の導体層であって、前記第2の導体層を貫いて画定されかつ前記少なくとも1つの第1の孔と整列するように配置された少なくとも1つの第2の孔を有する第2の導体層と、
前記第2の導体層上に設けられた光操作層であって、第3の孔と第4の孔とを含む、前記光操作層を貫いて画定された少なくとも1対の孔を有し、前記第3の孔が、前記少なくとも1つの第2及び第1の孔と整列するように配置されている光操作層と、
前記第1、第2、第3の孔内をアクセスする前記第1の導体パターンと電気的に連通する第1の部分と、前記第4の孔内をアクセスする前記第2の導体パターンと電気的に連通する第2の部分とを有する少なくとも1つの光源と、
を備え、かつ
前記光操作層は、光反射層、高分子ミラーフィルム又は光透過層であり、そして
前記光操作層が光透過層であるとき、該光透過層は、屈折層、回折層又は偏光層のいずれかである照明装置。 - 前記第1の絶縁体層が、前記第1の絶縁体層を貫いて画定された複数の第1の孔を有し、前記第2の導体層が、前記第2の導体層を貫いて画定されかつ前記複数の第1の孔と位置合わせして配置された複数の第2の孔を備え、複数の第3の孔及び複数の第4の孔が、前記光操作層内に画定されており、前記複数の第3の孔が、前記複数の第2の孔と位置合わせされる、請求項1に記載の照明装置。
- 照明装置を製作する方法であって、
第1の絶縁体層を第1の導体パターンからなる第1の導体層上に設ける工程であって、第1の絶縁体層が、第1の絶縁体層を貫いて少なくとも1つの第1の孔を画定する工程と、
第2の導体パターンからなる第2の導体層を前記第1の絶縁体層上に設ける工程であって、前記第2の導体層が、前記第2の導体層を貫きかつ前記少なくとも1つの第1の孔と整列するように配置された少なくとも1つの第2の孔を画定する工程と、
光操作層を設ける工程であって、少なくとも1つの第3及び第4の孔を、前記少なくとも1つの第3の孔が前記少なくとも1つの第1及び第2の孔と整列するように配置されるように、光操作層を貫いて画定する工程と、
前記第1、第2、第3の孔内をアクセスする前記第1の導体パターンと電気的に連通する第1の部分と、前記第4の孔内をアクセスする前記第2の導体パターンと電気的に連通する第2の部分とを有する少なくとも1つの光源を備える工程と、
を含み、かつ
前記光操作層が光反射層又は高分子ミラーフィルムである、方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82524506P | 2006-09-11 | 2006-09-11 | |
US60/825,245 | 2006-09-11 | ||
US11/756,971 US8525402B2 (en) | 2006-09-11 | 2007-06-01 | Illumination devices and methods for making the same |
US11/756,971 | 2007-06-01 | ||
PCT/US2007/077844 WO2008033720A1 (en) | 2006-09-11 | 2007-09-07 | Illumination devices and methods for making the same |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010518548A JP2010518548A (ja) | 2010-05-27 |
JP2010518548A5 JP2010518548A5 (ja) | 2010-10-21 |
JP5596347B2 true JP5596347B2 (ja) | 2014-09-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009528402A Expired - Fee Related JP5596347B2 (ja) | 2006-09-11 | 2007-09-07 | 照明装置及びその照明装置を製作する方法 |
Country Status (6)
Country | Link |
---|---|
US (4) | US8525402B2 (ja) |
EP (1) | EP2069842A4 (ja) |
JP (1) | JP5596347B2 (ja) |
KR (1) | KR101397733B1 (ja) |
TW (1) | TW200835386A (ja) |
WO (1) | WO2008033720A1 (ja) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2006098799A2 (en) * | 2005-03-12 | 2006-09-21 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
US8525402B2 (en) | 2006-09-11 | 2013-09-03 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
US8581393B2 (en) | 2006-09-21 | 2013-11-12 | 3M Innovative Properties Company | Thermally conductive LED assembly |
US20080295327A1 (en) * | 2007-06-01 | 2008-12-04 | 3M Innovative Properties Company | Flexible circuit |
DE102007057765A1 (de) * | 2007-11-30 | 2009-06-04 | Osram Gesellschaft mit beschränkter Haftung | LED-System, LED-Leuchte und Verfahren zum Zusammenbau eines LED-Systems |
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2007
- 2007-06-01 US US11/756,971 patent/US8525402B2/en not_active Expired - Fee Related
- 2007-09-07 JP JP2009528402A patent/JP5596347B2/ja not_active Expired - Fee Related
- 2007-09-07 KR KR1020097007174A patent/KR101397733B1/ko not_active IP Right Cessation
- 2007-09-07 EP EP07814735.2A patent/EP2069842A4/en not_active Withdrawn
- 2007-09-07 WO PCT/US2007/077844 patent/WO2008033720A1/en active Application Filing
- 2007-09-10 TW TW096133773A patent/TW200835386A/zh unknown
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Also Published As
Publication number | Publication date |
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US20130313601A1 (en) | 2013-11-28 |
US20140293602A1 (en) | 2014-10-02 |
JP2010518548A (ja) | 2010-05-27 |
EP2069842A4 (en) | 2013-04-24 |
WO2008033720A1 (en) | 2008-03-20 |
US8525402B2 (en) | 2013-09-03 |
EP2069842A1 (en) | 2009-06-17 |
KR20090060432A (ko) | 2009-06-12 |
US9303829B2 (en) | 2016-04-05 |
US20140376224A1 (en) | 2014-12-25 |
US9303827B2 (en) | 2016-04-05 |
TW200835386A (en) | 2008-08-16 |
US20080062688A1 (en) | 2008-03-13 |
US8860296B2 (en) | 2014-10-14 |
KR101397733B1 (ko) | 2014-05-20 |
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