JP5497787B2 - 環境感応性素子をカプセル化する方法 - Google Patents
環境感応性素子をカプセル化する方法 Download PDFInfo
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- JP5497787B2 JP5497787B2 JP2011543512A JP2011543512A JP5497787B2 JP 5497787 B2 JP5497787 B2 JP 5497787B2 JP 2011543512 A JP2011543512 A JP 2011543512A JP 2011543512 A JP2011543512 A JP 2011543512A JP 5497787 B2 JP5497787 B2 JP 5497787B2
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/231—Filled with gas other than air; or under vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
Claims (1)
- 第1基板及び第2基板を提供する段階と、
前記第1基板と第2基板との間に、環境感応性素子を設置する段階と、
露出部分を含む接着剤で、前記第1基板及び第2基板を共にシーリングする段階と、
少なくとも1層のデカップリング層及び少なくとも1層のバリア層を含むバリア・スタックで、前記接着剤の露出部分を覆う段階
とを含み、
前記第1基板または第2基板の端部は、前記第1基板または第2基板の素子側底面と側面とのなす角が90゜未満の角度を有し、前記バリア・スタックが、90°未満の角度を有する前記第1基板または第2基板の端部に沿って連続的に接続され、
前記第1基板の全体、または前記第2基板の全体、またはその両方を前記バリア・スタックで覆う段階をさらに含むことを特徴とする、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/345,717 | 2008-12-30 | ||
US12/345,717 US20100167002A1 (en) | 2008-12-30 | 2008-12-30 | Method for encapsulating environmentally sensitive devices |
PCT/US2009/060437 WO2010077412A1 (en) | 2008-12-30 | 2009-10-13 | Method for encapsulating environmentally sensitive devices |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013013124A Division JP2013101969A (ja) | 2008-12-30 | 2013-01-28 | 環境感応性素子をカプセル化する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012513665A JP2012513665A (ja) | 2012-06-14 |
JP5497787B2 true JP5497787B2 (ja) | 2014-05-21 |
Family
ID=41566191
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2011543512A Active JP5497787B2 (ja) | 2008-12-30 | 2009-10-13 | 環境感応性素子をカプセル化する方法 |
JP2013013124A Pending JP2013101969A (ja) | 2008-12-30 | 2013-01-28 | 環境感応性素子をカプセル化する方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013013124A Pending JP2013101969A (ja) | 2008-12-30 | 2013-01-28 | 環境感応性素子をカプセル化する方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100167002A1 (ja) |
EP (1) | EP2374173B1 (ja) |
JP (2) | JP5497787B2 (ja) |
KR (1) | KR101288127B1 (ja) |
CN (1) | CN102210035B (ja) |
TW (1) | TWI408755B (ja) |
WO (1) | WO2010077412A1 (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2641277A4 (en) * | 2010-11-18 | 2016-06-15 | 3M Innovative Properties Co | LIGHT EMITTING DIODE COMPONENT COMPRISING A POLYSILAZANE BONDING LAYER |
JP5738617B2 (ja) * | 2011-02-08 | 2015-06-24 | 株式会社カネカ | 有機el装置 |
FR2973939A1 (fr) | 2011-04-08 | 2012-10-12 | Saint Gobain | Element en couches pour l’encapsulation d’un element sensible |
JPWO2012176595A1 (ja) * | 2011-06-20 | 2015-02-23 | コニカミノルタ株式会社 | 封止構造及び封止方法 |
KR101900362B1 (ko) | 2012-01-16 | 2018-11-09 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조방법 |
KR20130089039A (ko) | 2012-02-01 | 2013-08-09 | 삼성디스플레이 주식회사 | 증착 소스, 증착 장치 및 유기 발광 표시 장치 제조 방법 |
JP5888095B2 (ja) * | 2012-04-26 | 2016-03-16 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子 |
JP6098090B2 (ja) * | 2012-09-26 | 2017-03-22 | 凸版印刷株式会社 | 有機エレクトロルミネッセンスパネルの製造方法 |
JP6098091B2 (ja) * | 2012-09-26 | 2017-03-22 | 凸版印刷株式会社 | 有機エレクトロルミネッセンスパネルの製造方法 |
DE102012109140B4 (de) * | 2012-09-27 | 2021-06-24 | Pictiva Displays International Limited | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes |
TWI552331B (zh) * | 2013-01-11 | 2016-10-01 | 財團法人工業技術研究院 | 電子元件之封裝結構 |
US9368749B2 (en) | 2013-03-12 | 2016-06-14 | Samsung Sdi Co., Ltd. | Patterned multilayered stack, and system and method for making the same |
CN104124347A (zh) * | 2013-04-28 | 2014-10-29 | 海洋王照明科技股份有限公司 | 柔性有机电致发光器件及其制备方法 |
US9464214B2 (en) | 2014-02-25 | 2016-10-11 | The Boeing Company | Thermally conductive flexible adhesive for aerospace applications |
JP2016072127A (ja) | 2014-09-30 | 2016-05-09 | ソニー株式会社 | 有機el表示装置およびその製造方法、並びに電子機器 |
KR102439040B1 (ko) * | 2014-12-01 | 2022-09-01 | 엘지디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 이를 포함하는 롤러블 유기 발광 디스플레이 시스템 |
US10277196B2 (en) * | 2015-04-23 | 2019-04-30 | Samsung Electro-Mechanics Co., Ltd. | Bulk acoustic wave resonator and method for manufacturing the same |
JP6584162B2 (ja) * | 2015-06-22 | 2019-10-02 | 東京エレクトロン株式会社 | 積層封止膜形成方法および形成装置 |
CN104993063A (zh) * | 2015-07-17 | 2015-10-21 | 京东方科技集团股份有限公司 | 一种封装件及其制作方法、oled装置 |
CN107546332A (zh) * | 2016-06-29 | 2018-01-05 | 张家港市鸿嘉数字科技有限公司 | 一种柔性oled封装方法 |
CN107546330A (zh) * | 2016-06-29 | 2018-01-05 | 张家港市鸿嘉数字科技有限公司 | 一种柔性oled衬底 |
KR102454027B1 (ko) * | 2016-11-06 | 2022-10-14 | 케이엘에이 코포레이션 | 유기 발광 다이오드의 캡슐화를 위한 방법 및 장치 |
KR20200036885A (ko) * | 2017-08-02 | 2020-04-07 | 스미또모 가가꾸 가부시키가이샤 | 유기 디바이스의 제조 방법 및 유기 디바이스 |
TWI677743B (zh) * | 2018-05-04 | 2019-11-21 | 元太科技工業股份有限公司 | 電泳顯示裝置 |
TWI750421B (zh) * | 2018-10-30 | 2021-12-21 | 立景光電股份有限公司 | 顯示面板 |
WO2020194736A1 (ja) * | 2019-03-28 | 2020-10-01 | シャープ株式会社 | 表示装置、及び表示装置の製造方法 |
US11139164B2 (en) * | 2019-12-12 | 2021-10-05 | Raytheon Company | Electronic device including hermetic micro-cavity and methods of preparing the same |
Family Cites Families (113)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2071506A (en) * | 1935-04-29 | 1937-02-23 | Scovill Manufacturing Co | Tool for applying fasteners |
US3496427A (en) * | 1966-01-13 | 1970-02-17 | Gen Electric | Semiconductor device with composite encapsulation |
US4266223A (en) * | 1978-12-08 | 1981-05-05 | W. H. Brady Co. | Thin panel display |
US4313254A (en) * | 1979-10-30 | 1982-02-02 | The Johns Hopkins University | Thin-film silicon solar cell with metal boride bottom electrode |
US4581337A (en) * | 1983-07-07 | 1986-04-08 | E. I. Du Pont De Nemours And Company | Polyether polyamines as linking agents for particle reagents useful in immunoassays |
US4426275A (en) * | 1981-11-27 | 1984-01-17 | Deposition Technology, Inc. | Sputtering device adaptable for coating heat-sensitive substrates |
DE3324106A1 (de) * | 1983-07-05 | 1985-01-17 | Draiswerke Gmbh, 6800 Mannheim | Verfahren zum beleimen von holz-spaenen und dergl. mit fluessigleim und vorrichtung zur durchfuehrung des verfahrens |
US4722515A (en) * | 1984-11-06 | 1988-02-02 | Spectrum Control, Inc. | Atomizing device for vaporization |
JPH0193129A (ja) * | 1987-10-02 | 1989-04-12 | Mitsubishi Electric Corp | 化学気相成長装置 |
US5189405A (en) * | 1989-01-26 | 1993-02-23 | Sharp Kabushiki Kaisha | Thin film electroluminescent panel |
US5711816A (en) * | 1990-07-06 | 1998-01-27 | Advanced Technolgy Materials, Inc. | Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same |
US5204314A (en) * | 1990-07-06 | 1993-04-20 | Advanced Technology Materials, Inc. | Method for delivering an involatile reagent in vapor form to a CVD reactor |
US5203898A (en) * | 1991-12-16 | 1993-04-20 | Corning Incorporated | Method of making fluorine/boron doped silica tubes |
US5393607A (en) * | 1992-01-13 | 1995-02-28 | Mitsui Toatsu Chemiclas, Inc. | Laminated transparent plastic material and polymerizable monomer |
US5402314A (en) * | 1992-02-10 | 1995-03-28 | Sony Corporation | Printed circuit board having through-hole stopped with photo-curable solder resist |
GB9215928D0 (en) * | 1992-07-27 | 1992-09-09 | Cambridge Display Tech Ltd | Manufacture of electroluminescent devices |
US5260095A (en) * | 1992-08-21 | 1993-11-09 | Battelle Memorial Institute | Vacuum deposition and curing of liquid monomers |
JPH06111936A (ja) * | 1992-09-29 | 1994-04-22 | Nec Kansai Ltd | 電界発光灯の製造方法 |
ES2090893T3 (es) * | 1993-01-28 | 1996-10-16 | Applied Materials Inc | Aparato de tratamiento en vacio que tiene una capacidad de produccion mejorada. |
JPH06223966A (ja) * | 1993-01-28 | 1994-08-12 | Toshiba Corp | 有機分散型elパネル |
US5510173A (en) * | 1993-08-20 | 1996-04-23 | Southwall Technologies Inc. | Multiple layer thin films with improved corrosion resistance |
WO1995010117A1 (en) * | 1993-10-04 | 1995-04-13 | Catalina Coatings, Inc. | Cross-linked acrylate coating material useful for forming capacitor dielectrics and oxygen barriers |
JP2846571B2 (ja) * | 1994-02-25 | 1999-01-13 | 出光興産株式会社 | 有機エレクトロルミネッセンス素子 |
DE4438359C2 (de) * | 1994-10-27 | 2001-10-04 | Schott Glas | Behälter aus Kunststoff mit einer Sperrbeschichtung |
US6083628A (en) * | 1994-11-04 | 2000-07-04 | Sigma Laboratories Of Arizona, Inc. | Hybrid polymer film |
US5607789A (en) * | 1995-01-23 | 1997-03-04 | Duracell Inc. | Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same |
JPH08203669A (ja) * | 1995-01-30 | 1996-08-09 | Seikosha Co Ltd | El両面発光表示体 |
US5620524A (en) * | 1995-02-27 | 1997-04-15 | Fan; Chiko | Apparatus for fluid delivery in chemical vapor deposition systems |
GB9507817D0 (en) * | 1995-04-18 | 1995-05-31 | Philips Electronics Uk Ltd | Touch sensing devices and methods of making such |
US5629389A (en) * | 1995-06-06 | 1997-05-13 | Hewlett-Packard Company | Polymer-based electroluminescent device with improved stability |
US5686360A (en) * | 1995-11-30 | 1997-11-11 | Motorola | Passivation of organic devices |
US6195142B1 (en) * | 1995-12-28 | 2001-02-27 | Matsushita Electrical Industrial Company, Ltd. | Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element |
US5738920A (en) * | 1996-01-30 | 1998-04-14 | Becton, Dickinson And Company | Blood collection tube assembly |
US5731661A (en) * | 1996-07-15 | 1998-03-24 | Motorola, Inc. | Passivation of electroluminescent organic devices |
US5902688A (en) * | 1996-07-16 | 1999-05-11 | Hewlett-Packard Company | Electroluminescent display device |
US5895228A (en) * | 1996-11-14 | 1999-04-20 | International Business Machines Corporation | Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives |
US5872355A (en) * | 1997-04-09 | 1999-02-16 | Hewlett-Packard Company | Electroluminescent device and fabrication method for a light detection system |
JP3290375B2 (ja) * | 1997-05-12 | 2002-06-10 | 松下電器産業株式会社 | 有機電界発光素子 |
US6198220B1 (en) * | 1997-07-11 | 2001-03-06 | Emagin Corporation | Sealing structure for organic light emitting devices |
EP2098906A1 (en) * | 1997-08-29 | 2009-09-09 | Sharp Kabushiki Kaisha | Liquid crystal display device |
US6203898B1 (en) * | 1997-08-29 | 2001-03-20 | 3M Innovatave Properties Company | Article comprising a substrate having a silicone coating |
US5902641A (en) * | 1997-09-29 | 1999-05-11 | Battelle Memorial Institute | Flash evaporation of liquid monomer particle mixture |
US6224948B1 (en) * | 1997-09-29 | 2001-05-01 | Battelle Memorial Institute | Plasma enhanced chemical deposition with low vapor pressure compounds |
US6045864A (en) * | 1997-12-01 | 2000-04-04 | 3M Innovative Properties Company | Vapor coating method |
US6569515B2 (en) * | 1998-01-13 | 2003-05-27 | 3M Innovative Properties Company | Multilayered polymer films with recyclable or recycled layers |
US6178082B1 (en) * | 1998-02-26 | 2001-01-23 | International Business Machines Corporation | High temperature, conductive thin film diffusion barrier for ceramic/metal systems |
US6066826A (en) * | 1998-03-16 | 2000-05-23 | Yializis; Angelo | Apparatus for plasma treatment of moving webs |
US5904958A (en) * | 1998-03-20 | 1999-05-18 | Rexam Industries Corp. | Adjustable nozzle for evaporation or organic monomers |
US6361885B1 (en) * | 1998-04-10 | 2002-03-26 | Organic Display Technology | Organic electroluminescent materials and device made from such materials |
US6352777B1 (en) * | 1998-08-19 | 2002-03-05 | The Trustees Of Princeton University | Organic photosensitive optoelectronic devices with transparent electrodes |
US6040017A (en) * | 1998-10-02 | 2000-03-21 | Sigma Laboratories, Inc. | Formation of multilayered photonic polymer composites |
CA2353506A1 (en) * | 1998-11-02 | 2000-05-11 | 3M Innovative Properties Company | Transparent conductive oxides for plastic flat panel displays |
US6837950B1 (en) * | 1998-11-05 | 2005-01-04 | Interface, Inc. | Separation of floor covering components for recycling |
US6228436B1 (en) * | 1998-12-16 | 2001-05-08 | Battelle Memorial Institute | Method of making light emitting polymer composite material |
US6217947B1 (en) * | 1998-12-16 | 2001-04-17 | Battelle Memorial Institute | Plasma enhanced polymer deposition onto fixtures |
US6228434B1 (en) * | 1998-12-16 | 2001-05-08 | Battelle Memorial Institute | Method of making a conformal coating of a microtextured surface |
US6268695B1 (en) * | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
US6207238B1 (en) * | 1998-12-16 | 2001-03-27 | Battelle Memorial Institute | Plasma enhanced chemical deposition for high and/or low index of refraction polymers |
US6207239B1 (en) * | 1998-12-16 | 2001-03-27 | Battelle Memorial Institute | Plasma enhanced chemical deposition of conjugated polymer |
JP3817081B2 (ja) * | 1999-01-29 | 2006-08-30 | パイオニア株式会社 | 有機el素子の製造方法 |
US6172810B1 (en) * | 1999-02-26 | 2001-01-09 | 3M Innovative Properties Company | Retroreflective articles having polymer multilayer reflective coatings |
US6358570B1 (en) * | 1999-03-31 | 2002-03-19 | Battelle Memorial Institute | Vacuum deposition and curing of oligomers and resins |
US7198832B2 (en) * | 1999-10-25 | 2007-04-03 | Vitex Systems, Inc. | Method for edge sealing barrier films |
US6866901B2 (en) * | 1999-10-25 | 2005-03-15 | Vitex Systems, Inc. | Method for edge sealing barrier films |
US7394153B2 (en) * | 1999-12-17 | 2008-07-01 | Osram Opto Semiconductors Gmbh | Encapsulation of electronic devices |
US6867539B1 (en) * | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
US6605826B2 (en) * | 2000-08-18 | 2003-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and display device |
US6537688B2 (en) * | 2000-12-01 | 2003-03-25 | Universal Display Corporation | Adhesive sealed organic optoelectronic structures |
US6822391B2 (en) * | 2001-02-21 | 2004-11-23 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device, electronic equipment, and method of manufacturing thereof |
JP4255643B2 (ja) * | 2001-02-21 | 2009-04-15 | 株式会社半導体エネルギー研究所 | 発光装置及びその作製方法 |
TWI222838B (en) * | 2001-04-10 | 2004-10-21 | Chi Mei Optoelectronics Corp | Packaging method of organic electroluminescence light-emitting display device |
KR100682377B1 (ko) * | 2001-05-25 | 2007-02-15 | 삼성전자주식회사 | 유기 전계발광 디바이스 및 이의 제조 방법 |
US6397776B1 (en) * | 2001-06-11 | 2002-06-04 | General Electric Company | Apparatus for large area chemical vapor deposition using multiple expanding thermal plasma generators |
TW546857B (en) * | 2001-07-03 | 2003-08-11 | Semiconductor Energy Lab | Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment |
US6888307B2 (en) * | 2001-08-21 | 2005-05-03 | Universal Display Corporation | Patterned oxygen and moisture absorber for organic optoelectronic device structures |
TW519853B (en) * | 2001-10-17 | 2003-02-01 | Chi Mei Electronic Corp | Organic electro-luminescent display and its packaging method |
US6888305B2 (en) * | 2001-11-06 | 2005-05-03 | Universal Display Corporation | Encapsulation structure that acts as a multilayer mirror |
US6681716B2 (en) * | 2001-11-27 | 2004-01-27 | General Electric Company | Apparatus and method for depositing large area coatings on non-planar surfaces |
US6948448B2 (en) * | 2001-11-27 | 2005-09-27 | General Electric Company | Apparatus and method for depositing large area coatings on planar surfaces |
US6597111B2 (en) * | 2001-11-27 | 2003-07-22 | Universal Display Corporation | Protected organic optoelectronic devices |
US6765351B2 (en) * | 2001-12-20 | 2004-07-20 | The Trustees Of Princeton University | Organic optoelectronic device structures |
US7012363B2 (en) * | 2002-01-10 | 2006-03-14 | Universal Display Corporation | OLEDs having increased external electroluminescence quantum efficiencies |
JP2003258189A (ja) * | 2002-03-01 | 2003-09-12 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2003292394A (ja) * | 2002-03-29 | 2003-10-15 | Canon Inc | 液相成長方法および液相成長装置 |
US8808457B2 (en) * | 2002-04-15 | 2014-08-19 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
NL1020634C2 (nl) * | 2002-05-21 | 2003-11-24 | Otb Group Bv | Werkwijze voor het passiveren van een halfgeleider substraat. |
US6710542B2 (en) * | 2002-08-03 | 2004-03-23 | Agilent Technologies, Inc. | Organic light emitting device with improved moisture seal |
JP2004103337A (ja) * | 2002-09-06 | 2004-04-02 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
US7015640B2 (en) * | 2002-09-11 | 2006-03-21 | General Electric Company | Diffusion barrier coatings having graded compositions and devices incorporating the same |
US7056584B2 (en) * | 2002-10-11 | 2006-06-06 | General Electric Company | Bond layer for coatings on plastic substrates |
AU2003299989A1 (en) * | 2002-12-27 | 2004-07-29 | Add-Vision, Inc. | Method for encapsulation of light emitting polyme devices and apparatus made by same |
JP2004241160A (ja) * | 2003-02-03 | 2004-08-26 | Sanyo Electric Co Ltd | 有機エレクトロルミネッセンス装置 |
US7018713B2 (en) * | 2003-04-02 | 2006-03-28 | 3M Innovative Properties Company | Flexible high-temperature ultrabarrier |
US7029765B2 (en) * | 2003-04-22 | 2006-04-18 | Universal Display Corporation | Organic light emitting devices having reduced pixel shrinkage |
JP4784308B2 (ja) * | 2003-05-29 | 2011-10-05 | コニカミノルタホールディングス株式会社 | ディスプレイ基板用透明フィルム、該フィルムを用いたディスプレイ基板およびその製造方法、液晶ディスプレイ、有機エレクトロルミネッセンスディスプレイ、およびタッチパネル |
US6998648B2 (en) * | 2003-08-25 | 2006-02-14 | Universal Display Corporation | Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant |
US7282244B2 (en) * | 2003-09-05 | 2007-10-16 | General Electric Company | Replaceable plate expanded thermal plasma apparatus and method |
US7635525B2 (en) * | 2003-09-30 | 2009-12-22 | Fujifilm Corporation | Gas barrier laminate film and method for producing the same |
JP2005251671A (ja) * | 2004-03-08 | 2005-09-15 | Fuji Photo Film Co Ltd | 表示装置 |
US8405193B2 (en) * | 2004-04-02 | 2013-03-26 | General Electric Company | Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages |
US7033850B2 (en) * | 2004-06-30 | 2006-04-25 | Eastman Kodak Company | Roll-to-sheet manufacture of OLED materials |
US20060063015A1 (en) * | 2004-09-23 | 2006-03-23 | 3M Innovative Properties Company | Protected polymeric film |
US7342356B2 (en) * | 2004-09-23 | 2008-03-11 | 3M Innovative Properties Company | Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer |
JP2006147218A (ja) * | 2004-11-17 | 2006-06-08 | Seiko Epson Corp | コンタクトの形成方法、共振器構造、及びel装置 |
JP2006185679A (ja) * | 2004-12-27 | 2006-07-13 | Asahi Glass Co Ltd | 有機elパネル及び有機el発光装置、並びに有機elパネルの製造方法 |
CN101228649B (zh) * | 2005-07-27 | 2011-09-28 | 皇家飞利浦电子股份有限公司 | 具有密封的集成驱动电路的发光器件 |
US7251947B2 (en) * | 2005-08-09 | 2007-08-07 | Carrier Corporation | Refrigerant system with suction line restrictor for capacity correction |
JP2007258006A (ja) * | 2006-03-23 | 2007-10-04 | Pioneer Electronic Corp | 光デバイス用の封止部材の製造方法、光デバイスの製造方法、光デバイス、および光デバイス用の封止部材 |
JP2008153043A (ja) * | 2006-12-18 | 2008-07-03 | Seiko Epson Corp | エレクトロルミネッセンス装置及び電子機器 |
JP5335190B2 (ja) * | 2006-12-28 | 2013-11-06 | 双葉電子工業株式会社 | 有機elパネル |
JP2007199729A (ja) * | 2007-02-19 | 2007-08-09 | Semiconductor Energy Lab Co Ltd | 表示装置 |
CN100580892C (zh) * | 2007-04-29 | 2010-01-13 | 联华电子股份有限公司 | 具有y型金属栅极的金属氧化物半导体晶体管及其工艺 |
EP2153699B1 (en) * | 2007-05-18 | 2016-07-13 | Henkel AG & Co. KGaA | Organic electronic devices protected by elastomeric laminating adhesive |
-
2008
- 2008-12-30 US US12/345,717 patent/US20100167002A1/en not_active Abandoned
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2009
- 2009-10-13 EP EP09774998.0A patent/EP2374173B1/en active Active
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JP2013101969A (ja) | 2013-05-23 |
WO2010077412A1 (en) | 2010-07-08 |
CN102210035A (zh) | 2011-10-05 |
US20100167002A1 (en) | 2010-07-01 |
JP2012513665A (ja) | 2012-06-14 |
EP2374173A1 (en) | 2011-10-12 |
KR101288127B1 (ko) | 2013-07-19 |
CN102210035B (zh) | 2016-08-17 |
TW201030860A (en) | 2010-08-16 |
KR20110089349A (ko) | 2011-08-05 |
EP2374173B1 (en) | 2020-04-01 |
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