JP5469932B2 - パワーモジュール及びそれを用いた車両用インバータ - Google Patents
パワーモジュール及びそれを用いた車両用インバータ Download PDFInfo
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- JP5469932B2 JP5469932B2 JP2009154528A JP2009154528A JP5469932B2 JP 5469932 B2 JP5469932 B2 JP 5469932B2 JP 2009154528 A JP2009154528 A JP 2009154528A JP 2009154528 A JP2009154528 A JP 2009154528A JP 5469932 B2 JP5469932 B2 JP 5469932B2
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- H—ELECTRICITY
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- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
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Description
電気回路のインダクタンスの低減に係る工夫には次の3つの観点がある。
パワーモジュールの小型化について説明する。後述するパワーモジュールは同様の構造を有している。パワーモジュールには、インバータ回路の上アームと下アームからなる直列回路を3相交流のU相とV相とW相とに対応させて設けている。上記直列回路を併設して設けているので、各直列回路の半導体チップが整然と並べて配置することが可能となり、パワーモジュールの小型化に繋がる。
図2にインバータ装置140の回路構成図を示す。該図に示す如く、インバータ装置140は、パワーモジュール300及びドライバ回路174からなり、マイコン基板172からの信号によりドライバ回路174が動作し、パワーモジュール300のIGBTをスイッチングする。
該図において、300はパワーモジュール、302は樹脂ケース、304は金属ベース、305はフィン(図7参照)、314は正極接続端子、316は負極接続端子、318は絶縁紙(図6参照)、320U/320Lはパワーモジュールの制御端子、328は上アーム用IGBT、330は下アーム用IGBT、156/166はダイオード、334は絶縁基板(図7参照)、334kは絶縁基板334上の回路配線パターン(図7参照)、334rは絶縁基板334下の回路配線パターン334r(図7参照)をそれぞれ表す。
10 上部ケース蓋
11 金属ベース
12 筐体
13 入口配管
14 出口配管
15 直流ターミナルケース
16 下部ケース蓋
17 交流ターミナルケース
20 マイコン回路基板
21 コネクタ
22 ドライバ回路基板
110 ハイブリッド電気自動車
112 前輪
114 前輪車軸
116 前輪側DEF
118 変速機
120 エンジン
121 エンジンシステム
131 エンジンコントローラ
132 燃料
136 バッテリ
138 直流コネクタ
140,200 インバータ装置
144 インバータ回路
150 上下アームの直列回路
151 上アームの回路
152 下アームの回路
154 上アームのゲート電極端子
156 上アームのダイオード
159 交流端子
159t モータ側接続部
166 下アームのダイオード
169 中間電極
170 制御部
172 マイコン基板(制御回路)
174 ドライバ回路
180 電流検出部
188 交流コネクタ
192 インダクタンス
250 車載用電機システム
300 パワーモジュール(半導体装置)
302 樹脂ケース
304 金属ベース
313Z 絶縁沿面距離
314 正極接続端子
314a 正極接続部
314B,316B,318B 屈曲部
314k,316k 接続端
316 負極接続端子
316a 負極接続部
317,704 負極導体板
318 絶縁紙
318D 接続部直近の絶縁紙の露出部
318E 積層端子部の絶縁紙の露出部
319 インサートナット
320L,320U 制御端子
328 上アーム用IGBT
330 下アーム用IGBT
334 絶縁基板
334k,334r 回路配線パターン
335 寄生インダクタンス
336 電源
337 はんだまたは、その他金属接続用のろう材
380 接続箇所
382,614,615 電流
384,392,394 電流経路
390 コンデンサモジュールと直流バスバーの接続部拡大箇所
500 コンデンサモジュール
502 コンデンサケース
600,606,624 コレクタ電流
602,622 ゲート電圧
604,626 コレクタ電圧
608 ダイオード
610 インダクタンス負荷
616 ミラー期間
618 電流の流れ(正極側)
620 電流の流れ(負極側)
628 スパイク電圧
700 コンデンサ外部接続導体
702 正極導体板
702a,702b 正極導体板702の接続部
704a,704c 負極導体板704の接続部
705 透孔
706 絶縁シート
710 端子締結用ボルト
720 ボルト
Claims (5)
- パワー半導体素子を搭載した上アーム回路部及び下アーム回路部と、該上アーム回路部及び下アーム回路部を実装する絶縁基板と、前記上アーム回路部と下アーム回路部を直列に接続した回路を構成し、かつ、前記絶縁基板の前記上アーム回路及び下アーム回路部を実装する面とは反対側の面に接合された金属ベースとを有し、前記上アーム回路部は、外部から前記上アーム回路部に高電位を供給するための第1接続導体と、外部から前記下アーム回路部の低電位を供給するための第2接続導体と、前記金属ベースの上に前記第1及び第2接続導体を支持し絶縁する樹脂ケースとを備えたパワーモジュールであって、
前記第1接続導体及び前記第2接続導体は、平板状の導体であり、かつ、絶縁シートで互いに絶縁されて積層され、前記絶縁シートが前記第1接続導体及び前記第2接続導体に挟まれて成る部分である積層部を形成し、前記絶縁シートは、前記積層部より露出した部分である露出部を有し、前記露出部によって前記第1接続導体と前記第2接続導体の絶縁沿面距離を確保する構造をとり、前記樹脂ケースには、前記第1接続導体と第2接続導体及び前記絶縁シートを積層して収納する凹部が形成され、
前記第1接続導体及び第2接続導体は、その端部に前記パワーモジュールの外部接続部が形成され、前記絶縁シートが、前記外部接続部の直近まで露出している
ことを特徴とするパワーモジュール。 - 請求項1に記載のパワーモジュールにおいて、
前記樹脂ケースは、前記外部接続部を前記樹脂ケースに固定するネジ部を備え、前記外部接続部が前記ネジ部で前記樹脂ケースに固定されることにより前記外部接続部の応力を前記樹脂ケースに伝える構造をもつ
ことを特徴とするパワーモジュール。 - 請求項2に記載のパワーモジュールにおいて、
前記絶縁シートの前記露出部は、ゲル状の絶縁物で覆われている
ことを特徴とするパワーモジュール。 - 請求項2に記載のパワーモジュールにおいて、
前記第1接続導体及び前記第2接続導体並びに前記絶縁シートは屈曲部を有し、該屈曲部の先端部を樹脂ケースの凹部に収納して位置決めする構造をもつ
ことを特徴とするパワーモジュール。 - 請求項1から4までのいずれか1項に記載のパワーモジュールとコンデンサモジュールとを搭載し、前記絶縁シートとは分離された他の絶縁シートを介して互いに積層された2枚の平板導体を含んで成る積層バスバーを用いて前記コンデンサモジュールと前記パワーモジュールとを接続した回路を備え、
バッテリの直流電力を交流電力に変換して車両駆動用モータを制御する
ことを特徴とする車両用インバータ。
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US12/826,409 US8519561B2 (en) | 2009-06-30 | 2010-06-29 | Power module and vehicle-mounted inverter using the same |
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