JP5469874B2 - 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 - Google Patents

硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 Download PDF

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JP5469874B2
JP5469874B2 JP2009025254A JP2009025254A JP5469874B2 JP 5469874 B2 JP5469874 B2 JP 5469874B2 JP 2009025254 A JP2009025254 A JP 2009025254A JP 2009025254 A JP2009025254 A JP 2009025254A JP 5469874 B2 JP5469874 B2 JP 5469874B2
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optical semiconductor
semiconductor element
component
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JP2010084118A5 (OSRAM
JP2010084118A (ja
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誠 吉武
博司 江南
智子 加藤
匡慶 寺田
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Priority to JP2009025254A priority Critical patent/JP5469874B2/ja
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to CN2009801326886A priority patent/CN102131874B/zh
Priority to TW098129913A priority patent/TWI495688B/zh
Priority to MYPI20110999 priority patent/MY151260A/en
Priority to KR1020117007834A priority patent/KR101723387B1/ko
Priority to US13/062,374 priority patent/US8373286B2/en
Priority to EP09740543.5A priority patent/EP2324079B9/en
Priority to PCT/JP2009/065885 priority patent/WO2010027105A1/en
Publication of JP2010084118A publication Critical patent/JP2010084118A/ja
Publication of JP2010084118A5 publication Critical patent/JP2010084118A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
JP2009025254A 2008-09-05 2009-02-05 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 Active JP5469874B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2009025254A JP5469874B2 (ja) 2008-09-05 2009-02-05 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
TW098129913A TWI495688B (zh) 2008-09-05 2009-09-04 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置
MYPI20110999 MY151260A (en) 2008-09-05 2009-09-04 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
KR1020117007834A KR101723387B1 (ko) 2008-09-05 2009-09-04 경화성 오가노폴리실록산 조성물, 광반도체 소자 봉지제 및 광반도체 장치
CN2009801326886A CN102131874B (zh) 2008-09-05 2009-09-04 可固化的有机基聚硅氧烷组合物，光学半导体元件密封剂，和光学半导体器件
US13/062,374 US8373286B2 (en) 2008-09-05 2009-09-04 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
EP09740543.5A EP2324079B9 (en) 2008-09-05 2009-09-04 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
PCT/JP2009/065885 WO2010027105A1 (en) 2008-09-05 2009-09-04 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008228980 2008-09-05
JP2008228980 2008-09-05
JP2009025254A JP5469874B2 (ja) 2008-09-05 2009-02-05 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置

Publications (3)

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JP2010084118A JP2010084118A (ja) 2010-04-15
JP2010084118A5 JP2010084118A5 (OSRAM) 2013-09-19
JP5469874B2 true JP5469874B2 (ja) 2014-04-16

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Country Status (8)

Country Link
US (1) US8373286B2 (OSRAM)
EP (1) EP2324079B9 (OSRAM)
JP (1) JP5469874B2 (OSRAM)
KR (1) KR101723387B1 (OSRAM)
CN (1) CN102131874B (OSRAM)
MY (1) MY151260A (OSRAM)
TW (1) TWI495688B (OSRAM)
WO (1) WO2010027105A1 (OSRAM)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010050625A1 (en) 2008-10-31 2010-05-06 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
KR101274418B1 (ko) * 2010-06-24 2013-06-17 세키스이가가쿠 고교가부시키가이샤 광 반도체 장치용 밀봉제 및 이를 이용한 광 반도체 장치
KR101277722B1 (ko) * 2010-07-14 2013-06-24 제일모직주식회사 하이브리드 실록산 중합체, 상기 하이브리드 실록산 중합체로부터 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자
JP5323037B2 (ja) * 2010-12-14 2013-10-23 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP5323038B2 (ja) * 2010-12-14 2013-10-23 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2012222202A (ja) * 2011-04-11 2012-11-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP5992666B2 (ja) * 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
EP2722366B1 (en) * 2011-06-17 2023-01-04 LG Chem, Ltd. Curable composition
EP2784126B1 (en) 2011-11-25 2019-03-13 LG Chem, Ltd. Curable composition
KR101317776B1 (ko) * 2011-12-14 2013-10-11 한국과학기술연구원 코어-쉘 구조를 갖는 페닐폴리실록산 수지
RU2495895C1 (ru) * 2012-05-10 2013-10-20 Общество с ограниченной ответственностью "Элкон" Эмаль термостойкая
JP6046395B2 (ja) * 2012-06-29 2016-12-14 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
JP6108132B2 (ja) * 2012-07-27 2017-04-05 エルジー・ケム・リミテッド 硬化性組成物
TWI510554B (zh) * 2012-07-27 2015-12-01 Ｌｇ化學股份有限公司 可固化組成物
JP2014031394A (ja) * 2012-08-01 2014-02-20 Shin Etsu Chem Co Ltd 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
US9117757B2 (en) * 2012-10-16 2015-08-25 Brewer Science Inc. Silicone polymers with high refractive indices and extended pot life
US9181400B2 (en) 2012-11-09 2015-11-10 Sumitomo Seika Chemicals Co., Ltd. Silicone resin composition, cured silicone resin, and sealed optical semiconductor element
US9657143B2 (en) 2012-12-26 2017-05-23 Cheil Industries, Inc. Curable polysiloxane composition for optical device and encapsulant and optical device
EP2938679B1 (en) 2012-12-28 2021-08-18 Dow Silicones Corporation Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
JP5985981B2 (ja) * 2012-12-28 2016-09-06 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
KR20150103707A (ko) * 2012-12-28 2015-09-11 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물, 이의 경화물 및 광반도체 장치
JP6415451B2 (ja) 2012-12-28 2018-10-31 ダウ シリコーンズ コーポレーション トランスデューサー用硬化性オルガノシロキサン組成物及び硬化性シリコーン組成物のトランスデューサーへの使用
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
WO2014148852A1 (ko) * 2013-03-21 2014-09-25 주식회사 동진쎄미켐 광학소자의 다층구조 봉지방법
CN103232707B (zh) * 2013-04-19 2015-12-09 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
EP2994290B1 (en) 2013-05-10 2023-10-04 ABL IP Holding LLC Silicone optics
CN105492541A (zh) * 2013-08-19 2016-04-13 住友精化株式会社 加成固化型有机硅树脂组合物、加成固化型有机硅树脂固化物和光半导体元件封装体
KR102151835B1 (ko) 2013-08-20 2020-09-03 스미또모 세이까 가부시키가이샤 축합 경화형 실리콘 수지 조성물, 축합 경화형 실리콘 수지 경화물, 및 광 반도체 소자 봉지체
KR101911694B1 (ko) * 2013-08-29 2018-10-25 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물, 및 광반도체 장치
WO2015056725A1 (ja) * 2013-10-17 2015-04-23 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および光半導体装置
KR101688407B1 (ko) * 2013-10-17 2016-12-22 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 광 반도체 장치
JP6254833B2 (ja) 2013-11-25 2017-12-27 信越化学工業株式会社 シリコーン樹脂組成物及び光半導体装置
WO2015083446A1 (ja) * 2013-12-06 2015-06-11 住友精化株式会社 付加硬化型シリコーン樹脂組成物、付加硬化型シリコーン樹脂硬化物、及び、光半導体素子封止体
WO2015098072A1 (en) * 2013-12-27 2015-07-02 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, member for transducers
WO2015115808A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
JP6643985B2 (ja) 2014-01-28 2020-02-12 エルジー・ケム・リミテッド 硬化体
WO2015115810A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015115811A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015115812A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015129140A1 (ja) * 2014-02-28 2015-09-03 住友精化株式会社 付加硬化型シリコーン樹脂組成物、付加硬化型シリコーン樹脂硬化物、及び、光半導体素子封止体
JP6100717B2 (ja) * 2014-03-05 2017-03-22 信越化学工業株式会社 付加硬化型シリコーン組成物及び光学素子
EP3106494A4 (en) * 2014-03-12 2017-10-18 The Yokohama Rubber Co., Ltd. Curable resin composition
KR20170015356A (ko) * 2014-06-04 2017-02-08 다우 코닝 도레이 캄파니 리미티드 접착 촉진제, 경화성 실리콘 조성물 및 반도체 장치
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
KR20160002243A (ko) * 2014-06-30 2016-01-07 제일모직주식회사 경화형 폴리오르가노실록산 조성물, 봉지재, 및 광학기기
DE102015225906A1 (de) * 2015-12-18 2017-06-22 Wacker Chemie Ag Siloxanharzzusammensetzungen
JP6515940B2 (ja) * 2017-03-17 2019-05-22 日亜化学工業株式会社 発光装置及びその製造方法
EP3655483B1 (en) * 2017-07-21 2022-06-08 Dow Silicones Corporation Curable organopolysiloxane composition and cured product thereof
JP6915527B2 (ja) * 2017-12-27 2021-08-04 信越化学工業株式会社 有機ｅｌ用透明乾燥剤及びその使用方法
CN112041376B (zh) * 2018-04-16 2023-04-04 信越化学工业株式会社 有机el用透明干燥剂及其使用方法
CN110272627B (zh) * 2019-07-24 2021-11-23 杭州之江新材料有限公司 一种高折光指数的有机硅凝胶及其制备方法
CN110684357A (zh) * 2019-09-16 2020-01-14 安徽若水化工有限公司 一种低密度导热阻燃有机硅材料
IL293546A (en) 2019-12-06 2022-08-01 Nusil Tech Llc Solvent catalyst for one-part organopolysiloxane systems and related methods
KR20210147211A (ko) 2020-05-28 2021-12-07 롬엔드하스전자재료코리아유한회사 광경화성 실록산 수지 조성물 및 이의 경화물
JP7673941B2 (ja) 2020-07-20 2025-05-09 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
KR20220012648A (ko) 2020-07-23 2022-02-04 롬엔드하스전자재료코리아유한회사 광경화성 실록산 수지 조성물 및 이의 경화물
TW202244185A (zh) 2021-03-08 2022-11-16 日商杜邦東麗特殊材料股份有限公司 硬化性聚矽氧組成物、密封劑及光半導體裝置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661210A (en) * 1996-09-25 1997-08-26 Dow Corning Corporation Optically clear liquid silicone rubber
JP4040858B2 (ja) * 2001-10-19 2008-01-30 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4766222B2 (ja) 2003-03-12 2011-09-07 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
TW200427111A (en) * 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
JP4908736B2 (ja) 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2005272697A (ja) * 2004-03-25 2005-10-06 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物、光半導体用封止材および光半導体装置
JP2006063092A (ja) * 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP4590253B2 (ja) * 2004-12-16 2010-12-01 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびシリコーン組成物
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP5025917B2 (ja) * 2005-06-15 2012-09-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP4586981B2 (ja) * 2005-06-23 2010-11-24 信越化学工業株式会社 自己接着性オルガノポリシロキサン組成物
EP1749861B1 (en) * 2005-08-03 2014-08-20 Shin-Etsu Chemical Co., Ltd. Addition curable silicone resin composition for light emitting diode
JP4872296B2 (ja) 2005-09-30 2012-02-08 日亜化学工業株式会社 シリコーンゴム封止型発光装置、及び該発光装置の製造方法
CN101389695B (zh) * 2006-02-24 2012-07-04 陶氏康宁公司 用硅氧烷包封的发光器件和用于制备该硅氧烷的可固化的硅氧烷组合物
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4933179B2 (ja) * 2006-07-14 2012-05-16 信越化学工業株式会社 硬化性シリコーンゴム組成物及びその硬化物
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
WO2010050625A1 (en) 2008-10-31 2010-05-06 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
JP4862032B2 (ja) * 2008-12-05 2012-01-25 信越化学工業株式会社 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材

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CN102131874A (zh) 2011-07-20
CN102131874B (zh) 2013-02-27
WO2010027105A1 (en) 2010-03-11
US20110227235A1 (en) 2011-09-22
TW201014885A (en) 2010-04-16
EP2324079B9 (en) 2013-10-16
EP2324079A1 (en) 2011-05-25
KR20110053470A (ko) 2011-05-23
JP2010084118A (ja) 2010-04-15
EP2324079B1 (en) 2012-10-24
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