TWI495688B - 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置 - Google Patents

可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置 Download PDF

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Publication number
TWI495688B
TWI495688B TW098129913A TW98129913A TWI495688B TW I495688 B TWI495688 B TW I495688B TW 098129913 A TW098129913 A TW 098129913A TW 98129913 A TW98129913 A TW 98129913A TW I495688 B TWI495688 B TW I495688B
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Taiwan
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optical semiconductor
group
semiconductor element
groups
phenyl
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TW098129913A
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Chinese (zh)
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TW201014885A (en
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吉武誠
江南博司
加藤智子
寺田匡慶
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道康寧東麗股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
TW098129913A 2008-09-05 2009-09-04 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置 TWI495688B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008228980 2008-09-05
JP2009025254A JP5469874B2 (ja) 2008-09-05 2009-02-05 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置

Publications (2)

Publication Number Publication Date
TW201014885A TW201014885A (en) 2010-04-16
TWI495688B true TWI495688B (zh) 2015-08-11

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TW098129913A TWI495688B (zh) 2008-09-05 2009-09-04 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置

Country Status (8)

Country Link
US (1) US8373286B2 (OSRAM)
EP (1) EP2324079B9 (OSRAM)
JP (1) JP5469874B2 (OSRAM)
KR (1) KR101723387B1 (OSRAM)
CN (1) CN102131874B (OSRAM)
MY (1) MY151260A (OSRAM)
TW (1) TWI495688B (OSRAM)
WO (1) WO2010027105A1 (OSRAM)

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Also Published As

Publication number Publication date
KR20110053470A (ko) 2011-05-23
US8373286B2 (en) 2013-02-12
WO2010027105A1 (en) 2010-03-11
US20110227235A1 (en) 2011-09-22
KR101723387B1 (ko) 2017-04-06
EP2324079B9 (en) 2013-10-16
TW201014885A (en) 2010-04-16
EP2324079A1 (en) 2011-05-25
CN102131874B (zh) 2013-02-27
CN102131874A (zh) 2011-07-20
JP2010084118A (ja) 2010-04-15
MY151260A (en) 2014-04-30
JP5469874B2 (ja) 2014-04-16
EP2324079B1 (en) 2012-10-24

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