JP5467799B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5467799B2
JP5467799B2 JP2009117689A JP2009117689A JP5467799B2 JP 5467799 B2 JP5467799 B2 JP 5467799B2 JP 2009117689 A JP2009117689 A JP 2009117689A JP 2009117689 A JP2009117689 A JP 2009117689A JP 5467799 B2 JP5467799 B2 JP 5467799B2
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Japan
Prior art keywords
lead
conductive material
semiconductor
semiconductor chip
chip
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JP2009117689A
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English (en)
Japanese (ja)
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JP2010267789A5 (enExample
JP2010267789A (ja
Inventor
孝光 金澤
俊幸 波多
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Renesas Electronics Corp
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Renesas Electronics Corp
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Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2009117689A priority Critical patent/JP5467799B2/ja
Priority to US12/776,376 priority patent/US8222651B2/en
Publication of JP2010267789A publication Critical patent/JP2010267789A/ja
Publication of JP2010267789A5 publication Critical patent/JP2010267789A5/ja
Priority to US13/533,947 priority patent/US8629467B2/en
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Publication of JP5467799B2 publication Critical patent/JP5467799B2/ja
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JP2009117689A 2009-05-14 2009-05-14 半導体装置 Active JP5467799B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009117689A JP5467799B2 (ja) 2009-05-14 2009-05-14 半導体装置
US12/776,376 US8222651B2 (en) 2009-05-14 2010-05-08 Semiconductor device
US13/533,947 US8629467B2 (en) 2009-05-14 2012-06-26 Semiconductor device

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Application Number Priority Date Filing Date Title
JP2009117689A JP5467799B2 (ja) 2009-05-14 2009-05-14 半導体装置

Publications (3)

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JP2010267789A JP2010267789A (ja) 2010-11-25
JP2010267789A5 JP2010267789A5 (enExample) 2012-04-05
JP5467799B2 true JP5467799B2 (ja) 2014-04-09

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US (2) US8222651B2 (enExample)
JP (1) JP5467799B2 (enExample)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5467799B2 (ja) * 2009-05-14 2014-04-09 ルネサスエレクトロニクス株式会社 半導体装置
JP5921055B2 (ja) * 2010-03-08 2016-05-24 ルネサスエレクトロニクス株式会社 半導体装置
US8324025B2 (en) * 2010-04-22 2012-12-04 Team Pacific Corporation Power semiconductor device packaging
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