JP5369128B2 - 浮上式塗布装置 - Google Patents

浮上式塗布装置 Download PDF

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Publication number
JP5369128B2
JP5369128B2 JP2011044115A JP2011044115A JP5369128B2 JP 5369128 B2 JP5369128 B2 JP 5369128B2 JP 2011044115 A JP2011044115 A JP 2011044115A JP 2011044115 A JP2011044115 A JP 2011044115A JP 5369128 B2 JP5369128 B2 JP 5369128B2
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JP
Japan
Prior art keywords
stage
levitation
floating
rough
substrate
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Active
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JP2011044115A
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English (en)
Japanese (ja)
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JP2012182308A (ja
Inventor
寿史 稲益
文宏 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=46804753&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5369128(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011044115A priority Critical patent/JP5369128B2/ja
Priority to TW101106554A priority patent/TWI505390B/zh
Priority to CN201210050161.2A priority patent/CN102671821B/zh
Priority to KR1020120020780A priority patent/KR101805928B1/ko
Publication of JP2012182308A publication Critical patent/JP2012182308A/ja
Application granted granted Critical
Publication of JP5369128B2 publication Critical patent/JP5369128B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Coating Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
JP2011044115A 2011-03-01 2011-03-01 浮上式塗布装置 Active JP5369128B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011044115A JP5369128B2 (ja) 2011-03-01 2011-03-01 浮上式塗布装置
TW101106554A TWI505390B (zh) 2011-03-01 2012-02-29 Floating on the coating device
CN201210050161.2A CN102671821B (zh) 2011-03-01 2012-02-29 悬浮式涂敷装置
KR1020120020780A KR101805928B1 (ko) 2011-03-01 2012-02-29 부상식 도포 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011044115A JP5369128B2 (ja) 2011-03-01 2011-03-01 浮上式塗布装置

Publications (2)

Publication Number Publication Date
JP2012182308A JP2012182308A (ja) 2012-09-20
JP5369128B2 true JP5369128B2 (ja) 2013-12-18

Family

ID=46804753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011044115A Active JP5369128B2 (ja) 2011-03-01 2011-03-01 浮上式塗布装置

Country Status (4)

Country Link
JP (1) JP5369128B2 (zh)
KR (1) KR101805928B1 (zh)
CN (1) CN102671821B (zh)
TW (1) TWI505390B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102115171B1 (ko) * 2013-02-01 2020-05-26 세메스 주식회사 기판 부상 유닛 및 기판 처리 장치
CN106780988B (zh) * 2017-02-17 2023-04-28 深圳怡化电脑股份有限公司 纸币浮动传输装置及自动柜员机
JP6860379B2 (ja) * 2017-03-03 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
JP6853520B2 (ja) * 2018-09-20 2021-03-31 株式会社Ｎｓｃ 浮上搬送装置
JP6916833B2 (ja) * 2019-04-18 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
CN112357581A (zh) * 2020-12-30 2021-02-12 彩虹（合肥）液晶玻璃有限公司 一种玻璃基板风干及传送装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177514A (en) * 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
DE4201584C1 (zh) * 1992-01-22 1993-04-15 Leybold Ag, 6450 Hanau, De
DE4232959C2 (de) * 1992-10-01 2001-05-10 Leybold Ag Vorrichtung zum Ein- und Ausschleusen scheibenförmiger Substrate
US6620243B1 (en) * 1998-05-29 2003-09-16 Nordson Corporation Fluidized bed powder handling and coating apparatus and methods
US20050079278A1 (en) * 2003-10-14 2005-04-14 Burrows Paul E. Method and apparatus for coating an organic thin film on a substrate from a fluid source with continuous feed capability
JP2006173246A (ja) * 2004-12-14 2006-06-29 Tokyo Electron Ltd 塗布装置及び塗布方法及び塗布処理プログラム
JP4531690B2 (ja) * 2005-12-08 2010-08-25 東京エレクトロン株式会社 加熱処理装置
JP2009093002A (ja) * 2007-10-10 2009-04-30 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板処理装置を構成するステージの設置方法
TWI452436B (zh) * 2008-04-24 2014-09-11 Tokyo Ohka Kogyo Co Ltd 塗佈裝置
JP5244446B2 (ja) * 2008-04-24 2013-07-24 東京応化工業株式会社 塗布装置
JP4592787B2 (ja) * 2008-07-11 2010-12-08 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
CN102671821B (zh) 2016-04-27
KR20120099593A (ko) 2012-09-11
CN102671821A (zh) 2012-09-19
TW201243988A (en) 2012-11-01
JP2012182308A (ja) 2012-09-20
TWI505390B (zh) 2015-10-21
KR101805928B1 (ko) 2017-12-06

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