JP5324212B2 - 樹脂被覆方法および樹脂被覆装置 - Google Patents

樹脂被覆方法および樹脂被覆装置 Download PDF

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Publication number
JP5324212B2
JP5324212B2 JP2008333751A JP2008333751A JP5324212B2 JP 5324212 B2 JP5324212 B2 JP 5324212B2 JP 2008333751 A JP2008333751 A JP 2008333751A JP 2008333751 A JP2008333751 A JP 2008333751A JP 5324212 B2 JP5324212 B2 JP 5324212B2
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Japan
Prior art keywords
resin
workpiece
wafer
pressing
curable resin
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JP2008333751A
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English (en)
Japanese (ja)
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JP2010155298A (ja
Inventor
一馬 関家
寛 小野寺
誠 下谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2008333751A priority Critical patent/JP5324212B2/ja
Priority to TW098134603A priority patent/TWI460215B/zh
Priority to CN200910258838.XA priority patent/CN101770937B/zh
Publication of JP2010155298A publication Critical patent/JP2010155298A/ja
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Publication of JP5324212B2 publication Critical patent/JP5324212B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2008333751A 2008-12-26 2008-12-26 樹脂被覆方法および樹脂被覆装置 Active JP5324212B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008333751A JP5324212B2 (ja) 2008-12-26 2008-12-26 樹脂被覆方法および樹脂被覆装置
TW098134603A TWI460215B (zh) 2008-12-26 2009-10-13 Resin coating method and resin coating device (2)
CN200910258838.XA CN101770937B (zh) 2008-12-26 2009-12-25 树脂包覆方法以及树脂包覆装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008333751A JP5324212B2 (ja) 2008-12-26 2008-12-26 樹脂被覆方法および樹脂被覆装置

Publications (2)

Publication Number Publication Date
JP2010155298A JP2010155298A (ja) 2010-07-15
JP5324212B2 true JP5324212B2 (ja) 2013-10-23

Family

ID=42503721

Family Applications (1)

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JP2008333751A Active JP5324212B2 (ja) 2008-12-26 2008-12-26 樹脂被覆方法および樹脂被覆装置

Country Status (3)

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JP (1) JP5324212B2 (zh)
CN (1) CN101770937B (zh)
TW (1) TWI460215B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015216619A1 (de) 2015-08-31 2017-03-02 Disco Corporation Verfahren zum Bearbeiten eines Wafers
DE112017003219T5 (de) 2016-06-28 2019-03-21 Disco Corporation Verfahren zum Bearbeiten eines Wafers

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012049448A (ja) * 2010-08-30 2012-03-08 Mitsubishi Chemicals Corp 窒化物半導体基板の製造方法
JP5585379B2 (ja) * 2010-10-21 2014-09-10 富士電機株式会社 半導体装置の製造方法およびその製造装置
JP5675377B2 (ja) * 2011-01-13 2015-02-25 株式会社ディスコ ワーク保持装置
JP5670208B2 (ja) * 2011-01-13 2015-02-18 株式会社ディスコ 樹脂塗布装置
JP5675378B2 (ja) * 2011-01-13 2015-02-25 株式会社ディスコ 樹脂塗布装置
JP6021362B2 (ja) * 2012-03-09 2016-11-09 株式会社ディスコ 板状物の研削方法
JP5991853B2 (ja) * 2012-05-30 2016-09-14 株式会社ディスコ 樹脂塗布装置
CN102773311A (zh) * 2012-07-11 2012-11-14 苏州市世嘉科技股份有限公司 一种控制薄板焊接变形的新型生产工艺
JP6164822B2 (ja) * 2012-11-15 2017-07-19 株式会社ディスコ ウェーハ貼着方法
JP2014192307A (ja) * 2013-03-27 2014-10-06 Disco Abrasive Syst Ltd サファイア基板の平坦加工方法
JP6149223B2 (ja) * 2013-04-18 2017-06-21 株式会社ディスコ 板状物の貼着方法
JP6288935B2 (ja) * 2013-04-18 2018-03-07 株式会社ディスコ シート
JP6322472B2 (ja) * 2014-05-01 2018-05-09 スリーエム イノベイティブ プロパティズ カンパニー シート貼付方法、シート貼付装置及びウエハ加工方法
JP6486176B2 (ja) 2015-04-15 2019-03-20 株式会社ディスコ 被加工物の切削加工方法
JP2018074019A (ja) * 2016-10-31 2018-05-10 株式会社Sumco ウェーハの製造方法およびウェーハ
JP2018074018A (ja) * 2016-10-31 2018-05-10 株式会社Sumco ウェーハの製造方法およびウェーハ
CN109244029B (zh) * 2018-09-28 2022-12-02 上海微松工业自动化有限公司 一种晶圆平整固定装置
JP7208759B2 (ja) 2018-10-16 2023-01-19 株式会社ディスコ ウエーハ保持装置を用いたウエーハの加工方法
JP7462441B2 (ja) 2020-03-13 2024-04-05 株式会社ディスコ 保護部材の設置方法、被加工物の加工方法、保護部材の製造方法及び被加工物の保護部材
JP7436289B2 (ja) 2020-05-27 2024-02-21 株式会社ディスコ 保護部材形成装置
JP7436288B2 (ja) 2020-05-27 2024-02-21 株式会社ディスコ 保護部材形成装置
JP2022172822A (ja) 2021-05-07 2022-11-17 信越半導体株式会社 ウェーハの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3055401B2 (ja) * 1994-08-29 2000-06-26 信越半導体株式会社 ワークの平面研削方法及び装置
JP3924641B2 (ja) * 1997-10-07 2007-06-06 東芝セラミックス株式会社 半導体ウェーハの製造方法
JP2000005982A (ja) * 1998-06-22 2000-01-11 Enya System:Kk スライスドウエ−ハの基準面形成方法
JP2001110765A (ja) * 1999-10-05 2001-04-20 Sumitomo Metal Ind Ltd 高精度ウェーハとその製造方法
JP2006222119A (ja) * 2005-02-08 2006-08-24 Renesas Technology Corp 半導体装置の製造方法
JP2006263837A (ja) * 2005-03-22 2006-10-05 Disco Abrasive Syst Ltd ウエーハの平坦加工方法
JP2007134371A (ja) * 2005-11-08 2007-05-31 Nikka Seiko Kk ウエ−ハの基準面形成方法及びその装置
JP5089370B2 (ja) * 2007-12-21 2012-12-05 株式会社ディスコ 樹脂被覆方法および装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015216619A1 (de) 2015-08-31 2017-03-02 Disco Corporation Verfahren zum Bearbeiten eines Wafers
DE102015216619B4 (de) 2015-08-31 2017-08-10 Disco Corporation Verfahren zum Bearbeiten eines Wafers
US10256148B2 (en) 2015-08-31 2019-04-09 Disco Corporation Method of processing wafer
DE112017003219T5 (de) 2016-06-28 2019-03-21 Disco Corporation Verfahren zum Bearbeiten eines Wafers
DE112017003219B4 (de) 2016-06-28 2023-06-15 Disco Corporation Verfahren zum Bearbeiten eines Wafers

Also Published As

Publication number Publication date
CN101770937B (zh) 2014-03-12
TW201031695A (en) 2010-09-01
JP2010155298A (ja) 2010-07-15
CN101770937A (zh) 2010-07-07
TWI460215B (zh) 2014-11-11

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